We investigate the impact of heavy ion irradiation on a hypothetical static random access memory （SRAM） device. Influences of the irradiation angle, critical charge, drain-drain spacing, and dimension of device stru...We investigate the impact of heavy ion irradiation on a hypothetical static random access memory （SRAM） device. Influences of the irradiation angle, critical charge, drain-drain spacing, and dimension of device structure on the device sensitivity have been studied. These prediction and simulated results are interpreted with MUFPSA, a Monte Carlo code based on Geant4. The results show that the orientation of ion beams and device with different critical charge exert indis- pensable effects on multiple-bit upsets （MBUs）, and that with the decrease in spacing distance between adjacent cells or the dimension of the cells, the device is more susceptible to single event effect, especially to MBUs at oblique incidence.展开更多
Experimental evidence is presented relevant to the angular dependences of multiple-bit upset （MBU） rates and patterns in static random access memories （SRAMs） under heavy ion irradiation. The single event upset （...Experimental evidence is presented relevant to the angular dependences of multiple-bit upset （MBU） rates and patterns in static random access memories （SRAMs） under heavy ion irradiation. The single event upset （SEU） cross sections under tilted ion strikes are overestimated by 23.9%-84.6%, compared with under normally incident ion with the equivalent linear energy transfer （LET） value of 41 MeV/（mg/cm2）, which can be partially explained by the fact that the MBU rate for tilted ions of 30° is 8.5%-9.8% higher than for normally incident ions. While at a lower LET of - 9.5 MeV/（mg/cm2）, no clear discrepancy is observed. Moreover, since the ion trajectories at normal and tilted incidences are different, the predominant double-bit upset （DBU） patterns measured are different in both conditions. Those differences depend on the LET values of heavy ions and devices under test. Thus, effective LET method should be used carefully in ground-based testing of single event effects （SEE） sensitivity, especially in MBU-sensitive devices.展开更多
Experimental evidence is presented showing obvious azimuthal dependence of single event upsets(SEU) and multiple-bit upset(MBU) patterns in radiation hardened by design(RHBD) and MBU-sensitive static random access mem...Experimental evidence is presented showing obvious azimuthal dependence of single event upsets(SEU) and multiple-bit upset(MBU) patterns in radiation hardened by design(RHBD) and MBU-sensitive static random access memories(SRAMs), due to the anisotropic device layouts. Depending on the test devices, a discrepancy from 24.5% to 50% in the SEU cross sections of dual interlock cell(DICE) SRAMs is shown between two perpendicular ion azimuths under the same tilt angle. Significant angular dependence of the SEU data in this kind of design is also observed, which does not fit the inverse-cosine law in the effective LET method. Ion trajectory-oriented MBU patterns are identified, which is also affected by the topological distribution of sensitive volumes. Due to that the sensitive volumes are periodically isolated by the BL/BLB contacts along the Y-axis direction, double-bit upsets along the X-axis become the predominant configuration under normal incidence.Predominant triple-bit upset and quadruple-bit upset patterns are the same under different ion azimuths(Lshaped and square-shaped configurations, respectively). Those results suggest that traditional RPP/IRPP model should be promoted to consider the azimuthal and angular dependence of single event effects in certain designs.During earth-based evaluation of SEE sensitivity, worst case beam direction, i.e., the worst case response, should be revealed to avoid underestimation of the on-orbit error rate.展开更多
This paper explores the impact of back-gate bias (V_(soi)) and supply voltage (V_(DD)) on the single-event upset (SEU) cross section of 0.18μm configurable silicon-on-insulator static random-access memory (SRAM) unde...This paper explores the impact of back-gate bias (V_(soi)) and supply voltage (V_(DD)) on the single-event upset (SEU) cross section of 0.18μm configurable silicon-on-insulator static random-access memory (SRAM) under high linear energy transfer heavyion experimentation.The experimental findings demonstrate that applying a negative back-gate bias to NMOS and a positive back-gate bias to PMOS enhances the SEU resistance of SRAM.Specifically,as the back-gate bias for N-type transistors(V_(nsoi)) decreases from 0 to-10 V,the SEU cross section decreases by 93.23%,whereas an increase in the back-gate bias for P-type transistors (V_(psoi)) from 0 to 10 V correlates with an 83.7%reduction in SEU cross section.Furthermore,a significant increase in the SEU cross section was observed with increase in supply voltage,as evidenced by a 159%surge at V_(DD)=1.98 V compared with the nominal voltage of 1.8 V.To explore the physical mechanisms underlying these experimental data,we analyzed the dependence of the critical charge of the circuit and the collected charge on the bias voltage by simulating SEUs using technology computer-aided design.展开更多
AZ31-4.6% Mg2Si （mass fraction） composite was prepared by conventional casting method. Repetitive upsetting （RU） was applied to severely deforming the as-cast composite at 400 ℃ for 1, 3, and 5 passes. Finite ele...AZ31-4.6% Mg2Si （mass fraction） composite was prepared by conventional casting method. Repetitive upsetting （RU） was applied to severely deforming the as-cast composite at 400 ℃ for 1, 3, and 5 passes. Finite element analysis of the material flow indicates that deformation concentrates in the bottom region of the sample after 1 pass, and much more uniform deformation is obtained after 5 passes. During multi-pass RU process, both dendritic and Chinese script type Mg2Si phases are broken up into smaller particles owing to the shear stress forced by the matrix. With the increasing number of RU passes, finer grain size and more homogeneous distribution of Mg2Si particles are obtained along with significant enhancement in both strength and ductility. AZ31-4.6%Mg2Si composite exhibits tensile strength of 284 MPa and elongation of 9.8%after 5 RU passes at 400 ℃ compared with the initial 128 MPa and 5.4%of original AZ31-4.6%Mg2Si composite.展开更多
We study the problem of multiple node upset （MNU） using three-dimensional device simulation. The results show the transient floating node and charge lateral diffusion are the key reasons for MNU. We compare the MNU ...We study the problem of multiple node upset （MNU） using three-dimensional device simulation. The results show the transient floating node and charge lateral diffusion are the key reasons for MNU. We compare the MNU with multiple bit upset （MBU）,and find that their characteristics are different. Methods to avoid MNU are also discussed.展开更多
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 11179003, 10975164, 10805062, and 11005134)
文摘We investigate the impact of heavy ion irradiation on a hypothetical static random access memory （SRAM） device. Influences of the irradiation angle, critical charge, drain-drain spacing, and dimension of device structure on the device sensitivity have been studied. These prediction and simulated results are interpreted with MUFPSA, a Monte Carlo code based on Geant4. The results show that the orientation of ion beams and device with different critical charge exert indis- pensable effects on multiple-bit upsets （MBUs）, and that with the decrease in spacing distance between adjacent cells or the dimension of the cells, the device is more susceptible to single event effect, especially to MBUs at oblique incidence.
基金supported by the National Natural Science Foundation of China(Grant Nos.11179003,10975164,10805062,and 11005134)
文摘Experimental evidence is presented relevant to the angular dependences of multiple-bit upset （MBU） rates and patterns in static random access memories （SRAMs） under heavy ion irradiation. The single event upset （SEU） cross sections under tilted ion strikes are overestimated by 23.9%-84.6%, compared with under normally incident ion with the equivalent linear energy transfer （LET） value of 41 MeV/（mg/cm2）, which can be partially explained by the fact that the MBU rate for tilted ions of 30° is 8.5%-9.8% higher than for normally incident ions. While at a lower LET of - 9.5 MeV/（mg/cm2）, no clear discrepancy is observed. Moreover, since the ion trajectories at normal and tilted incidences are different, the predominant double-bit upset （DBU） patterns measured are different in both conditions. Those differences depend on the LET values of heavy ions and devices under test. Thus, effective LET method should be used carefully in ground-based testing of single event effects （SEE） sensitivity, especially in MBU-sensitive devices.
基金Supported by National Natural Science Foundation of China(Nos.11179003,10975164,61204112 and 61204116)China Postdoctoral Science Foundation(No.2014M552170)
文摘Experimental evidence is presented showing obvious azimuthal dependence of single event upsets(SEU) and multiple-bit upset(MBU) patterns in radiation hardened by design(RHBD) and MBU-sensitive static random access memories(SRAMs), due to the anisotropic device layouts. Depending on the test devices, a discrepancy from 24.5% to 50% in the SEU cross sections of dual interlock cell(DICE) SRAMs is shown between two perpendicular ion azimuths under the same tilt angle. Significant angular dependence of the SEU data in this kind of design is also observed, which does not fit the inverse-cosine law in the effective LET method. Ion trajectory-oriented MBU patterns are identified, which is also affected by the topological distribution of sensitive volumes. Due to that the sensitive volumes are periodically isolated by the BL/BLB contacts along the Y-axis direction, double-bit upsets along the X-axis become the predominant configuration under normal incidence.Predominant triple-bit upset and quadruple-bit upset patterns are the same under different ion azimuths(Lshaped and square-shaped configurations, respectively). Those results suggest that traditional RPP/IRPP model should be promoted to consider the azimuthal and angular dependence of single event effects in certain designs.During earth-based evaluation of SEE sensitivity, worst case beam direction, i.e., the worst case response, should be revealed to avoid underestimation of the on-orbit error rate.
基金supported by the National Key Laboratory of Materials Behavior and Evaluation Technology in Space Environment(No.6142910220208)National Natural Science Foundation of China(Nos.12105341 and 12035019)the opening fund of Key Laboratory of Silicon Device and Technology,Chinese Academy of Sciences(No.KLSDTJJ2022-3).
文摘This paper explores the impact of back-gate bias (V_(soi)) and supply voltage (V_(DD)) on the single-event upset (SEU) cross section of 0.18μm configurable silicon-on-insulator static random-access memory (SRAM) under high linear energy transfer heavyion experimentation.The experimental findings demonstrate that applying a negative back-gate bias to NMOS and a positive back-gate bias to PMOS enhances the SEU resistance of SRAM.Specifically,as the back-gate bias for N-type transistors(V_(nsoi)) decreases from 0 to-10 V,the SEU cross section decreases by 93.23%,whereas an increase in the back-gate bias for P-type transistors (V_(psoi)) from 0 to 10 V correlates with an 83.7%reduction in SEU cross section.Furthermore,a significant increase in the SEU cross section was observed with increase in supply voltage,as evidenced by a 159%surge at V_(DD)=1.98 V compared with the nominal voltage of 1.8 V.To explore the physical mechanisms underlying these experimental data,we analyzed the dependence of the critical charge of the circuit and the collected charge on the bias voltage by simulating SEUs using technology computer-aided design.
基金Projects(51074106,51374145)supported by the National Natural Science Foundation of ChinaProject(09JC1408200)supported by the Science and Technology Commission of Shanghai Municipality,China+1 种基金Project(2014M561466)supported by China Postdoctoral Science FoundationProject(14R21411000)supported by Shanghai Postdoctoral Scientific Program,China
文摘AZ31-4.6% Mg2Si （mass fraction） composite was prepared by conventional casting method. Repetitive upsetting （RU） was applied to severely deforming the as-cast composite at 400 ℃ for 1, 3, and 5 passes. Finite element analysis of the material flow indicates that deformation concentrates in the bottom region of the sample after 1 pass, and much more uniform deformation is obtained after 5 passes. During multi-pass RU process, both dendritic and Chinese script type Mg2Si phases are broken up into smaller particles owing to the shear stress forced by the matrix. With the increasing number of RU passes, finer grain size and more homogeneous distribution of Mg2Si particles are obtained along with significant enhancement in both strength and ductility. AZ31-4.6%Mg2Si composite exhibits tensile strength of 284 MPa and elongation of 9.8%after 5 RU passes at 400 ℃ compared with the initial 128 MPa and 5.4%of original AZ31-4.6%Mg2Si composite.
文摘We study the problem of multiple node upset （MNU） using three-dimensional device simulation. The results show the transient floating node and charge lateral diffusion are the key reasons for MNU. We compare the MNU with multiple bit upset （MBU）,and find that their characteristics are different. Methods to avoid MNU are also discussed.
