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Flexible Monolithic 3D-Integrated Self-Powered Tactile Sensing Array Based on Holey MXene Paste
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作者 Mengjie Wang Chen Chen +9 位作者 Yuhang Zhang Yanan Ma Li Xu Dan‑Dan Wu Bowen Gao Aoyun Song Li Wen Yongfa Cheng Siliang Wang Yang Yue 《Nano-Micro Letters》 2026年第2期772-785,共14页
Flexible electronics face critical challenges in achieving monolithic three-dimensional(3D)integration,including material compatibility,structural stability,and scalable fabrication methods.Inspired by the tactile sen... Flexible electronics face critical challenges in achieving monolithic three-dimensional(3D)integration,including material compatibility,structural stability,and scalable fabrication methods.Inspired by the tactile sensing mechanism of the human skin,we have developed a flexible monolithic 3D-integrated tactile sensing system based on a holey MXene paste,where each vertical one-body unit simultaneously functions as a microsupercapacitor and pressure sensor.The in-plane mesopores of MXene significantly improve ion accessibility,mitigate the self-stacking of nanosheets,and allow the holey MXene to multifunctionally act as a sensing material,an active electrode,and a conductive interconnect,thus drastically reducing the interface mismatch and enhancing the mechanical robustness.Furthermore,we fabricate a large-scale device using a blade-coating and stamping method,which demonstrates excellent mechanical flexibility,low-power consumption,rapid response,and stable long-term operation.As a proof-of-concept application,we integrate our sensing array into a smart access control system,leveraging deep learning to accurately identify users based on their unique pressing behaviors.This study provides a promising approach for designing highly integrated,intelligent,and flexible electronic systems for advanced human-computer interactions and personalized electronics. 展开更多
关键词 Holey MXene Microsupercapacitor Tactile sensor Monolithic 3d integration deep learning algorithm
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多芯粒2.5D/3D集成技术研究与应用现状
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作者 王根旺 李璐 +1 位作者 潘鹏辉 李宝霞 《电子科技大学学报》 北大核心 2025年第6期819-831,共13页
面向高性能计算机、人工智能、无人系统对电子芯片高性能、高集成度的需求,以2.5D、3D集成技术为代表的先进封装集成技术,不仅打破了当前集成芯片良率降低、成本骤升的困境,也是实现多种类型、多种材质、多种功能芯粒集成的重要手段。... 面向高性能计算机、人工智能、无人系统对电子芯片高性能、高集成度的需求,以2.5D、3D集成技术为代表的先进封装集成技术,不仅打破了当前集成芯片良率降低、成本骤升的困境,也是实现多种类型、多种材质、多种功能芯粒集成的重要手段。该文对多芯粒2.5D、3D集成方案研究现状与技术水平进行总结分析,包括大尺寸中介层2.5D技术、低互连节距3D堆叠互连技术、玻璃基集成技术等。并总结了不同集成方案技术的主要发展方向与亟待攻克的技术难点。在此基础上,进一步归纳了多芯粒2.5D、3D集成技术在数字、光电、微电子机械等集成芯片与器件领域的应用,分析了多芯粒2.5D、3D封装集成技术未来发展与应用方向,为微小型多功能一体化集成芯片提供发展思路。 展开更多
关键词 先进封装 2.5d集成 3d集成 中介层
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Detailed in-depth mapping of the world largest anorthositic complex:Magnetic anomalies,2.5-3D modelling and emplacement constraints of the Kunene Complex(KC),SW Angola
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作者 T.Mochales E.Merino-Martínez +11 位作者 C.Rey-Moral A.Machadinho J.Carvalho P.Represas J.L.García-Lobón M.C.Feria R.Martín-Banda M.T.López-Bahut D.Alves E.Ramalho J.Manuel D.Cordeiro 《Geoscience Frontiers》 2025年第3期261-285,共25页
The Kunene Complex(KC)represents a very large Mesoproterozoic igneous body,mainly composed of anorthosites and gabbroic rocks that extends from SW Angola to NW Namibia(outcropping 18,000 km^(2),NE-SW trend,and ca.350 ... The Kunene Complex(KC)represents a very large Mesoproterozoic igneous body,mainly composed of anorthosites and gabbroic rocks that extends from SW Angola to NW Namibia(outcropping 18,000 km^(2),NE-SW trend,and ca.350 km long and up to 50 km wide).Little is known about its structure at depth.Here,we use recently acquired aerogeophysical data to accurately determine its hidden extent and to unravel its morphology at depth.These data have been interpreted and modelled to investigate the unexposed KC boundaries,reconstructing the upper crustal structure(between 0 and 15 km depth)overlain by the thin sedimentary cover of the Kalahari Basin.The modelling reveals that the KC was emplaced in the upper crust and extends in depth up to ca.5 km,showing a lobular geometry and following a large NE-SW to NNE-SSW linear trend,presumably inherited from older Paleoproterozoic structures.The lateral continuation of the KC to the east(between 50 and 125 km)beneath the Kalahari Cenozoic sediments suggests an overall size three times the outcropping dimension(about 53,500 km^(2)).This affirmation clearly reinforces the economic potential of this massif,related to the prospecting of raw materials and certain types of economic mineralization(Fe-Ti oxides,metallic sulphides or platinum group minerals).Up to 11 lobes have been isolated with dimensions ranging from 135.5 to 37.3 km in length and 81.9 to 20.7 km in width according to remanent bodies revealed by TMI mapping.A total volume of 65,184 km3 was calculated only for the magnetically remanent bodies of the KC.A long-lasting complex contractional regime,where large strike-slip fault systems were involved,occurred in three kinematic pulses potentially related to a change of velocity or convergence angle acting on previous Paleoproterozoic inherited sutures.The coalescent magmatic pulses can be recognized by means of magnetic anomalies,age of the bodies as well as the lineations inferred in this work:(i)Emplacement of the eastern mafic bodies and granites in a stage of significant lateral extension in a transtensional context between 1500 Ma and 1420 Ma;(ii)Migration of the mantle derived magmas westwards with deformation in a complex contractional setting with shearing structures involving western KC bodies and basement from 1415 Ma to 1340 Ma;(iii)NNW-SSE extensional structures are relocated westwards,involving mantle magmas,negative flower structures and depression that led to the formation of late Mesoproterozoic basins from 1325 Ma to 1170 Ma.Additionally,we detect several first and second order structures to place the structuring of the KC in a craton-scale context in relation to the crustal structures detected in NW Namibia. 展开更多
关键词 ANGOLA Kunene Complex(KC) Magnetic prospecting 2.5 modelling 3d inversion
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Impact and Residual Flexural Properties of 3D Integrated Woven Spacer Composites
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作者 Mahim Masfikun Hannan Deng’an Cai Xinwei Wang 《Journal of Polymer Materials》 2025年第3期873-891,共19页
This study investigates the low-velocity impact and post-impact flexural properties of 3D integrated woven spacer composites,focusing on their orthotropic behavior when tested along two principal directions,i.e.,warp(... This study investigates the low-velocity impact and post-impact flexural properties of 3D integrated woven spacer composites,focusing on their orthotropic behavior when tested along two principal directions,i.e.,warp(X-type)and weft(Y-type)directions.The same composite material was tested in these orientations to evaluate the differences in impact resistance and residual bending strength.Specimens were fabricated via vacuum-assisted molding and tested at 2,3,5,and 7 J impact energies using an Instron Ceast 9350 drop-weight impact testing machine,in accordance with ASTM D7136.Post-impact flexural tests were performed using a four-point bending method in accordance with ASTM D7264.The absorbed energy increased from 1.97 to 6.98 J,and the panel damage area ranged from 121 to 361 mm^(2) as impact energy roses.Specimens tested in the weft direction(Y-type)showed greater residual strength(up to 15.83 N)and displacement(up to 0.538 mm)than those tested in the warp direction(X-type).Ultrasonic C-scan imaging revealed localized matrix cracking and fiber failure damage patterns.Results emphasize the directional differences in impact resistance and residual bending properties,highlighting the importance of material orientation in structural applications.This study provides a foundation for utilizing 3D woven spacer composites in lightweight,damage-tolerant structural components. 展开更多
关键词 3d integrated woven spacer composites low-velocity impact post-impact flexural properties impact resistance
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1,25(OH)_2D_3对PM2.5在体染毒慢性阻塞性肺疾病大鼠气道炎症的作用 被引量:3
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作者 彭建萍 陈乐蓉 +3 位作者 胡欣春 程小鹏 廖连芳 吴亮亮 《中国老年学杂志》 CAS 北大核心 2017年第19期4707-4709,共3页
目的探讨1,25二羟维生素D3[1,25(OH)_2D_3]对PM2.5在体染毒慢性阻塞性肺疾病(COPD)大鼠气道炎症的作用。方法 72只雄性Wistar大鼠随机分成正常组、COPD组、1,25(OH)_2D_3+COPD组(合并组),每组24只,对三组大鼠气管滴注PM2.5染毒,每天染毒... 目的探讨1,25二羟维生素D3[1,25(OH)_2D_3]对PM2.5在体染毒慢性阻塞性肺疾病(COPD)大鼠气道炎症的作用。方法 72只雄性Wistar大鼠随机分成正常组、COPD组、1,25(OH)_2D_3+COPD组(合并组),每组24只,对三组大鼠气管滴注PM2.5染毒,每天染毒1次,连续3 d,在最后一次染毒24 h后处死动物,分析肺泡灌洗液中白细胞介素(IL)-8、IL-17、肿瘤坏死因子(TNF)-α的含量。结果 PM2.5对正常组、COPD组、合并组大鼠均产生急性毒性,且存在剂量反应关系,COPD组肺泡灌洗液中IL-8、TNF-α浓度明显高于正常组(P<0.05),经1,25(OH)_2D_3干预COPD组IL-8、TNF-α浓度低于COPD组,但仍高于正常组(P<0.05)。结论 COPD大鼠比正常大鼠对PM2.5更加易感,PM2.5可加重COPD的气道炎症。1,25(OH)_2D_3可减轻COPD气道炎症及损伤,在PM2.5染毒情况下补充1,25(OH)_2D_3对COPD的气道炎症仍具有改善作用。 展开更多
关键词 大气细颗粒物(PM2.5) 慢性阻塞性肺疾病 1 25二羟维生素d3 炎症
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射频微系统2.5D/3D封装技术发展与应用 被引量:35
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作者 崔凯 王从香 胡永芳 《电子机械工程》 2016年第6期1-6,共6页
2.5D/3D封装技术是满足未来射频系统更高集成度、更高性能、更高工作频率需求的主要手段。文中介绍了目前微系统2.5D/3D封装技术的发展趋势及硅通孔(TSV)、微凸点/铜柱、圆片级封装等先进的高密度封装技术,并关注了2.5D/3D封装技术在射... 2.5D/3D封装技术是满足未来射频系统更高集成度、更高性能、更高工作频率需求的主要手段。文中介绍了目前微系统2.5D/3D封装技术的发展趋势及硅通孔(TSV)、微凸点/铜柱、圆片级封装等先进的高密度封装技术,并关注了2.5D/3D封装技术在射频微系统领域的应用及挑战,为射频微系统集成封装技术研究提供参考。 展开更多
关键词 2.5d/3d封装 射频微系统 硅通孔 圆片级封装 热管理
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基于2.5D模型和3D模型的重震联合反演对比分析 被引量:5
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作者 刘小龙 刘天佑 《工程地球物理学报》 2008年第4期458-463,共6页
由于三维可视化显示技术的复杂性和任意形状、多个沉积层模型三维正演计算的复杂性,目前国内外大多采用2.5D模型。本文根据南方海相油气勘探的实际情况,编制了基于3D模型的可视化重震交互反演系统。通过理论模型的验证,对实际资料处理... 由于三维可视化显示技术的复杂性和任意形状、多个沉积层模型三维正演计算的复杂性,目前国内外大多采用2.5D模型。本文根据南方海相油气勘探的实际情况,编制了基于3D模型的可视化重震交互反演系统。通过理论模型的验证,对实际资料处理结果的对比,3D重震联合反演克服了2D或2.5D模型难以模拟复杂地质构造带的问题,较好地解决了海相地区地震资料品质差、信噪比低导致地震解释模糊甚至无法给出解释的困难,取得了明显的地质解释效果。 展开更多
关键词 重震联合反演 2.5d模型 3d模型 人机交互
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Beyond the Silicon Plateau:A Convergence of Novel Materials for Transistor Evolution
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作者 Jung Hun Lee Jae Young Kim +3 位作者 Hyeon-Ji Lee Sung-Jin Choi Yoon Jung Lee Ho Won Jang 《Nano-Micro Letters》 2026年第2期786-844,共59页
As silicon-based transistors face fundamental scaling limits,the search for breakthrough alternatives has led to innovations in 3D architectures,heterogeneous integration,and sub-3 nm semiconductor body thicknesses.Ho... As silicon-based transistors face fundamental scaling limits,the search for breakthrough alternatives has led to innovations in 3D architectures,heterogeneous integration,and sub-3 nm semiconductor body thicknesses.However,the true effectiveness of these advancements lies in the seamless integration of alternative semiconductors tailored for next-generation transistors.In this review,we highlight key advances that enhance both scalability and switching performance by leveraging emerging semiconductor materials.Among the most promising candidates are 2D van der Waals semiconductors,Mott insulators,and amorphous oxide semiconductors,which offer not only unique electrical properties but also low-power operation and high carrier mobility.Additionally,we explore the synergistic interactions between these novel semiconductors and advanced gate dielectrics,including high-K materials,ferroelectrics,and atomically thin hexagonal boron nitride layers.Beyond introducing these novel material configurations,we address critical challenges such as leakage current and long-term device reliability,which become increasingly crucial as transistors scale down to atomic dimensions.Through concrete examples showcasing the potential of these materials in transistors,we provide key insights into overcoming fundamental obstacles—such as device reliability,scaling down limitations,and extended applications in artificial intelligence—ultimately paving the way for the development of future transistor technologies. 展开更多
关键词 Modern transistors Transistor scaling Alternative semiconductors 3d integration device reliability
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2.5D/3D硅基光电子集成技术及应用 被引量:9
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作者 欧祥鹏 杨在利 +4 位作者 唐波 李志华 罗军 王文武 杨妍 《光通信研究》 2023年第1期1-16,共16页
全球网络流量急速增长,数据传输所需带宽和能源消耗也随之快速增加,传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体(CMOS)技术将光子集成电... 全球网络流量急速增长,数据传输所需带宽和能源消耗也随之快速增加,传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体(CMOS)技术将光子集成电路和电子集成电路大规模集成在硅衬底上等优势,能满足下一代数据传输系统的迫切需求。2.5D/3D硅基光电子集成技术可以有效缩短光芯片和电芯片之间电学互连长度、减小芯片尺寸,从而减小寄生效应、提高集成密度和降低功耗。文章介绍了硅基光电子集成技术的不同方案和最新进展,并展望了硅基光电子芯片结合2.5D/3D集成技术在数据通信、激光雷达、生化传感以及光计算等领域的应用前景。 展开更多
关键词 光通信 硅光 光电集成 2.5d/3d集成 硅通孔 转接板
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微系统先进封装3D CT无损检测方法研究
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作者 杜林 蒋珚 +4 位作者 孔泽斌 汪波 朱敏蔚 王兰来 王昆黍 《上海航天(中英文)》 2025年第4期66-74,共9页
分析了微系统器件先进封装架构的演变趋势,对目前应用最广泛的微系统2.5D先进封装结构的可靠性问题和风险进行了总结,针对高价值的微系统器件典型风险难以检测的问题,开展了无损检测方法研究。实验采用了3D micro CT方法,基于纳米微焦... 分析了微系统器件先进封装架构的演变趋势,对目前应用最广泛的微系统2.5D先进封装结构的可靠性问题和风险进行了总结,针对高价值的微系统器件典型风险难以检测的问题,开展了无损检测方法研究。实验采用了3D micro CT方法,基于纳米微焦点射线管对2.5D的微系统先进封装特征进行了分析,首次提出了基于2D焊球虚拟切片数据的等高线分析方法,对转接板微翘曲的分析精度达到1μm。通过TSV 2D切片数据和扫描电镜制样数据的比对,验证了内部硅穿孔(TSV)精细尺寸的3D无损检测精度。通过转接板的实验数据分析,证实了转接板中铜凸形态,并展示了实测数据。通过实测数据表征了转接板上电阻焊接的微焊点质量。本文为微系统先进封装可靠性评估提供了新评估方法,试验数据证实了方法的有效性,并为缺陷判别提供了参考依据。 展开更多
关键词 2.5d先进封装 3d CT 无损 微系统 微翘曲
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DWT-3DRec:DeepJSCC-based wireless transmission for efficient 3D scene reconstruction using CityNeRF
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作者 Shuang Cao Jie Li +2 位作者 Ruiyun Yu Xingwei Wang Jianing Duan 《Digital Communications and Networks》 2025年第5期1370-1384,共15页
The Unmanned Aerial Vehicle(UAV)-assisted sensing-transmission--computing integrated system plays a vital role in emergency rescue scenarios involving damaged infrastructure.To tackle the challenges of data transmissi... The Unmanned Aerial Vehicle(UAV)-assisted sensing-transmission--computing integrated system plays a vital role in emergency rescue scenarios involving damaged infrastructure.To tackle the challenges of data transmission and enable timely rescue decision-making,we propose DWT-3DRec-an efficient wireless transmission model for 3D scene reconstruction.This model leverages MobileNetV2 to extract image and pose features,which are transmitted through a Dual-path Adaptive Noise Modulation network(DANM).Moreover,we introduce the Gumbel Channel Masking Module(GCMM),which enhances feature extraction and improves reconstruction reliability by mitigating the effects of dynamic noise.At the ground receiver,the Multi-scale Deep Source-Channel Coding for 3D Reconstruction(MDS-3DRecon)framework integrates Deep Joint Source-Channel Coding(DeepJSCC)with Cityscale Neural Radiance Fields(CityNeRF).It adopts a progressive close-view training strategy and incorporates an Adaptive Fusion Module(AFM)to achieve high-precision scene reconstruction.Experimental results demonstrate that DWT-3DRec significantly outperforms the Joint Photographic Experts Group(JPEG)standard in transmitting image and pose data,achieving an average loss as low as 0.0323 and exhibiting strong robustness across a Signal-to-Noise Ratio(SNR)range of 5--20 dB.In large-scale 3D scene reconstruction tasks,MDS-3DRecon surpasses Multum in Parvo Neural Radiance Fields(Mip-NeRF)and Bungee Neural Radiance Field(BungeeNeRF),achieving a Peak Signal-to-Noise Ratio(PSNR)of 24.921 dB and a reconstruction loss of 0.188.Ablation studies further confirm the essential roles of GCMM,DANM,and AFM in enabling highfidelity 3D reconstruction. 展开更多
关键词 deepJSCC CityNeRF MULTI-SCALE 3d reconstruction integrated sensing-transmission-computation
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3D printing technology for rechargeable Li/Na-ion batteries
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作者 Ziting Chen Yihao Yang +4 位作者 Songheng Xie Yangjie Liu Puwu Liang Xiang Hu Zhenhai Wen 《Journal of Energy Chemistry》 2025年第4期237-263,共27页
The rapid advancement of energy storage technologies highlights the urgent need for innovative electrochemical energy storage(EES)systems featuring complex geometries.Three-dimensional(3D)printing has emerged as a gro... The rapid advancement of energy storage technologies highlights the urgent need for innovative electrochemical energy storage(EES)systems featuring complex geometries.Three-dimensional(3D)printing has emerged as a groundbreaking solution,enabling the fabrication of customized,high-performance electrodes with precise structural control.This approach enhances accuracy,convenience,and facilitates improved ion and electron transport.In this review,we systematically summarize recent advancements in leveraging 3D printing techniques for lithium-ion and sodium-ion batteries.We begin by comparing the unique capabilities of various 3D printing methods against traditional fabrication techniques for producing tailored electrodes.We then address critical challenges across different battery module architectures-cathodes,anodes,electrolytes,and integrated systems-highlighting breakthroughs in material selection,ink formulation,and post-processing.Finally,we explore the future potential of 3Dprinted batteries in next-generation EES devices,emphasizing their role in advancing customizable,high-efficiency solutions.The insights provided herein illuminate how 3D printing can significantly accelerate the development of advanced battery materials,fostering innovation in energy storage technology. 展开更多
关键词 3d printing Li/Na-ion batteries ELECTROdE ELECTROLYTE integrated batteries
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Identification of bored pile defects utilizing torsional low strain integrity test:Theoretical basis and numerical analysis
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作者 Yunpeng Zhang Hongxuan Ji +2 位作者 Lulu Zhang M.Hesham El Naggar Wenbing Wu 《Journal of Rock Mechanics and Geotechnical Engineering》 2025年第5期3035-3053,共19页
The torsional low strain integrity test(TLSIT),known for its advantages such as a smaller detection blind zone,improved identification of shallowly buried defects,stable phase velocity for signal interpretation,and be... The torsional low strain integrity test(TLSIT),known for its advantages such as a smaller detection blind zone,improved identification of shallowly buried defects,stable phase velocity for signal interpretation,and better adaptability for existing pile testing.However,it lacks a comprehensive understanding of the authentic three-dimensional(3D)strain wave propagation mechanism,particularly wave reflection and transmission at defects.To address this gap,a novel 3D theoretical framework is introduced in this context to model the authentic 3D wave propagation during the TLSIT.The proposed approach is validated by comparing its results with those obtained from 3D finite element method(FEM)simulations and simplified 1D(one-dimensional)and 3D analytical solutions.Additionally,a parametric study is conducted to enhance insights into the formation mechanism of high-frequency interference observed during the TLSIT.Finally,a defect identification study is performed to provide guidance for interpreting the wave spectrum in terms of defect characteristics. 展开更多
关键词 Pile foundations Non-destructive integrity test TORSION 3d strain wave propagation Low strain High-frequency interference
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DATA MODEL AND VISUALIZATION OF 3D CITY LANDSCAPE BASED ON INTEGRATED DATABASES 被引量:5
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作者 Li Deren Wang Yandong +1 位作者 Zhu Qing Gong Jianya 《Geo-Spatial Information Science》 1999年第1期21-25,共5页
Data acquisition and modeling are the two important, difficult and costful aspects in a Cybercity project. 2D-GIS is mature and can manage a lot of spatial data. Thus 3D-GIS should make the best of data and technology... Data acquisition and modeling are the two important, difficult and costful aspects in a Cybercity project. 2D-GIS is mature and can manage a lot of spatial data. Thus 3D-GIS should make the best of data and technology of 2D-GIS. Construction of a useful synthetic environment requires integration of multiple types of information like DEM, texture images and 3D representation of objects such as buildings. In this paper, the method for 3D city landscape data model and visualization based on integrated databases is presented. Since the data volume of raster are very huge, special strategies(for example, pyramid gridded method) must be adopted in order to manage raster data efficiently. Three different methods of data acquisition, the proper data structure and a simple modeling method are presented as well. At last, a pilot project of Shanghai Cybercity is illustrated. 展开更多
关键词 3d CITY LANdSCAPE integrATEd dATABASES modeling VISUALIZATION
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Impact of Urban 3D Morphology on Particulate Matter 2.5(PM2.5) Concentrations:Case Study of Beijing, China 被引量:6
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作者 LUAN Qingzu JIANG Wei +1 位作者 LIU Shuo GUO Hongxiang 《Chinese Geographical Science》 SCIE CSCD 2020年第2期294-308,共15页
Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigat... Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigations of the impact of urban three-dimensional(3D)morphology on PM2.5 concentration have important scientific significance.In this paper,39 PM2.5 monitoring sites of Beijing in China were selected with PM2.5 automatic monitoring data that were collected in 2013.This data set was used to analyze the impacts of the meteorological condition and public transportation on PM2.5 concentrations.Based on the elimination of the meteorological conditions and public transportation factors,the relationships between urban 3D morphology and PM2.5 concentrations are highlighted.Ten urban 3D morphology indices were established to explore the spatial-temporal correlations between the indices and PM2.5 concentrations and analyze the impact of urban 3D morphology on the PM2.5 concentrations.Results demonstrated that road length density(RLD),road area density(RAD),construction area density(CAD),construction height density(CHD),construction volume density(CVD),construction otherness(CO),and vegetation area density(VAD)have positive impacts on the PM2.5 concentrations,whereas water area density(WAD),water fragmentation(WF),and vegetation fragmentation(VF)(except for the 500 m buffer)have negative impacts on the PM2.5 concentrations.Moreover,the correlations between the morphology indices and PM2.5 concentrations varied with the buffer scale.The findings could lay a foundation for the high-precision spatial-temporal modelling of PM2.5 concentrations and the scientific planning of urban 3D spaces by authorities responsible for controlling PM2.5 concentrations. 展开更多
关键词 URBAN three-dimensional(3d)morphology PARTICULATE matter 2.5(PM2.5) air pollution URBAN planning Beijing China
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3D‑Printed Carbon‑Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics 被引量:7
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作者 Shaohong Shi Yuheng Jiang +5 位作者 Hao Ren Siwen Deng Jianping Sun Fangchao Cheng Jingjing Jing Yinghong Chen 《Nano-Micro Letters》 SCIE EI CAS CSCD 2024年第5期87-101,共15页
Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electroni... Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electronics,posing a major obstacle to the integra-tion of electronics.The innovation of integrating 3D-printed conformal shielding(c-SE)modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE func-tion without occupying additional space.Herein,the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity.Accordingly,the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing.In particular,the SE performance of 3D-printed frame is up to 61.4 dB,simultaneously accompanied with an ultralight architecture of 0.076 g cm^(-3) and a superhigh specific shielding of 802.4 dB cm3 g^(-1).Moreover,as a proof-of-concept,the 3D-printed c-SE module is in situ integrated into core electronics,successfully replacing the traditional metal-based module to afford multiple functions for electromagnetic compatibility and thermal dissipa-tion.Thus,this scientific innovation completely makes up the blank for assembling carbon-based c-SE modules and sheds a brilliant light on developing the next generation of high-performance shielding materials with arbitrarily-customized structure for integrated electronics. 展开更多
关键词 3d printing Carbon-based nanoparticles Conformal electromagnetic interference shielding integrated electronics
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Heavy ion-induced single event upset sensitivity evaluation of 3D integrated static random access memory 被引量:6
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作者 Xue-Bing Cao Li-Yi Xiao +5 位作者 Ming-Xue Huo Tian-Qi Wang Shan-Shan Liu Chun-Hua Qi An-Long Li Jin-Xiang Wang 《Nuclear Science and Techniques》 SCIE CAS CSCD 2018年第3期31-41,共11页
Heavy ion-induced single event upsets(SEUs)of static random access memory(SRAM), integrated with three-dimensional integrated circuit technology, are evaluated using a Monte Carlo simulation method based on the Geant4... Heavy ion-induced single event upsets(SEUs)of static random access memory(SRAM), integrated with three-dimensional integrated circuit technology, are evaluated using a Monte Carlo simulation method based on the Geant4 simulation toolkit. The SEU cross sections and multiple cell upset(MCU) susceptibility of 3D SRAM are explored using different types and energies of heavy ions.In the simulations, the sensitivities of different dies of 3D SRAM show noticeable discrepancies for low linear energy transfers(LETs). The average percentage of MCUs of 3D SRAM increases from 17.2 to 32.95%, followed by the energy of ^(209)Bi decreasing from 71.77 to 38.28 MeV/u. For a specific LET, the percentage of MCUs presents a notable difference between the face-to-face and back-toface structures. In the back-to-face structure, the percentage of MCUs increases with a deeper die, compared with the face-to-face structure. The simulation method and process are verified by comparing the SEU cross sections of planar SRAM with experimental data. The upset cross sections of the planar process and 3D integrated SRAM are analyzed. The results demonstrate that the 3D SRAM sensitivity is not greater than that of the planar SRAM. The 3D process technology has the potential to be applied to the aerospace and military fields. 展开更多
关键词 3d integration Single EVENT upset (SEU) Multiple CELL upset (MCU) MONTE Carlo simulation
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3D-printing of integrated spheres as a superior support of phosphotungstic acid for deep oxidative desulfurization of fuel 被引量:4
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作者 Jie Zhu Peiwen Wu +8 位作者 Linlin Chen Jing He Yingcheng Wu Chao Wang Yanhong Chao Linjie Lu Minqiang He Wenshuai Zhu Huaming Li 《Journal of Energy Chemistry》 SCIE EI CAS CSCD 2020年第6期91-97,I0004,共8页
Construction of catalysts with integral structure for oxidative reaction process is an essential promotion to catalysts in industrial application.In this work,a 3D printing method was employed to prepare 3D printed sp... Construction of catalysts with integral structure for oxidative reaction process is an essential promotion to catalysts in industrial application.In this work,a 3D printing method was employed to prepare 3D printed spheres(3D-PSs),followed by carbonization to form 3D carbon spheres(3D-CSs).Then,a 3D-CSs supported phosphotungstic acid(HPW/3D-CSs)was prepared for deep oxidative desulfurization.Compared with traditional powder catalysts,the as-prepared catalyst is easy to be operated and separated from oil products.The supported catalyst possesses excellent catalytic performance and the removal of DBT,4-MDBT and 4,6-DMDBT in fuel oil,reaching^100%of sulfur removal.The effects of various experimental parameters on desulfurization efficiency were considered to optimize reaction conditions.Moreover,the catalyst shows excellent thermal and chemical stability,with no obvious decrease in desulfurization activity after 5 cycles.GC–MS analysis indicates DBT sulfone was the solely oxidized product of DBT. 展开更多
关键词 3d PRINTING integrATEd SPHERES Supported catalyst OXIdATIVE dESULFURIZATION
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Integral imaging-based tabletop light field 3D display with large viewing angle 被引量:6
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作者 Yan Xing Xing-Yu Lin +9 位作者 Lin-Bo Zhang Yun-Peng Xia Han-Le Zhang Hong-Yu Cui Shuang Li Tong-Yu Wang Hui Ren Di Wang Huan Deng Qiong-Hua Wang 《Opto-Electronic Advances》 SCIE EI CAS CSCD 2023年第6期19-30,共12页
Light field 3D display technology is considered a revolutionary technology to address the critical visual fatigue issues in the existing 3D displays.Tabletop light field 3D display provides a brand-new display form th... Light field 3D display technology is considered a revolutionary technology to address the critical visual fatigue issues in the existing 3D displays.Tabletop light field 3D display provides a brand-new display form that satisfies multi-user shared viewing and collaborative works,and it is poised to become a potential alternative to the traditional wall and portable display forms.However,a large radial viewing angle and correct radial perspective and parallax are still out of reach for most current tabletop light field 3D displays due to the limited amount of spatial information.To address the viewing angle and perspective issues,a novel integral imaging-based tabletop light field 3D display with a simple flat-panel structure is proposed and developed by applying a compound lens array,two spliced 8K liquid crystal display panels,and a light shaping diffuser screen.The compound lens array is designed to be composed of multiple three-piece compound lens units by employing a reverse design scheme,which greatly extends the radial viewing angle in the case of a limited amount of spatial information and balances other important 3D display parameters.The proposed display has a radial viewing angle of 68.7°in a large display size of 43.5 inches,which is larger than the conventional tabletop light field 3D displays.The radial perspective and parallax are correct,and high-resolution 3D images can be reproduced in large radial viewing positions.We envision that this proposed display opens up possibility for redefining the display forms of consumer electronics. 展开更多
关键词 tabletop light field 3d display integral imaging compound lens array radial viewing angle
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Collaborative Design in PDM / 3D CAD Integrated Environment 被引量:3
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作者 CHEN Zhuoning ZHANG Fen YAN Xiaoguang BIN Hongzan 《Wuhan University Journal of Natural Sciences》 EI CAS 2006年第3期642-648,共7页
Some key issues in supporting collaborative design in product data management(PDM ) system and 3D computer aided design(CAD) system integrated environment are analyzed. The general architecture of the integrated e... Some key issues in supporting collaborative design in product data management(PDM ) system and 3D computer aided design(CAD) system integrated environment are analyzed. The general architecture of the integrated environment is divided into five tiers and employs the transparently integrated mode, with the mode, function calling and information exchanging among independent PDM and CAD processes are carried out via message translation /parse approach. Product layout feature(PLF ) model definition is presented, PLF model is used to represent design intention at the preliminary design phase. The collaborative design methodology employing the PLF model in PDM/3D CAD integrated environment is analyzed. The design methodology can speed up the design process, reduce the investment and improve the product quality. 展开更多
关键词 PdM/3d CAd integrated product layout feature collaborative design transparently integrated mode
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