The Kunene Complex(KC)represents a very large Mesoproterozoic igneous body,mainly composed of anorthosites and gabbroic rocks that extends from SW Angola to NW Namibia(outcropping 18,000 km^(2),NE-SW trend,and ca.350 ...The Kunene Complex(KC)represents a very large Mesoproterozoic igneous body,mainly composed of anorthosites and gabbroic rocks that extends from SW Angola to NW Namibia(outcropping 18,000 km^(2),NE-SW trend,and ca.350 km long and up to 50 km wide).Little is known about its structure at depth.Here,we use recently acquired aerogeophysical data to accurately determine its hidden extent and to unravel its morphology at depth.These data have been interpreted and modelled to investigate the unexposed KC boundaries,reconstructing the upper crustal structure(between 0 and 15 km depth)overlain by the thin sedimentary cover of the Kalahari Basin.The modelling reveals that the KC was emplaced in the upper crust and extends in depth up to ca.5 km,showing a lobular geometry and following a large NE-SW to NNE-SSW linear trend,presumably inherited from older Paleoproterozoic structures.The lateral continuation of the KC to the east(between 50 and 125 km)beneath the Kalahari Cenozoic sediments suggests an overall size three times the outcropping dimension(about 53,500 km^(2)).This affirmation clearly reinforces the economic potential of this massif,related to the prospecting of raw materials and certain types of economic mineralization(Fe-Ti oxides,metallic sulphides or platinum group minerals).Up to 11 lobes have been isolated with dimensions ranging from 135.5 to 37.3 km in length and 81.9 to 20.7 km in width according to remanent bodies revealed by TMI mapping.A total volume of 65,184 km3 was calculated only for the magnetically remanent bodies of the KC.A long-lasting complex contractional regime,where large strike-slip fault systems were involved,occurred in three kinematic pulses potentially related to a change of velocity or convergence angle acting on previous Paleoproterozoic inherited sutures.The coalescent magmatic pulses can be recognized by means of magnetic anomalies,age of the bodies as well as the lineations inferred in this work:(i)Emplacement of the eastern mafic bodies and granites in a stage of significant lateral extension in a transtensional context between 1500 Ma and 1420 Ma;(ii)Migration of the mantle derived magmas westwards with deformation in a complex contractional setting with shearing structures involving western KC bodies and basement from 1415 Ma to 1340 Ma;(iii)NNW-SSE extensional structures are relocated westwards,involving mantle magmas,negative flower structures and depression that led to the formation of late Mesoproterozoic basins from 1325 Ma to 1170 Ma.Additionally,we detect several first and second order structures to place the structuring of the KC in a craton-scale context in relation to the crustal structures detected in NW Namibia.展开更多
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabricati...Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.展开更多
Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigat...Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigations of the impact of urban three-dimensional(3D)morphology on PM2.5 concentration have important scientific significance.In this paper,39 PM2.5 monitoring sites of Beijing in China were selected with PM2.5 automatic monitoring data that were collected in 2013.This data set was used to analyze the impacts of the meteorological condition and public transportation on PM2.5 concentrations.Based on the elimination of the meteorological conditions and public transportation factors,the relationships between urban 3D morphology and PM2.5 concentrations are highlighted.Ten urban 3D morphology indices were established to explore the spatial-temporal correlations between the indices and PM2.5 concentrations and analyze the impact of urban 3D morphology on the PM2.5 concentrations.Results demonstrated that road length density(RLD),road area density(RAD),construction area density(CAD),construction height density(CHD),construction volume density(CVD),construction otherness(CO),and vegetation area density(VAD)have positive impacts on the PM2.5 concentrations,whereas water area density(WAD),water fragmentation(WF),and vegetation fragmentation(VF)(except for the 500 m buffer)have negative impacts on the PM2.5 concentrations.Moreover,the correlations between the morphology indices and PM2.5 concentrations varied with the buffer scale.The findings could lay a foundation for the high-precision spatial-temporal modelling of PM2.5 concentrations and the scientific planning of urban 3D spaces by authorities responsible for controlling PM2.5 concentrations.展开更多
The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-...The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.展开更多
In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is bu...In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is built with the general consideration of both the test time for automatic test equipment(ATE)and manufacturing failure factors.An algorithm for testing cost and testing order optimization is proposed,and the minimum testing cost and optimized stacking order can be carried out by taking testing bandwidth and testing power as constraints.To prove the influence of the optimal stacking order on testing costs,two baselines stacked in sequential either in pyramid type or in inverted pyramid type are compared.Based on the benchmarks from ITC 02,experimental results show that for a 5-layer 3D IC,under different constraints,the optimal stacking order can reduce the test costs on average by 13%and 62%,respectively,compared to the pyramid type and inverted pyramid type.Furthermore,with the increase of the stack size,the test costs of the optimized stack order can be decreased.展开更多
Ultra-high molecular weight polyethylene（UHMWPE） fiber/epoxy composites were fabricated by a vacuum assisted resin infused（VARI） processing technology. The curing condition of composites was at a cure temperature ...Ultra-high molecular weight polyethylene（UHMWPE） fiber/epoxy composites were fabricated by a vacuum assisted resin infused（VARI） processing technology. The curing condition of composites was at a cure temperature of 80 ℃ for 3h in a drying oven. The characteristics of 2.5D（shallow bend-joint and deep straight-joint） structure and 3D orthogonal structure were compared. The failure behavior, flexural strength, and microstructures of both composites were investigated. It was found that the flexural property was closely related to undulation angle θ. The flexural strength of 3D orthogonal structure composite was superior to the other two structures composites with the same weave parameters and resin.展开更多
As a two-dimensional carbon based semiconductor,C_(3)N acts as a promising material in many application areas.However,the basic physical properties such as Raman spectrum properties of C_(3)N is still not clear.In thi...As a two-dimensional carbon based semiconductor,C_(3)N acts as a promising material in many application areas.However,the basic physical properties such as Raman spectrum properties of C_(3)N is still not clear.In this paper,we clarify the Raman spectrum properties of multilayer C_(3)N.Moreover,the stacking driven Raman spectra change of multilayer C_(3)N is also discussed.展开更多
基金supported by the subsidiary programme“Ayudas Extraordinarias Menciones Excelencia Severo Ochoa”of the CN IGME-CSIC(project AECEX2021,grant 15903)the University of Minnesota and National Science Foundation(award NSF-EAR 2153786)+1 种基金the Portuguese Foundation for Science and Technology(FCT)support,Geosciences Center project UIDB/00073/2020(doi:10.54499/UIDB/00073/2020)University of Coimbra and and GeoBioTec project UIDB/04035/2020(doi:10.54499/UIDB/04035/2020),Nova School of Science and Technology.
文摘The Kunene Complex(KC)represents a very large Mesoproterozoic igneous body,mainly composed of anorthosites and gabbroic rocks that extends from SW Angola to NW Namibia(outcropping 18,000 km^(2),NE-SW trend,and ca.350 km long and up to 50 km wide).Little is known about its structure at depth.Here,we use recently acquired aerogeophysical data to accurately determine its hidden extent and to unravel its morphology at depth.These data have been interpreted and modelled to investigate the unexposed KC boundaries,reconstructing the upper crustal structure(between 0 and 15 km depth)overlain by the thin sedimentary cover of the Kalahari Basin.The modelling reveals that the KC was emplaced in the upper crust and extends in depth up to ca.5 km,showing a lobular geometry and following a large NE-SW to NNE-SSW linear trend,presumably inherited from older Paleoproterozoic structures.The lateral continuation of the KC to the east(between 50 and 125 km)beneath the Kalahari Cenozoic sediments suggests an overall size three times the outcropping dimension(about 53,500 km^(2)).This affirmation clearly reinforces the economic potential of this massif,related to the prospecting of raw materials and certain types of economic mineralization(Fe-Ti oxides,metallic sulphides or platinum group minerals).Up to 11 lobes have been isolated with dimensions ranging from 135.5 to 37.3 km in length and 81.9 to 20.7 km in width according to remanent bodies revealed by TMI mapping.A total volume of 65,184 km3 was calculated only for the magnetically remanent bodies of the KC.A long-lasting complex contractional regime,where large strike-slip fault systems were involved,occurred in three kinematic pulses potentially related to a change of velocity or convergence angle acting on previous Paleoproterozoic inherited sutures.The coalescent magmatic pulses can be recognized by means of magnetic anomalies,age of the bodies as well as the lineations inferred in this work:(i)Emplacement of the eastern mafic bodies and granites in a stage of significant lateral extension in a transtensional context between 1500 Ma and 1420 Ma;(ii)Migration of the mantle derived magmas westwards with deformation in a complex contractional setting with shearing structures involving western KC bodies and basement from 1415 Ma to 1340 Ma;(iii)NNW-SSE extensional structures are relocated westwards,involving mantle magmas,negative flower structures and depression that led to the formation of late Mesoproterozoic basins from 1325 Ma to 1170 Ma.Additionally,we detect several first and second order structures to place the structuring of the KC in a craton-scale context in relation to the crustal structures detected in NW Namibia.
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
基金supported by Research Fund for the Doctoral Program of Higher Education of China(Grant No.20060614021)Sichuan Provincial Fundamental Research of China(Grant No.2008JY0057),Fundamental Research Funds for the Central Universities of China(Grant No.ZYGX2009J091)
文摘Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.
基金Under the auspices of National Key Research and Development Program of China(No.2016YFB0502504)Beijing Excellent Youth Talent Program(No.2015400018760G294)National Natural Science Foundation of China(No.41201443,41001267).
文摘Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigations of the impact of urban three-dimensional(3D)morphology on PM2.5 concentration have important scientific significance.In this paper,39 PM2.5 monitoring sites of Beijing in China were selected with PM2.5 automatic monitoring data that were collected in 2013.This data set was used to analyze the impacts of the meteorological condition and public transportation on PM2.5 concentrations.Based on the elimination of the meteorological conditions and public transportation factors,the relationships between urban 3D morphology and PM2.5 concentrations are highlighted.Ten urban 3D morphology indices were established to explore the spatial-temporal correlations between the indices and PM2.5 concentrations and analyze the impact of urban 3D morphology on the PM2.5 concentrations.Results demonstrated that road length density(RLD),road area density(RAD),construction area density(CAD),construction height density(CHD),construction volume density(CVD),construction otherness(CO),and vegetation area density(VAD)have positive impacts on the PM2.5 concentrations,whereas water area density(WAD),water fragmentation(WF),and vegetation fragmentation(VF)(except for the 500 m buffer)have negative impacts on the PM2.5 concentrations.Moreover,the correlations between the morphology indices and PM2.5 concentrations varied with the buffer scale.The findings could lay a foundation for the high-precision spatial-temporal modelling of PM2.5 concentrations and the scientific planning of urban 3D spaces by authorities responsible for controlling PM2.5 concentrations.
文摘The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.
基金The National Natural Science Foundation of China(No.61674048,61574052,61474036,61371025)the Project of Anhui Institute of Economics and Management(No.YJKT1417T01)
文摘In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is built with the general consideration of both the test time for automatic test equipment(ATE)and manufacturing failure factors.An algorithm for testing cost and testing order optimization is proposed,and the minimum testing cost and optimized stacking order can be carried out by taking testing bandwidth and testing power as constraints.To prove the influence of the optimal stacking order on testing costs,two baselines stacked in sequential either in pyramid type or in inverted pyramid type are compared.Based on the benchmarks from ITC 02,experimental results show that for a 5-layer 3D IC,under different constraints,the optimal stacking order can reduce the test costs on average by 13%and 62%,respectively,compared to the pyramid type and inverted pyramid type.Furthermore,with the increase of the stack size,the test costs of the optimized stack order can be decreased.
基金Funded by the National Natural Science Foundation of China(No.51001117)
文摘Ultra-high molecular weight polyethylene（UHMWPE） fiber/epoxy composites were fabricated by a vacuum assisted resin infused（VARI） processing technology. The curing condition of composites was at a cure temperature of 80 ℃ for 3h in a drying oven. The characteristics of 2.5D（shallow bend-joint and deep straight-joint） structure and 3D orthogonal structure were compared. The failure behavior, flexural strength, and microstructures of both composites were investigated. It was found that the flexural property was closely related to undulation angle θ. The flexural strength of 3D orthogonal structure composite was superior to the other two structures composites with the same weave parameters and resin.
基金supported by The National Natural Science Foundation of China (Nos. 11804353 and 11774368)Shanghai Science and Technology Committee (No. 18511110600)
文摘As a two-dimensional carbon based semiconductor,C_(3)N acts as a promising material in many application areas.However,the basic physical properties such as Raman spectrum properties of C_(3)N is still not clear.In this paper,we clarify the Raman spectrum properties of multilayer C_(3)N.Moreover,the stacking driven Raman spectra change of multilayer C_(3)N is also discussed.
