Copper metal is widely electroplated for microelectronic interconnections such as redistribution layers(RDL),pillar bumps,through silicon vias,etc.With advances of multilayered RDL,via-on-via structures have been deve...Copper metal is widely electroplated for microelectronic interconnections such as redistribution layers(RDL),pillar bumps,through silicon vias,etc.With advances of multilayered RDL,via-on-via structures have been developed for ultrahigh-density any-layer interconnection,which expects superconformal filling of interlayer low aspect-ratio vias jointly with coplanar lines and pads.However,it poses a great challenge to electrodeposition,because current via fill mechanisms are stemming from middle to high aspect-ratio(>0.8)vias and lacking applicability in low aspect-ratio(<0.3)RDL-vias,where via geometry related electric-flow fields coupling must be reconsidered.In the present work,a four-additive strategy has been developed for RDL-vias fill and thoroughly investigated from additive electrochemistry,in situ Raman spectroelectrochemistry,and quantum chemistry perspectives.A novel adsorbate configuration controlled(ACC)electrodeposition mechanism is established that at weak-convection bilateral edges and lower corners,the adsorbate displays a weakly-adsorbing configuration to assist accelerator-governed deposition,whereas at strong-convection center,the adsorbate exhibits a mildlyadsorbing configuration to promote leveler-determined inhibition.Deposit profiles can be tailored from dished,flat to domed,depending on predominance of leveler over accelerator.This study should lay theoretical and practical foundations in design and application of copper electroplating additives of multiple adsorbate configurations to cope with complicated interconnect scenarios.展开更多
An Al2O3 dispersion strengthened(ADS)alloy with an ultra-high softening temperature of∼1200 K was fabricated by the in-situ internal oxidation and reduction methods.The evolution of the nanometer Al2O3 particles,grai...An Al2O3 dispersion strengthened(ADS)alloy with an ultra-high softening temperature of∼1200 K was fabricated by the in-situ internal oxidation and reduction methods.The evolution of the nanometer Al2O3 particles,grain size,and consequently the softening behavior of this ADS alloy,were investigated by conducting the annealing treatments in the range from 673 K to 1273 K for 60 min.These refined nanometer Al2O3 particles were found to be highly stable at elevated temperatures,leading to the high dislocation density and grain boundary stability of the matrix.The average grain size was found to increase extremely slowly from∼0.60μm to∼0.74μm with increasing annealing temperatures from 773 K to 1273 K.A criterion for grain boundaries migration and softening was established based on the competition between grain growth and pinning effect of Al2O3 particles.The strong pinning effect of Al2O3 particles was found when the grain size was between the lower limit(about 0.4-0.5μm)and upper limit(2.18μm).The occurrence of softening behavior was attributed to the rapid increase of the proportion of grains larger than the upper limit.A modified Hall-Petch relationship was established by introducing the integration of the grain size distribution,which can describe this correlation between softening behavior and the pinning effect of Al2O3 particles.The current study not only sheds light on the further understanding of the softening mechanism of ADS copper alloy but also provides a useful route for designing copper alloy with high softening resistance.展开更多
We examine thermodynamic phase transition(PT)of the charged Gauss-Bonnet Ad S black hole(BH)by utilizing the shadow radius.In this system,we rescale the corresponding Gauss-Bonnet coefficientαby a factor of 1/(D-4),a...We examine thermodynamic phase transition(PT)of the charged Gauss-Bonnet Ad S black hole(BH)by utilizing the shadow radius.In this system,we rescale the corresponding Gauss-Bonnet coefficientαby a factor of 1/(D-4),and ensure thatαis positive to avoid any singularity problems.The equation derived for the shadow radius indicates that it increases as the event horizon radius increases,making it an independent variable for determining BH temperature.By investigating the PT curve in relation to shadows,we can observe that the shadow radius can be used as an alternative to the event horizon radius in explaining the phenomenon of BH PT.Furthermore,the results indicate that an increase in the parameterαcorresponds to a decrease in the temperature of the BH.By utilizing the relationship between the temperature and the shadow radius,it is possible to obtain the thermal profile of the Gauss-Bonnet AdS BH.It is evident that there is an N-type variation in temperature for pressures P<P_(c).Additionally,as the parameterαincreases,the region covered by shadow expands while the temperature decreases.The utilization of BH shadows as a probe holds immense significance in gaining a deeper understanding of BH thermodynamic behavior.展开更多
基金supported by Key-Area Research and Development Program of Guangdong Province(No.2023B0101040002)National Natural Science Foundation of China(Nos.62304143,52303092 and 62274172)Guangdong Basic and Applied Basic Research Fund(No.2022B1515120037).
文摘Copper metal is widely electroplated for microelectronic interconnections such as redistribution layers(RDL),pillar bumps,through silicon vias,etc.With advances of multilayered RDL,via-on-via structures have been developed for ultrahigh-density any-layer interconnection,which expects superconformal filling of interlayer low aspect-ratio vias jointly with coplanar lines and pads.However,it poses a great challenge to electrodeposition,because current via fill mechanisms are stemming from middle to high aspect-ratio(>0.8)vias and lacking applicability in low aspect-ratio(<0.3)RDL-vias,where via geometry related electric-flow fields coupling must be reconsidered.In the present work,a four-additive strategy has been developed for RDL-vias fill and thoroughly investigated from additive electrochemistry,in situ Raman spectroelectrochemistry,and quantum chemistry perspectives.A novel adsorbate configuration controlled(ACC)electrodeposition mechanism is established that at weak-convection bilateral edges and lower corners,the adsorbate displays a weakly-adsorbing configuration to assist accelerator-governed deposition,whereas at strong-convection center,the adsorbate exhibits a mildlyadsorbing configuration to promote leveler-determined inhibition.Deposit profiles can be tailored from dished,flat to domed,depending on predominance of leveler over accelerator.This study should lay theoretical and practical foundations in design and application of copper electroplating additives of multiple adsorbate configurations to cope with complicated interconnect scenarios.
基金financially supported by the National Key Research and Development Program of China(No.2020YFB0311101)the National Natural Science Foundation of China(Nos.92066205 and 92266301)+1 种基金the Natural Science Foundation for Distinguished Young Scholars of China(No.51925401)the Youth Foundation of National Natural Science Foundation China(No.52001020).
文摘An Al2O3 dispersion strengthened(ADS)alloy with an ultra-high softening temperature of∼1200 K was fabricated by the in-situ internal oxidation and reduction methods.The evolution of the nanometer Al2O3 particles,grain size,and consequently the softening behavior of this ADS alloy,were investigated by conducting the annealing treatments in the range from 673 K to 1273 K for 60 min.These refined nanometer Al2O3 particles were found to be highly stable at elevated temperatures,leading to the high dislocation density and grain boundary stability of the matrix.The average grain size was found to increase extremely slowly from∼0.60μm to∼0.74μm with increasing annealing temperatures from 773 K to 1273 K.A criterion for grain boundaries migration and softening was established based on the competition between grain growth and pinning effect of Al2O3 particles.The strong pinning effect of Al2O3 particles was found when the grain size was between the lower limit(about 0.4-0.5μm)and upper limit(2.18μm).The occurrence of softening behavior was attributed to the rapid increase of the proportion of grains larger than the upper limit.A modified Hall-Petch relationship was established by introducing the integration of the grain size distribution,which can describe this correlation between softening behavior and the pinning effect of Al2O3 particles.The current study not only sheds light on the further understanding of the softening mechanism of ADS copper alloy but also provides a useful route for designing copper alloy with high softening resistance.
基金Project supported by the National Natural Science Foundation of China (Grant No.11903025)the starting fund of China West Normal University (Grant No.18Q062)+2 种基金the Sichuan Youth Science and Technology Innovation Research Team (Grant No.21CXTD0038)the Chongqing Science and Technology Bureau (Grant No.cstc2022ycjh-bgzxm0161)the Natural Science Foundation of Sichuan Province (Grant No.2022NSFSC1833)。
文摘We examine thermodynamic phase transition(PT)of the charged Gauss-Bonnet Ad S black hole(BH)by utilizing the shadow radius.In this system,we rescale the corresponding Gauss-Bonnet coefficientαby a factor of 1/(D-4),and ensure thatαis positive to avoid any singularity problems.The equation derived for the shadow radius indicates that it increases as the event horizon radius increases,making it an independent variable for determining BH temperature.By investigating the PT curve in relation to shadows,we can observe that the shadow radius can be used as an alternative to the event horizon radius in explaining the phenomenon of BH PT.Furthermore,the results indicate that an increase in the parameterαcorresponds to a decrease in the temperature of the BH.By utilizing the relationship between the temperature and the shadow radius,it is possible to obtain the thermal profile of the Gauss-Bonnet AdS BH.It is evident that there is an N-type variation in temperature for pressures P<P_(c).Additionally,as the parameterαincreases,the region covered by shadow expands while the temperature decreases.The utilization of BH shadows as a probe holds immense significance in gaining a deeper understanding of BH thermodynamic behavior.
