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多芯粒2.5D/3D集成技术研究与应用现状
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作者 王根旺 李璐 +1 位作者 潘鹏辉 李宝霞 《电子科技大学学报》 北大核心 2025年第6期819-831,共13页
面向高性能计算机、人工智能、无人系统对电子芯片高性能、高集成度的需求,以2.5D、3D集成技术为代表的先进封装集成技术,不仅打破了当前集成芯片良率降低、成本骤升的困境,也是实现多种类型、多种材质、多种功能芯粒集成的重要手段。... 面向高性能计算机、人工智能、无人系统对电子芯片高性能、高集成度的需求,以2.5D、3D集成技术为代表的先进封装集成技术,不仅打破了当前集成芯片良率降低、成本骤升的困境,也是实现多种类型、多种材质、多种功能芯粒集成的重要手段。该文对多芯粒2.5D、3D集成方案研究现状与技术水平进行总结分析,包括大尺寸中介层2.5D技术、低互连节距3D堆叠互连技术、玻璃基集成技术等。并总结了不同集成方案技术的主要发展方向与亟待攻克的技术难点。在此基础上,进一步归纳了多芯粒2.5D、3D集成技术在数字、光电、微电子机械等集成芯片与器件领域的应用,分析了多芯粒2.5D、3D封装集成技术未来发展与应用方向,为微小型多功能一体化集成芯片提供发展思路。 展开更多
关键词 先进封装 2.5d集成 3d集成 中介层
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Detailed in-depth mapping of the world largest anorthositic complex:Magnetic anomalies,2.5-3D modelling and emplacement constraints of the Kunene Complex(KC),SW Angola
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作者 T.Mochales E.Merino-Martínez +11 位作者 C.Rey-Moral A.Machadinho J.Carvalho P.Represas J.L.García-Lobón M.C.Feria R.Martín-Banda M.T.López-Bahut D.Alves E.Ramalho J.Manuel D.Cordeiro 《Geoscience Frontiers》 2025年第3期261-285,共25页
The Kunene Complex(KC)represents a very large Mesoproterozoic igneous body,mainly composed of anorthosites and gabbroic rocks that extends from SW Angola to NW Namibia(outcropping 18,000 km^(2),NE-SW trend,and ca.350 ... The Kunene Complex(KC)represents a very large Mesoproterozoic igneous body,mainly composed of anorthosites and gabbroic rocks that extends from SW Angola to NW Namibia(outcropping 18,000 km^(2),NE-SW trend,and ca.350 km long and up to 50 km wide).Little is known about its structure at depth.Here,we use recently acquired aerogeophysical data to accurately determine its hidden extent and to unravel its morphology at depth.These data have been interpreted and modelled to investigate the unexposed KC boundaries,reconstructing the upper crustal structure(between 0 and 15 km depth)overlain by the thin sedimentary cover of the Kalahari Basin.The modelling reveals that the KC was emplaced in the upper crust and extends in depth up to ca.5 km,showing a lobular geometry and following a large NE-SW to NNE-SSW linear trend,presumably inherited from older Paleoproterozoic structures.The lateral continuation of the KC to the east(between 50 and 125 km)beneath the Kalahari Cenozoic sediments suggests an overall size three times the outcropping dimension(about 53,500 km^(2)).This affirmation clearly reinforces the economic potential of this massif,related to the prospecting of raw materials and certain types of economic mineralization(Fe-Ti oxides,metallic sulphides or platinum group minerals).Up to 11 lobes have been isolated with dimensions ranging from 135.5 to 37.3 km in length and 81.9 to 20.7 km in width according to remanent bodies revealed by TMI mapping.A total volume of 65,184 km3 was calculated only for the magnetically remanent bodies of the KC.A long-lasting complex contractional regime,where large strike-slip fault systems were involved,occurred in three kinematic pulses potentially related to a change of velocity or convergence angle acting on previous Paleoproterozoic inherited sutures.The coalescent magmatic pulses can be recognized by means of magnetic anomalies,age of the bodies as well as the lineations inferred in this work:(i)Emplacement of the eastern mafic bodies and granites in a stage of significant lateral extension in a transtensional context between 1500 Ma and 1420 Ma;(ii)Migration of the mantle derived magmas westwards with deformation in a complex contractional setting with shearing structures involving western KC bodies and basement from 1415 Ma to 1340 Ma;(iii)NNW-SSE extensional structures are relocated westwards,involving mantle magmas,negative flower structures and depression that led to the formation of late Mesoproterozoic basins from 1325 Ma to 1170 Ma.Additionally,we detect several first and second order structures to place the structuring of the KC in a craton-scale context in relation to the crustal structures detected in NW Namibia. 展开更多
关键词 ANGOLA Kunene Complex(KC) Magnetic prospecting 2.5 modelling 3d inversion
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1,25(OH)_2D_3对PM2.5在体染毒慢性阻塞性肺疾病大鼠气道炎症的作用 被引量:3
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作者 彭建萍 陈乐蓉 +3 位作者 胡欣春 程小鹏 廖连芳 吴亮亮 《中国老年学杂志》 CAS 北大核心 2017年第19期4707-4709,共3页
目的探讨1,25二羟维生素D3[1,25(OH)_2D_3]对PM2.5在体染毒慢性阻塞性肺疾病(COPD)大鼠气道炎症的作用。方法 72只雄性Wistar大鼠随机分成正常组、COPD组、1,25(OH)_2D_3+COPD组(合并组),每组24只,对三组大鼠气管滴注PM2.5染毒,每天染毒... 目的探讨1,25二羟维生素D3[1,25(OH)_2D_3]对PM2.5在体染毒慢性阻塞性肺疾病(COPD)大鼠气道炎症的作用。方法 72只雄性Wistar大鼠随机分成正常组、COPD组、1,25(OH)_2D_3+COPD组(合并组),每组24只,对三组大鼠气管滴注PM2.5染毒,每天染毒1次,连续3 d,在最后一次染毒24 h后处死动物,分析肺泡灌洗液中白细胞介素(IL)-8、IL-17、肿瘤坏死因子(TNF)-α的含量。结果 PM2.5对正常组、COPD组、合并组大鼠均产生急性毒性,且存在剂量反应关系,COPD组肺泡灌洗液中IL-8、TNF-α浓度明显高于正常组(P<0.05),经1,25(OH)_2D_3干预COPD组IL-8、TNF-α浓度低于COPD组,但仍高于正常组(P<0.05)。结论 COPD大鼠比正常大鼠对PM2.5更加易感,PM2.5可加重COPD的气道炎症。1,25(OH)_2D_3可减轻COPD气道炎症及损伤,在PM2.5染毒情况下补充1,25(OH)_2D_3对COPD的气道炎症仍具有改善作用。 展开更多
关键词 大气细颗粒物(PM2.5) 慢性阻塞性肺疾病 1 25二羟维生素d3 炎症
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射频微系统2.5D/3D封装技术发展与应用 被引量:35
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作者 崔凯 王从香 胡永芳 《电子机械工程》 2016年第6期1-6,共6页
2.5D/3D封装技术是满足未来射频系统更高集成度、更高性能、更高工作频率需求的主要手段。文中介绍了目前微系统2.5D/3D封装技术的发展趋势及硅通孔(TSV)、微凸点/铜柱、圆片级封装等先进的高密度封装技术,并关注了2.5D/3D封装技术在射... 2.5D/3D封装技术是满足未来射频系统更高集成度、更高性能、更高工作频率需求的主要手段。文中介绍了目前微系统2.5D/3D封装技术的发展趋势及硅通孔(TSV)、微凸点/铜柱、圆片级封装等先进的高密度封装技术,并关注了2.5D/3D封装技术在射频微系统领域的应用及挑战,为射频微系统集成封装技术研究提供参考。 展开更多
关键词 2.5d/3d封装 射频微系统 硅通孔 圆片级封装 热管理
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基于2.5D模型和3D模型的重震联合反演对比分析 被引量:5
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作者 刘小龙 刘天佑 《工程地球物理学报》 2008年第4期458-463,共6页
由于三维可视化显示技术的复杂性和任意形状、多个沉积层模型三维正演计算的复杂性,目前国内外大多采用2.5D模型。本文根据南方海相油气勘探的实际情况,编制了基于3D模型的可视化重震交互反演系统。通过理论模型的验证,对实际资料处理... 由于三维可视化显示技术的复杂性和任意形状、多个沉积层模型三维正演计算的复杂性,目前国内外大多采用2.5D模型。本文根据南方海相油气勘探的实际情况,编制了基于3D模型的可视化重震交互反演系统。通过理论模型的验证,对实际资料处理结果的对比,3D重震联合反演克服了2D或2.5D模型难以模拟复杂地质构造带的问题,较好地解决了海相地区地震资料品质差、信噪比低导致地震解释模糊甚至无法给出解释的困难,取得了明显的地质解释效果。 展开更多
关键词 重震联合反演 2.5d模型 3d模型 人机交互
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2.5D/3D硅基光电子集成技术及应用 被引量:9
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作者 欧祥鹏 杨在利 +4 位作者 唐波 李志华 罗军 王文武 杨妍 《光通信研究》 2023年第1期1-16,共16页
全球网络流量急速增长,数据传输所需带宽和能源消耗也随之快速增加,传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体(CMOS)技术将光子集成电... 全球网络流量急速增长,数据传输所需带宽和能源消耗也随之快速增加,传统电子信息互联架构已无法满足日益增长的带宽和节约能耗的需求。硅基光电子技术具有带宽高、能耗低并且可以利用成熟的互补金属氧化物半导体(CMOS)技术将光子集成电路和电子集成电路大规模集成在硅衬底上等优势,能满足下一代数据传输系统的迫切需求。2.5D/3D硅基光电子集成技术可以有效缩短光芯片和电芯片之间电学互连长度、减小芯片尺寸,从而减小寄生效应、提高集成密度和降低功耗。文章介绍了硅基光电子集成技术的不同方案和最新进展,并展望了硅基光电子芯片结合2.5D/3D集成技术在数据通信、激光雷达、生化传感以及光计算等领域的应用前景。 展开更多
关键词 光通信 硅光 光电集成 2.5d/3d集成 硅通孔 转接板
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3D-programmable streamline guided orientation in composite materials for targeted heat dissipation
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作者 Xinfeng Zhang Xuan Yang +3 位作者 Yiwen Fan Run Hu Bin Xie Xiaobing Luo 《International Journal of Extreme Manufacturing》 2025年第2期723-735,共13页
Filler-reinforced polymer composites demonstrate pervasive applications due to their strengthened performances,multi-degree tunability,and ease of manufacturing.In thermal management field,polymer composites reinforce... Filler-reinforced polymer composites demonstrate pervasive applications due to their strengthened performances,multi-degree tunability,and ease of manufacturing.In thermal management field,polymer composites reinforced with thermally conductive fillers are widely adopted as thermal interface materials(TIMs).However,the three dimensional(3D)-stacked heterogenous integration of electronic devices has posed the problem that high-density heat sources are spatially distributed in the package.This situation puts forward new requirements for TIMs,where efficient heat dissipation channels must be established according to the specific distribution of discrete heat sources.To address this challenge,a 3D printing-assisted streamline orientation(3D-PSO)method was proposed to fabricate composite thermal materials with 3D programmable microstructures and orientations of fillers,which combines the shape-design capability of 3D printing and oriented control ability of fluid.The mechanism of fluid-based filler orientation control along streamlines was revealed by mechanical analysis of fillers in matrix.Thanks to the designed heat dissipation channels,composites showed better thermal and mechanical properties in comparison to random composites.Specifically,the thermal conductivity of 3D mesh-shape polydimethylsiloxane/liquid metal(PDMS/LM)composite was5.8 times that of random PDMS/LM composite under filler loading of 34.8 vol%.The thermal conductivity enhancement efficiency of 3D mesh-shape PDMS/carbon fibers composite reached101.05%under filler loading of 5.2 vol%.In the heat dissipation application of 3D-stacked chips,the highest chip temperature with 3D-PSO composite was 42.14℃lower than that with random composites.This is mainly attributed to the locally aggregated and oriented fillers'microstructure in fluid channels,which contributes to thermal percolation phenomena.The3D-PSO method exhibits excellent programmable design capabilities to adopt versatile distributions of heat sources,paving a new way to solve the complicated heat dissipation issue in 3D-stacked chips integration application. 展开更多
关键词 thermal materials 3d heat dissipation channels 3d-stacked chips heat dissipation 3d printing orientation control
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微系统先进封装3D CT无损检测方法研究
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作者 杜林 蒋珚 +4 位作者 孔泽斌 汪波 朱敏蔚 王兰来 王昆黍 《上海航天(中英文)》 2025年第4期66-74,共9页
分析了微系统器件先进封装架构的演变趋势,对目前应用最广泛的微系统2.5D先进封装结构的可靠性问题和风险进行了总结,针对高价值的微系统器件典型风险难以检测的问题,开展了无损检测方法研究。实验采用了3D micro CT方法,基于纳米微焦... 分析了微系统器件先进封装架构的演变趋势,对目前应用最广泛的微系统2.5D先进封装结构的可靠性问题和风险进行了总结,针对高价值的微系统器件典型风险难以检测的问题,开展了无损检测方法研究。实验采用了3D micro CT方法,基于纳米微焦点射线管对2.5D的微系统先进封装特征进行了分析,首次提出了基于2D焊球虚拟切片数据的等高线分析方法,对转接板微翘曲的分析精度达到1μm。通过TSV 2D切片数据和扫描电镜制样数据的比对,验证了内部硅穿孔(TSV)精细尺寸的3D无损检测精度。通过转接板的实验数据分析,证实了转接板中铜凸形态,并展示了实测数据。通过实测数据表征了转接板上电阻焊接的微焊点质量。本文为微系统先进封装可靠性评估提供了新评估方法,试验数据证实了方法的有效性,并为缺陷判别提供了参考依据。 展开更多
关键词 2.5d先进封装 3d CT 无损 微系统 微翘曲
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Bioprinting of novel 3D tumor array chip for drug screening 被引量:10
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作者 Mingjun Xie Qing Gao +2 位作者 Jianzhong Fu Zichen Chen Yong He 《Bio-Design and Manufacturing》 SCIE CSCD 2020年第3期175-188,共14页
Biomedical field has been seeking a feasible standard drug screening system consisting of 3D tumor model array for drug researching due to providing sufficient samples and simulating actual in vivo tumor growth situat... Biomedical field has been seeking a feasible standard drug screening system consisting of 3D tumor model array for drug researching due to providing sufficient samples and simulating actual in vivo tumor growth situation,which is still a challenge to rapidly and uniformly establish though.Here,we propose a novel drug screening system,namely 3D tumor array chip with“layer cake”structure,for drug screening.Accurate gelatin methacryloyl hydrogel droplets(~0.1μL)containing tumor cells can be automatically deposited on demand with electrohydrodynamic 3D printing.Transparent conductive membrane is introduced as a chip basement for preventing charges accumulation during fabricating and convenient observing during screening.Culturing chambers formed by stainless steel and silicon interlayer is convenient to be assembled and recycled.As this chip is compatible with the existing 96-well culturing plate,the drug screening protocols could keep the same as convention.Important properties of this chip,namely printing stability,customizability,accuracy,microenvironment,tumor functionalization,are detailly examined.As a demonstration,it is applied for screening of epirubicin and paclitaxel with breast tumor cells to confirm the compatibility of the proposed screening system with the traditional screening methods.We believe this chip will potentially play a significant role in drug evaluation in the future. 展开更多
关键词 3d tumor array chip(3d-TAC) Gelatin methacryloyl(GelMA) drug screening In vitro model BIOPRINTING
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Impact of Urban 3D Morphology on Particulate Matter 2.5(PM2.5) Concentrations:Case Study of Beijing, China 被引量:6
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作者 LUAN Qingzu JIANG Wei +1 位作者 LIU Shuo GUO Hongxiang 《Chinese Geographical Science》 SCIE CSCD 2020年第2期294-308,共15页
Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigat... Urban particulate matter 2.5(PM2.5)pollution and public health are closely related,and concerns regarding PM2.5 are widespread.Of the underlying factors,the urban morphology is the most manageable.Therefore,investigations of the impact of urban three-dimensional(3D)morphology on PM2.5 concentration have important scientific significance.In this paper,39 PM2.5 monitoring sites of Beijing in China were selected with PM2.5 automatic monitoring data that were collected in 2013.This data set was used to analyze the impacts of the meteorological condition and public transportation on PM2.5 concentrations.Based on the elimination of the meteorological conditions and public transportation factors,the relationships between urban 3D morphology and PM2.5 concentrations are highlighted.Ten urban 3D morphology indices were established to explore the spatial-temporal correlations between the indices and PM2.5 concentrations and analyze the impact of urban 3D morphology on the PM2.5 concentrations.Results demonstrated that road length density(RLD),road area density(RAD),construction area density(CAD),construction height density(CHD),construction volume density(CVD),construction otherness(CO),and vegetation area density(VAD)have positive impacts on the PM2.5 concentrations,whereas water area density(WAD),water fragmentation(WF),and vegetation fragmentation(VF)(except for the 500 m buffer)have negative impacts on the PM2.5 concentrations.Moreover,the correlations between the morphology indices and PM2.5 concentrations varied with the buffer scale.The findings could lay a foundation for the high-precision spatial-temporal modelling of PM2.5 concentrations and the scientific planning of urban 3D spaces by authorities responsible for controlling PM2.5 concentrations. 展开更多
关键词 URBAN three-dimensional(3d)morphology PARTICULATE matter 2.5(PM2.5) air pollution URBAN planning Beijing China
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Highly efficient synthesis and application of aryl diazonium salts via femtosecond laser-tailored 3D flow microfluidic chips 被引量:4
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作者 Jing Ren Miao Wu +3 位作者 Kaiwu Dong Min Zhang Ya Cheng Guoyue Shi 《Chinese Chemical Letters》 SCIE CAS CSCD 2023年第4期326-331,共6页
The first example of the microfluidic chips(MFCs) consisting of centimeter-level 3D channels with highdensity and large-volume fabricated by femtosecond laser micromachining were utilized to develop a time-saving, eco... The first example of the microfluidic chips(MFCs) consisting of centimeter-level 3D channels with highdensity and large-volume fabricated by femtosecond laser micromachining were utilized to develop a time-saving, economical and hazardless flow synthesis process, and its advantages have been proved by in situ formation of aryldiazonium salts and subsequent borylation with bis(pinacolato)diboron. There are several important advantages in our 3D MFC-based flow synthesis technology, including the following:(1) the reaction temperature was altered from ice bath to room temperature;(2) the residence time was reduced by 10 times;(3) the yield was greatly improved, that is, several arylboronates were successfully obtained with higher yield compared to traditional batch process. Therefore, it can be envisioned that a novel, simplified flow synthetic protocol will be developed toward green organic synthesis via MFCs. 展开更多
关键词 3d microfluidic chips Femtosecondlasermicromachining Flow synthesis Aryldiazoniumsalts Roomtemperature
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基于信号与电源完整性的有效分析优化2.5D-3D的设计 被引量:3
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作者 何永松 秦祖立 +1 位作者 林麟 吴凯 《电子技术应用》 2021年第8期64-67,71,共5页
HBM(高带宽内存)存储系统与传统的DRAM接口相比,具有高速率和低功耗特性。在2.5D/3D的设计中,随着HBM速率的提高,对信号与电源完整性的设计的考量越来越重要,如何通过有效的仿真指导产品的设计是一个挑战。首先从信号完整性的角度讨论... HBM(高带宽内存)存储系统与传统的DRAM接口相比,具有高速率和低功耗特性。在2.5D/3D的设计中,随着HBM速率的提高,对信号与电源完整性的设计的考量越来越重要,如何通过有效的仿真指导产品的设计是一个挑战。首先从信号完整性的角度讨论了设计的考量点,其次从电源完整性的角度讨论电源噪声在高速传输信号中的影响,并提出了如何仿真与预测大量同步开关噪声等电源噪声对眼图的影响,最后基于芯片的测试结果对比仿真,给出结论。 展开更多
关键词 2.5d/3d设计 信号完整性 电源完整性 同步开关噪声 电源噪声预测
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2.5D/3D芯片-封装-系统协同仿真技术研究 被引量:11
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作者 褚正浩 张书强 候明刚 《电子与封装》 2021年第10期30-39,共10页
2.5D/3D芯片包含Interposer/硅穿孔(Through Silicon Via,TSV)等复杂结构,通过多物理场仿真可以提前对2.5D/3D芯片的设计进行信号完整性(Signal Integrity,SI)、电源完整性(Power Integrity,PI)及可靠性优化。总结了目前2.5D/3D芯片仿... 2.5D/3D芯片包含Interposer/硅穿孔(Through Silicon Via,TSV)等复杂结构,通过多物理场仿真可以提前对2.5D/3D芯片的设计进行信号完整性(Signal Integrity,SI)、电源完整性(Power Integrity,PI)及可靠性优化。总结了目前2.5D/3D芯片仿真进展与挑战,介绍了基于芯片模型的Ansys芯片-封装-系统(CPS)多物理场协同仿真方法,阐述了如何模拟芯片在真实工况下达到优化芯片信号完整性、电源完整性以及优化散热方式、提高结构可靠性的设计目标,并进行电热耦合、热应力耦合分析,指出了仿真技术的未来发展方向。 展开更多
关键词 2.5d/3d芯片 芯片-封装-系统 多物理场 仿真 ANSYS
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重磁2.5D/3D互相约束反演技术在三维地质填图中的应用研究 被引量:1
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作者 王成龙 王诚煜 +2 位作者 刘长纯 杨忠杰 姚志宏 《地质找矿论丛》 CAS CSCD 2019年第2期274-279,共6页
三维地质填图为我国启动的新一轮地质调查项目,为提高重磁资料在三维地质填图中的应用效果,笔者提出重磁资料2.5D/3D相互约束重磁反演技术方案:利用重磁资料2.5D剖面反演结果、3D物性反演结果作为彼此反演约束条件,并通过了理论模型试... 三维地质填图为我国启动的新一轮地质调查项目,为提高重磁资料在三维地质填图中的应用效果,笔者提出重磁资料2.5D/3D相互约束重磁反演技术方案:利用重磁资料2.5D剖面反演结果、3D物性反演结果作为彼此反演约束条件,并通过了理论模型试验。试验结果表明,该技术方案使反演结果中物性参数、空间位置更接近理论模型体。通过对本溪—临江地区思山岭铁矿磁异常及酸性岩体重力异常进行反演实践——估算磁异常铁矿资源量、研究酸性侵入岩深部展布形态的效果良好,可为大面积三维填图提供有效途径。 展开更多
关键词 3d物性反演 重磁2.5d反演 三维填图 重磁反演
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Mechanical Behavior and Failure Mechanism of 2.5D(Shallow Bend-joint, Deep Straight-joint) and 3D Orthogonal UHWMPE Fiber/Epoxy Composites by Vacuum-assistant-resin-infused 被引量:2
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作者 赵晓琳 DU Jianhua +4 位作者 YANG Hongwei JIA Chengchang GAO Heng WANG Dafeng Lü Yingying 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2016年第6期1240-1244,共5页
Ultra-high molecular weight polyethylene(UHMWPE) fiber/epoxy composites were fabricated by a vacuum assisted resin infused(VARI) processing technology. The curing condition of composites was at a cure temperature ... Ultra-high molecular weight polyethylene(UHMWPE) fiber/epoxy composites were fabricated by a vacuum assisted resin infused(VARI) processing technology. The curing condition of composites was at a cure temperature of 80 ℃ for 3h in a drying oven. The characteristics of 2.5D(shallow bend-joint and deep straight-joint) structure and 3D orthogonal structure were compared. The failure behavior, flexural strength, and microstructures of both composites were investigated. It was found that the flexural property was closely related to undulation angle θ. The flexural strength of 3D orthogonal structure composite was superior to the other two structures composites with the same weave parameters and resin. 展开更多
关键词 2.5d shallow bend-joint 2.5d deep straight-joint 3d orthogonal flexural property
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基于Cadence 3D-IC平台的2.5D封装Interposer设计 被引量:1
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作者 张成 李晴 赵佳 《电子技术应用》 2022年第8期46-50,59,共6页
2.5D先进封装区别于普通2D封装,主要在于多了一层Silicon Interposer(硅中介层),它采用硅工艺,设计方法相比普通2D封装更为复杂。而高带宽存储(High Bandwidth Memory,HBM)接口的互连又是Interposer设计中的主要挑战,需要综合考虑性能... 2.5D先进封装区别于普通2D封装,主要在于多了一层Silicon Interposer(硅中介层),它采用硅工艺,设计方法相比普通2D封装更为复杂。而高带宽存储(High Bandwidth Memory,HBM)接口的互连又是Interposer设计中的主要挑战,需要综合考虑性能、可实现性等多种因素。介绍了基于Cadence 3D-IC平台的Interposer设计方法,并结合HBM接口的自动布线脚本可以快速实现Interposer设计;同时通过仿真分析确定了基于格芯65 nm三层金属硅工艺的HBM2e 3.2 Gb/s互连设计规则,权衡了性能和可实现性,又兼具成本优势。 展开更多
关键词 2.5d先进封装 硅中介层 高带宽存储 3d-IC
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基于2.5D/3D封装集成电路的破坏性物理分析(DPA)方法研究 被引量:2
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作者 刘飞 赫兰齐 +1 位作者 叶峻豪 曾鹏 《产业科技创新》 2024年第5期125-128,共4页
本文通过对2.5D/3D封装集成电路DPA分析流程及方法的研究,提出了针对2.5D/3D封装的分析流程为先无损分析再进行破坏性分析,其中无损分析部分主要是通过无损成像技术进行内外部结构成像,由外观检查(3D OM),X射线成像检查(3D Xray),声学... 本文通过对2.5D/3D封装集成电路DPA分析流程及方法的研究,提出了针对2.5D/3D封装的分析流程为先无损分析再进行破坏性分析,其中无损分析部分主要是通过无损成像技术进行内外部结构成像,由外观检查(3D OM),X射线成像检查(3D Xray),声学扫描显微镜检查(C-SAM)组成;破坏性分析部分主要是通过破坏性制样技术对待分析样品进行层层拆解后对各部分结构进行结构工艺及材料特性表征,由开封,取芯片,多层堆叠芯片分离,剖面制样,结构表征等组成。同时也对每个分析测试项目的实现方法作出了阐述。根据本文所述方法可以实现对2.5D/3D封装芯片进行结构解析。 展开更多
关键词 2.5d/3d封装 dPA分析 无损分析 破坏性分析
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基于3D打印与单片机实现PM_(2.5)监测装置的研究 被引量:1
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作者 吴亮 王泽国 邵鸿铭 《无线互联科技》 2019年第3期89-90,共2页
PM_(2.5)浓度作为衡量大气污染的指标之一,值得我们时刻关注。文章设计了一种PM_(2.5)浓度检测装置,利用激光散射来采集数据,通过WiFi模块传送到服务器,将采集结果呈现给用户,来指引市民的出行规划。
关键词 STM32 PM2.5 3d打印 光散射法
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Femtosecond laser-engineered 3D microfluidic chips: Synthesis system sprouting highly efficient multiphase organic reactions
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作者 Jing Ren Kexin Niu +2 位作者 Miao Wu Ya Cheng Guoyue Shi 《Chinese Chemical Letters》 SCIE CAS CSCD 2023年第4期338-344,共7页
Recent developments in the utilization of microfluidic chips(MFCs) have shown their potential utility in multiphase organic synthesis by enabling efficient organic reactions in flow chemistry. However, MFCs technology... Recent developments in the utilization of microfluidic chips(MFCs) have shown their potential utility in multiphase organic synthesis by enabling efficient organic reactions in flow chemistry. However, MFCs technology has been wandering in the laboratory of small dose synthetic routes, which is limited to the level of "tiny" fluid flux. To address this issue, we herein report the first case of the chips with highthroughput 3D channels produced by femtosecond laser being used to create a time-saving, cost-effective and risk-free approach suitable for large-scale flow synthesis. Several multiphase reactions have been successfully prepared on demand in our designed flow synthesis system containing 3D MFCs: 1) benzyl alcohol was converted to benzaldehyde in 3 min with a yield of 97.50% by liquid-liquid two-phase transfer catalytic oxidation;2) organozinc reagents and α-cyano carbonyl carbon compounds were synthesized by solid-liquid two-phase metal insertion reaction in 7 min, and the yield was up to 100%;3) benzoic acid was synthesized by gas-liquid two-phase carboxylation reaction in 2.8 s with a yield of 96%. Significant gains in production rate result from the effective scaling of flow reactors from microliters per hour in MFCs to intermediate milliliters per minute without affecting mass transport performance. Meanwhile,our 3D MFCs show excellent mass and heat transfer efficiency in large-scale industrial units, breaking through the bottleneck in this field. As a result, it is possible to imagine the creation of a new, streamlined flow synthetic technique via MFCs for green multiphase organic synthesis. 展开更多
关键词 3d microfluidic chips Femtosecond laser micromachining Flow synthesis Multiphase reaction Organometrical reagents
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Rapid fabrication of modular 3D paper-basedmicrofluidic chips using projection-based 3D printing
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作者 Mingjun Xie Zexin Fu +5 位作者 Chunfei Lu Sufan Wu Lei Pan Yong He Yi Sun Ji Wang 《Bio-Design and Manufacturing》 SCIE EI CAS CSCD 2024年第5期611-623,共13页
Paper-based microchips have different advantages,such as better biocompatibility,simple production,and easy handling,making them promising candidates for clinical diagnosis and other fields.This study describes ametho... Paper-based microchips have different advantages,such as better biocompatibility,simple production,and easy handling,making them promising candidates for clinical diagnosis and other fields.This study describes amethod developed to fabricate modular three-dimensional(3D)paper-based microfluidic chips based on projection-based 3D printing(PBP)technology.A series of two-dimensional(2D)paper-based microfluidic modules was designed and fabricated.After evaluating the effect of exposure time on the accuracy of the flow channel,the resolution of this channel was experimentally analyzed.Furthermore,several 3D paper-based microfluidic chips were assembled based on the 2D ones using different methods,with good channel connectivity.Scaffold-based 2D and hydrogel-based 3D cell culture systems based on 3D paper-based microfluidic chips were verified to be feasible.Furthermore,by combining extrusion 3D bioprinting technology and the proposed 3D paper-based microfluidic chips,multiorgan microfluidic chips were established by directly printing 3D hydrogel structures on 3D paperbased microfluidic chips,confirming that the prepared modular 3D paper-based microfluidic chip is potentially applicable in various biomedical applications. 展开更多
关键词 Paper-based microfluidic chip Projection-based 3d printing(PBP) Modularization Cell culture
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