A stacked metamaterial MEMS(meta-MEMS)chip is proposed,which can perfectly absorb electromagnetic waves,convert them into mechanical energy,drive movement of the optical micro-reflectors array,and detect millimeter wa...A stacked metamaterial MEMS(meta-MEMS)chip is proposed,which can perfectly absorb electromagnetic waves,convert them into mechanical energy,drive movement of the optical micro-reflectors array,and detect millimeter waves.It is equivalent to using visible light to image a millimeter wave.The meta-MEMS adopts the design of upper and lower chip separation and then stacking to achieve the"dielectric-resonant-air-ground"structure,reduce the thickness of the metamaterial and MEMS structures,and improve the performance of millimeter wave imaging.For verification,we designed and prepared a 94 GHz meta-MEMS focal plane array chip,in which the sum of the thickness of the metamaterial and MEMS structures is only 1/2500 wavelength,the pixel size is less than 1/3 wavelength,but the absorption rate is as high as 99.8%.Moreover,a light readout module was constructed to test the millimeter wave imaging performance.The results show that the response speed can reach 144 Hz and the lens-less imaging resolution is 1.5mm.展开更多
System-in-packaging(Si P) can realize the integration and miniaturization of electronic devices and it is significant to continue Moore’s law.Through-X-via(TXV) technology is the cornerstone of 3 D-SiP,which enables ...System-in-packaging(Si P) can realize the integration and miniaturization of electronic devices and it is significant to continue Moore’s law.Through-X-via(TXV) technology is the cornerstone of 3 D-SiP,which enables the vertical stacking and electrical interconnection of electronic devices.TXV originated from through-hole(TH) in PCB substrates and evolved in different substrate materials,such as silicon,glass,ceramic,and polymer.This work provides a comprehensive review of four distinguishing TXV technologies(through silicon via(TSV),through glass via(TGV),through ceramic via(TCV),and through mold via(TMV)),including the fabrication mechanisms,processes,and applications.Every TXV technology has unique characteristics and owns particular processes and functions.The process methods,key technologies,application fields,and advantages and disadvantages of each TXV technology were discussed.The cutting-edge through-hole process and development direction were reviewed.展开更多
文摘A stacked metamaterial MEMS(meta-MEMS)chip is proposed,which can perfectly absorb electromagnetic waves,convert them into mechanical energy,drive movement of the optical micro-reflectors array,and detect millimeter waves.It is equivalent to using visible light to image a millimeter wave.The meta-MEMS adopts the design of upper and lower chip separation and then stacking to achieve the"dielectric-resonant-air-ground"structure,reduce the thickness of the metamaterial and MEMS structures,and improve the performance of millimeter wave imaging.For verification,we designed and prepared a 94 GHz meta-MEMS focal plane array chip,in which the sum of the thickness of the metamaterial and MEMS structures is only 1/2500 wavelength,the pixel size is less than 1/3 wavelength,but the absorption rate is as high as 99.8%.Moreover,a light readout module was constructed to test the millimeter wave imaging performance.The results show that the response speed can reach 144 Hz and the lens-less imaging resolution is 1.5mm.
基金supported by the Aerospace S&T Group Application Innovation Program Project(No:09428ADA)the Key Research and Development Project of Hubei Province(Grant Nos.2020BAB068 and 2021BAA071)。
文摘System-in-packaging(Si P) can realize the integration and miniaturization of electronic devices and it is significant to continue Moore’s law.Through-X-via(TXV) technology is the cornerstone of 3 D-SiP,which enables the vertical stacking and electrical interconnection of electronic devices.TXV originated from through-hole(TH) in PCB substrates and evolved in different substrate materials,such as silicon,glass,ceramic,and polymer.This work provides a comprehensive review of four distinguishing TXV technologies(through silicon via(TSV),through glass via(TGV),through ceramic via(TCV),and through mold via(TMV)),including the fabrication mechanisms,processes,and applications.Every TXV technology has unique characteristics and owns particular processes and functions.The process methods,key technologies,application fields,and advantages and disadvantages of each TXV technology were discussed.The cutting-edge through-hole process and development direction were reviewed.
