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STUDY OF FAILURE MODES OF MICROELECTRONIC PACKAGING MODULES BY HOLOGRAPHY QUASI PROJECTION MOIRE METHOD 被引量:1
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作者 史训清 刘宝琛 戴福隆 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 1997年第2期179-185,共7页
In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method and the ... In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method and the holographic interferometry method. This technique is used to study the failure modes of microelectronic packaging modules. 展开更多
关键词 HOLOGRAPHY quasi projection moire sensitivity failure modes packaging modules
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