Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is import...Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.展开更多
Aero-engines,the core of air travel,rely on advanced high strength-toughness alloys(THSAs)such as titanium alloys,nickel-based superalloys,intermetallics,and ultra-high strength steel.The precision of cutting techniqu...Aero-engines,the core of air travel,rely on advanced high strength-toughness alloys(THSAs)such as titanium alloys,nickel-based superalloys,intermetallics,and ultra-high strength steel.The precision of cutting techniques is crucial for the manufacture of key components,including blades,discs,shafts,and gears.However,machining THSAs pose significant challenges,including high cutting forces and temperatures,which lead to rapid tool wear,reduced efficiency,and compromised surface integrity.This review thoroughly explores the current landscape and future directions of cutting techniques for THSAs in aero-engines.It examines the principles,mechanisms,and benefits of energy-assisted cutting technologies like laser-assisted machining and cryogenic cooling.The review assesses various tool preparation methods,their effects on tool performance,and strategies for precise shape and surface integrity control.It also outlines intelligent monitoring technologies for machining process status,covering aspects such as tool wear,surface roughness,and chatter,contributing to intelligent manufacturing.Additionally,it highlights emerging trends and potential future developments,including multi-energy assisted cutting mechanisms,advanced cutting tools,and collaborative control of structure shape and surface integrity,alongside intelligent monitoring software and hardware.This review serves as a reference for achieving efficient and high-quality manufacturing of THSAs in aero-engines.展开更多
基金Project supported by the National High Technology Research and Development Program of China(No.2008AA042505)the National Science and Technology Key Project Program(No.2009ZX02011)the Natural Science Foundation of Guangdong Province,China (No.U0734008)
文摘Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.
基金National Natural Science Foundation of China(Nos.92160301,92060203,52175415,and 52205475)Science Center for Gas Turbine Project(No.P2023-B-IV-003-001)+1 种基金Natural Science Foundation of Jiangsu Province(No.BK20210295)Fundamental Research Funds for the Central Universities(Nos.NS2023028 and NG2024015)。
文摘Aero-engines,the core of air travel,rely on advanced high strength-toughness alloys(THSAs)such as titanium alloys,nickel-based superalloys,intermetallics,and ultra-high strength steel.The precision of cutting techniques is crucial for the manufacture of key components,including blades,discs,shafts,and gears.However,machining THSAs pose significant challenges,including high cutting forces and temperatures,which lead to rapid tool wear,reduced efficiency,and compromised surface integrity.This review thoroughly explores the current landscape and future directions of cutting techniques for THSAs in aero-engines.It examines the principles,mechanisms,and benefits of energy-assisted cutting technologies like laser-assisted machining and cryogenic cooling.The review assesses various tool preparation methods,their effects on tool performance,and strategies for precise shape and surface integrity control.It also outlines intelligent monitoring technologies for machining process status,covering aspects such as tool wear,surface roughness,and chatter,contributing to intelligent manufacturing.Additionally,it highlights emerging trends and potential future developments,including multi-energy assisted cutting mechanisms,advanced cutting tools,and collaborative control of structure shape and surface integrity,alongside intelligent monitoring software and hardware.This review serves as a reference for achieving efficient and high-quality manufacturing of THSAs in aero-engines.
