Filler-reinforced polymer composites demonstrate pervasive applications due to their strengthened performances,multi-degree tunability,and ease of manufacturing.In thermal management field,polymer composites reinforce...Filler-reinforced polymer composites demonstrate pervasive applications due to their strengthened performances,multi-degree tunability,and ease of manufacturing.In thermal management field,polymer composites reinforced with thermally conductive fillers are widely adopted as thermal interface materials(TIMs).However,the three dimensional(3D)-stacked heterogenous integration of electronic devices has posed the problem that high-density heat sources are spatially distributed in the package.This situation puts forward new requirements for TIMs,where efficient heat dissipation channels must be established according to the specific distribution of discrete heat sources.To address this challenge,a 3D printing-assisted streamline orientation(3D-PSO)method was proposed to fabricate composite thermal materials with 3D programmable microstructures and orientations of fillers,which combines the shape-design capability of 3D printing and oriented control ability of fluid.The mechanism of fluid-based filler orientation control along streamlines was revealed by mechanical analysis of fillers in matrix.Thanks to the designed heat dissipation channels,composites showed better thermal and mechanical properties in comparison to random composites.Specifically,the thermal conductivity of 3D mesh-shape polydimethylsiloxane/liquid metal(PDMS/LM)composite was5.8 times that of random PDMS/LM composite under filler loading of 34.8 vol%.The thermal conductivity enhancement efficiency of 3D mesh-shape PDMS/carbon fibers composite reached101.05%under filler loading of 5.2 vol%.In the heat dissipation application of 3D-stacked chips,the highest chip temperature with 3D-PSO composite was 42.14℃lower than that with random composites.This is mainly attributed to the locally aggregated and oriented fillers'microstructure in fluid channels,which contributes to thermal percolation phenomena.The3D-PSO method exhibits excellent programmable design capabilities to adopt versatile distributions of heat sources,paving a new way to solve the complicated heat dissipation issue in 3D-stacked chips integration application.展开更多
介绍了3D堆叠技术及其发展现状,探讨了W2W(Wafer to wafer)及D2W(Die to wafer)等3D堆叠方案的优缺点,并重点讨论了垂直互连的穿透硅通孔TSV(Through silicon via)互连工艺的关键技术,探讨了先通孔、中通孔及后通孔的工艺流程及特点,介...介绍了3D堆叠技术及其发展现状,探讨了W2W(Wafer to wafer)及D2W(Die to wafer)等3D堆叠方案的优缺点,并重点讨论了垂直互连的穿透硅通孔TSV(Through silicon via)互连工艺的关键技术,探讨了先通孔、中通孔及后通孔的工艺流程及特点,介绍了TSV的市场前景和发展路线图。3D堆叠技术及TSV技术已经成为微电子领域研究的热点,是微电子技术及MEMS技术未来发展的必然趋势,也是实现混合集成微系统的关键技术之一。展开更多
建立了三维硅通孔(three-dimension through silicon via,3D-TSV)互连结构有限元分析模型,对该模型进行了随机振动加载有限元分析.选取TSV高度、TSV直径、微凸点高度和微凸点直径四个结构参数作为关键因素,采用水平正交表L16(45)设计了1...建立了三维硅通孔(three-dimension through silicon via,3D-TSV)互连结构有限元分析模型,对该模型进行了随机振动加载有限元分析.选取TSV高度、TSV直径、微凸点高度和微凸点直径四个结构参数作为关键因素,采用水平正交表L16(45)设计了16种不同结构参数的3D-TSV互连结构,获取了这16种3D-TSV互连结构随机振动应力数据并进行了方差分析.结果表明,在置信度为99%的情况下,TSV高度对3D-TSV互连结构随机振动应力有显著影响,因素显著性的排序由大到小为TSV高度最大,其次为TSV直径,再次为微凸点直径,最后是微凸点高度;单因子变量分析表明,TSV互连结构应力应变随TSV高度的增加而增大.展开更多
基金supported by the National Natural Science Foundation of China(Grant No.52106089)the National Key R&D Project from Ministry of Science and Technology of China(Grant No.2022YFA1203100)。
文摘Filler-reinforced polymer composites demonstrate pervasive applications due to their strengthened performances,multi-degree tunability,and ease of manufacturing.In thermal management field,polymer composites reinforced with thermally conductive fillers are widely adopted as thermal interface materials(TIMs).However,the three dimensional(3D)-stacked heterogenous integration of electronic devices has posed the problem that high-density heat sources are spatially distributed in the package.This situation puts forward new requirements for TIMs,where efficient heat dissipation channels must be established according to the specific distribution of discrete heat sources.To address this challenge,a 3D printing-assisted streamline orientation(3D-PSO)method was proposed to fabricate composite thermal materials with 3D programmable microstructures and orientations of fillers,which combines the shape-design capability of 3D printing and oriented control ability of fluid.The mechanism of fluid-based filler orientation control along streamlines was revealed by mechanical analysis of fillers in matrix.Thanks to the designed heat dissipation channels,composites showed better thermal and mechanical properties in comparison to random composites.Specifically,the thermal conductivity of 3D mesh-shape polydimethylsiloxane/liquid metal(PDMS/LM)composite was5.8 times that of random PDMS/LM composite under filler loading of 34.8 vol%.The thermal conductivity enhancement efficiency of 3D mesh-shape PDMS/carbon fibers composite reached101.05%under filler loading of 5.2 vol%.In the heat dissipation application of 3D-stacked chips,the highest chip temperature with 3D-PSO composite was 42.14℃lower than that with random composites.This is mainly attributed to the locally aggregated and oriented fillers'microstructure in fluid channels,which contributes to thermal percolation phenomena.The3D-PSO method exhibits excellent programmable design capabilities to adopt versatile distributions of heat sources,paving a new way to solve the complicated heat dissipation issue in 3D-stacked chips integration application.
文摘介绍了3D堆叠技术及其发展现状,探讨了W2W(Wafer to wafer)及D2W(Die to wafer)等3D堆叠方案的优缺点,并重点讨论了垂直互连的穿透硅通孔TSV(Through silicon via)互连工艺的关键技术,探讨了先通孔、中通孔及后通孔的工艺流程及特点,介绍了TSV的市场前景和发展路线图。3D堆叠技术及TSV技术已经成为微电子领域研究的热点,是微电子技术及MEMS技术未来发展的必然趋势,也是实现混合集成微系统的关键技术之一。
文摘建立了三维硅通孔(three-dimension through silicon via,3D-TSV)互连结构有限元分析模型,对该模型进行了随机振动加载有限元分析.选取TSV高度、TSV直径、微凸点高度和微凸点直径四个结构参数作为关键因素,采用水平正交表L16(45)设计了16种不同结构参数的3D-TSV互连结构,获取了这16种3D-TSV互连结构随机振动应力数据并进行了方差分析.结果表明,在置信度为99%的情况下,TSV高度对3D-TSV互连结构随机振动应力有显著影响,因素显著性的排序由大到小为TSV高度最大,其次为TSV直径,再次为微凸点直径,最后是微凸点高度;单因子变量分析表明,TSV互连结构应力应变随TSV高度的增加而增大.
