The study of Frequency Selective Surface(FSS)by Direct ink writing(DIW)has attracted much attention due to the convenience and effectiveness of 3D printing technology.However,the limited printing precision of DIW has ...The study of Frequency Selective Surface(FSS)by Direct ink writing(DIW)has attracted much attention due to the convenience and effectiveness of 3D printing technology.However,the limited printing precision of DIW has heavily restricted its applications as the electromagnetic performance is highly sensitive to it,especially the precision at the microscale.Herein,the ultra-high printing precision of FSS was achieved through DIW by the uniformly dispersed graphene sheets to deeply modify the rheological behavior and the steric hindrance effect.Thus,the highly precision of the printed filament width as thin as67μm with a space of only 42μm were achieved,which is difficult for conventional DIW,and no structural distortion is found after 3D printing,no matter it was 2D printed on a flat surface or the sharply skewed hook face,or even 3D printed to architectural structures.According to the highly improved precision,the electromagnetic performance matching between the designed model and the printed physical FSS device was perfectly achieved,reducing the center frequency error less than 0.3 GHz,and the transmission coefficient error less than 0.046.Our work promises an effective and easy preparation of high-quality FSS from the aid of graphene.展开更多
Multilayer frequency selective surfaces(FSSs)have become core components of multi-band communication systems because they possess high selectivity,stability,and out-of-band suppression capabilities.However,interlayer ...Multilayer frequency selective surfaces(FSSs)have become core components of multi-band communication systems because they possess high selectivity,stability,and out-of-band suppression capabilities.However,interlayer reliability problems have negatively affected the manufacture of multilayer FSSs for many years,and these negative impacts are primarily reflected in restrictions in the interlayer bonding strength and the interlayer alignment accuracy.To address these problems,a macroscopic-microscopic cross-scale,multi-material integrated additive manufacturing process was designed during this study.This process,which utilizes electric field-driven(EFD)jet printing and in-situ curing,produced multilayer FSS structures with high-resolution patterning(with a line width of<20μm)and a low alignment error(equal to 0.73%of the periodic dimension).A highly stable micro-interdiffused polyimide(PI)material,which was used for interlayer bonding,was developed by performing trifluoromethyl and fluorenyl side-chain modifications.This material exhibited both extreme environmental adaptability(the PI-based electrodes fabricated using this material exhibited a resistance change rate of less than 5%at 360°C)and a strong interlayer interfacial bonding strength(>3.37 MPa).Using this process and material,a dual-band FSS with passband center frequencies at 14.5 and 60 GHz was designed and fabricated.In addition,the flexibility of the PI material enabled the resultant FSSs to conform to deployable curved surfaces;thus,this material offers a simplified 2D-to-3D fabrication solution for deployable radomes.The proposed binder-free integrated forming process combines environmental sustainability with costeffectiveness;therefore,it serves as a novel strategy for rapid manufacture and performance optimizations of high-frequency communication devices.展开更多
基金financially supported by the National Natural Science Foundation of China(No.51972079)the National Key Research and Development Program of China(Nos.2017YFB0310400 and 2017YFB0310402)。
文摘The study of Frequency Selective Surface(FSS)by Direct ink writing(DIW)has attracted much attention due to the convenience and effectiveness of 3D printing technology.However,the limited printing precision of DIW has heavily restricted its applications as the electromagnetic performance is highly sensitive to it,especially the precision at the microscale.Herein,the ultra-high printing precision of FSS was achieved through DIW by the uniformly dispersed graphene sheets to deeply modify the rheological behavior and the steric hindrance effect.Thus,the highly precision of the printed filament width as thin as67μm with a space of only 42μm were achieved,which is difficult for conventional DIW,and no structural distortion is found after 3D printing,no matter it was 2D printed on a flat surface or the sharply skewed hook face,or even 3D printed to architectural structures.According to the highly improved precision,the electromagnetic performance matching between the designed model and the printed physical FSS device was perfectly achieved,reducing the center frequency error less than 0.3 GHz,and the transmission coefficient error less than 0.046.Our work promises an effective and easy preparation of high-quality FSS from the aid of graphene.
基金supported by the National Natural Science Foundation of China(Grant Nos.52375348,52175331)the National Natural Science Foundation of Shandong Province(Grant No.ZR2022ME014)the Taishan Scholars Program of Shandong Province(Grant No.tsqn202408219)。
文摘Multilayer frequency selective surfaces(FSSs)have become core components of multi-band communication systems because they possess high selectivity,stability,and out-of-band suppression capabilities.However,interlayer reliability problems have negatively affected the manufacture of multilayer FSSs for many years,and these negative impacts are primarily reflected in restrictions in the interlayer bonding strength and the interlayer alignment accuracy.To address these problems,a macroscopic-microscopic cross-scale,multi-material integrated additive manufacturing process was designed during this study.This process,which utilizes electric field-driven(EFD)jet printing and in-situ curing,produced multilayer FSS structures with high-resolution patterning(with a line width of<20μm)and a low alignment error(equal to 0.73%of the periodic dimension).A highly stable micro-interdiffused polyimide(PI)material,which was used for interlayer bonding,was developed by performing trifluoromethyl and fluorenyl side-chain modifications.This material exhibited both extreme environmental adaptability(the PI-based electrodes fabricated using this material exhibited a resistance change rate of less than 5%at 360°C)and a strong interlayer interfacial bonding strength(>3.37 MPa).Using this process and material,a dual-band FSS with passband center frequencies at 14.5 and 60 GHz was designed and fabricated.In addition,the flexibility of the PI material enabled the resultant FSSs to conform to deployable curved surfaces;thus,this material offers a simplified 2D-to-3D fabrication solution for deployable radomes.The proposed binder-free integrated forming process combines environmental sustainability with costeffectiveness;therefore,it serves as a novel strategy for rapid manufacture and performance optimizations of high-frequency communication devices.
