The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal ...The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling(–50 ℃–250 ℃) in SiC/DBC(direct bonding copper) die attachment structure for different time.During harsh thermal shock test,the strength of sintered joint deceased gradually with the increase of cycling number,and the value just was half of the value of as-sintered after 1 000 cycles.Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing,which were the reasons of the strength decease.In addition,it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1 000 cycles.This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature.展开更多
Silver paste is widely used in power electronics as a die-attach material owing to its low-temperature sinterability,high melting point,and excellent electrical and thermal conductivities in sintered joints.However,ow...Silver paste is widely used in power electronics as a die-attach material owing to its low-temperature sinterability,high melting point,and excellent electrical and thermal conductivities in sintered joints.However,owing to the mismatch in the coefficient of thermal expansion(CTE)between the joints and chip,the high Young's modulus of sintered silver hinders the mitigation of the high thermal stress generated during the operation of power modules,which increases the susceptibility of sintered joints to cracking,thereby leading to potential failure.This study developed a facile approach to synthesizing bayberry-like Ag microparticles(AgMPs)through the in situ assembly of silver nanorods,resulting in a uniform distribution of nanoscale structures and mesopores on the particle surface.These particles exhibited a high specific surface area of 2.5389 m^(2)·g^(-1),which enhanced theirsintering activity,enabling sintering to occur at 149.7℃.Furthermore,the porous structure of the AgMPs effectively reduced the density of joints formed by sintering AgMP paste,thereby lowering the Young's modulus of the joints.The small grain size and intricate internal substructure of the joints yielded high shear strength,which reached112.50 MPa at 250℃.The Young's modulus could be adjusted,and the pores provided by the AgMPs maintained the Young's modulus within a low range(15.11-29.61GPa),effectively mitigating thermal stress.These new bayberry-like porous AgMPs offer a promising option for die-attach materials in electronic packaging.展开更多
基金partly supported by the Japan Society for the Promotion of Science (JSPS) Grant-in-Aid for Scientific Research (Grant No. 19121587)supported by the Natural Science Foundation of Shaanxi Province (No.2021KW-25)。
文摘The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling(–50 ℃–250 ℃) in SiC/DBC(direct bonding copper) die attachment structure for different time.During harsh thermal shock test,the strength of sintered joint deceased gradually with the increase of cycling number,and the value just was half of the value of as-sintered after 1 000 cycles.Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing,which were the reasons of the strength decease.In addition,it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1 000 cycles.This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature.
基金financially supported by the National Natural Science Foundation of China(Nos.52075125 and 52105331)Guangdong Basic and Applied Basic Research Foundation(No.2023A1515010591)Shenzhen Science and Technology Innovation Committee(Nos.JCYJ20210324124203009,JSGG20201102154600003,GXWD20231130103814001,GXWD20220721182229001)
文摘Silver paste is widely used in power electronics as a die-attach material owing to its low-temperature sinterability,high melting point,and excellent electrical and thermal conductivities in sintered joints.However,owing to the mismatch in the coefficient of thermal expansion(CTE)between the joints and chip,the high Young's modulus of sintered silver hinders the mitigation of the high thermal stress generated during the operation of power modules,which increases the susceptibility of sintered joints to cracking,thereby leading to potential failure.This study developed a facile approach to synthesizing bayberry-like Ag microparticles(AgMPs)through the in situ assembly of silver nanorods,resulting in a uniform distribution of nanoscale structures and mesopores on the particle surface.These particles exhibited a high specific surface area of 2.5389 m^(2)·g^(-1),which enhanced theirsintering activity,enabling sintering to occur at 149.7℃.Furthermore,the porous structure of the AgMPs effectively reduced the density of joints formed by sintering AgMP paste,thereby lowering the Young's modulus of the joints.The small grain size and intricate internal substructure of the joints yielded high shear strength,which reached112.50 MPa at 250℃.The Young's modulus could be adjusted,and the pores provided by the AgMPs maintained the Young's modulus within a low range(15.11-29.61GPa),effectively mitigating thermal stress.These new bayberry-like porous AgMPs offer a promising option for die-attach materials in electronic packaging.
