In this paper a new algorithm for image magnification is presented. Because linear magnification/interpolation techniques diminish the contrast and produce sawtooth effects, in recent years, many nonlinear interpolati...In this paper a new algorithm for image magnification is presented. Because linear magnification/interpolation techniques diminish the contrast and produce sawtooth effects, in recent years, many nonlinear interpolation methods, especially nonlinear diffusion based approaches, have been proposed to solve these problems. Two recently proposed techniques for interpolation by diffusion, forward and backward diffusion (FAB) and level-set reconstruction (LSR), cannot enhance the contrast and smooth edges simultaneously. In this article, a novel Partial Differential Equations (PDE) based approach is presented. The contributions of the paper include: firstly, a unified form of diffusion joining FAB and LSR is constructed to have all of their virtues; secondly, to eliminate artifacts of the joint diffusion, soft constraint takes the place of hard constraint presented by LSR; thirdly, the determination of joint coefficients, criterion for stopping time and color image processing are also discussed. The results demonstrate that the method is visually and quantitatively better than Bicubic, FAB and LSR.展开更多
Micro-structure related behavior of diffusion bonding joints is a crucial issue in device and reactor fabrication of Micro Chemo Mechanical Systems.However,the previous studies have been focused on the macro mechanica...Micro-structure related behavior of diffusion bonding joints is a crucial issue in device and reactor fabrication of Micro Chemo Mechanical Systems.However,the previous studies have been focused on the macro mechanical performance of diffusion bonded joint,especially diffusion bonding conditions effects on tensile strength,shearing strength and fatigue strength.The research of interfacial micro-voids and microstructures evolution for failure mechanism has not been carried out for diffusion-bonded joints.An interfacial electrical resistance measuring method is proposed to evaluate the quality of bonded joints and verified by using two-dimensional finite-element simulation.The influences of micro void geometry on increments of resistance are analyzed and the relationship between bonded area fraction and resistance increment is established by theoretical analysis combined with simulated results.Metallographic inspections and micro-hardness testing are conducted near the interface of diffusion bonded joints.For the purpose of identifying the failure mechanisms of the joints,both microscopic tensile and fatigue tests are conducted on the self-developed in-situ microscopic fatigue testing system.Based on the microscopic observations,the mechanism of interfacial failure is addressed.The observation result shows that for 316LSS diffusion-bonded joints,microstructure evolution and effect of micro-voids play a key role in interfacial failure mechanism.Finally,a new life prediction model in terms of the increment of electrical resistance is developed and confirmed by the experimental results.The proposed study is initiated that constituted a primary interfacial failure mechanism on micron scale and provide the life prediction for reliability of components sealed by diffusion bonding.展开更多
The microstructure,diffusional and mechanical bonding behavior and microhardness distribution of laminated composites fabricated by ECAP process were investigated.Al?Cu and Cu?Ni laminated composites were produced by ...The microstructure,diffusional and mechanical bonding behavior and microhardness distribution of laminated composites fabricated by ECAP process were investigated.Al?Cu and Cu?Ni laminated composites were produced by ECAP process up to4passes at room temperature and high temperature(300°C).The results of microstructure characterization by SEM and shear strength test revealed that the joints between the layers of4-pass ECAPed samples were considerably stronger than those of1-pass ECAPed samples due to tolerating higher values of plastic deformations during ECAP.Furthermore,shear strength data showed that increasing ECAP temperature caused a notable increase in shear strength of the specimens.The reason lies in the formation of diffusional joint between the interface of both Al/Cu and Cu/Ni layers at high temperature.The shear bonding strength of ECAPed Cu/Ni/Cu composite at high temperature was remarkably higher than that of ECAPed Cu/Al/Cu composite.展开更多
文摘In this paper a new algorithm for image magnification is presented. Because linear magnification/interpolation techniques diminish the contrast and produce sawtooth effects, in recent years, many nonlinear interpolation methods, especially nonlinear diffusion based approaches, have been proposed to solve these problems. Two recently proposed techniques for interpolation by diffusion, forward and backward diffusion (FAB) and level-set reconstruction (LSR), cannot enhance the contrast and smooth edges simultaneously. In this article, a novel Partial Differential Equations (PDE) based approach is presented. The contributions of the paper include: firstly, a unified form of diffusion joining FAB and LSR is constructed to have all of their virtues; secondly, to eliminate artifacts of the joint diffusion, soft constraint takes the place of hard constraint presented by LSR; thirdly, the determination of joint coefficients, criterion for stopping time and color image processing are also discussed. The results demonstrate that the method is visually and quantitatively better than Bicubic, FAB and LSR.
基金supported by National Natural Science Foundation of China(Grant No.50475068)
文摘Micro-structure related behavior of diffusion bonding joints is a crucial issue in device and reactor fabrication of Micro Chemo Mechanical Systems.However,the previous studies have been focused on the macro mechanical performance of diffusion bonded joint,especially diffusion bonding conditions effects on tensile strength,shearing strength and fatigue strength.The research of interfacial micro-voids and microstructures evolution for failure mechanism has not been carried out for diffusion-bonded joints.An interfacial electrical resistance measuring method is proposed to evaluate the quality of bonded joints and verified by using two-dimensional finite-element simulation.The influences of micro void geometry on increments of resistance are analyzed and the relationship between bonded area fraction and resistance increment is established by theoretical analysis combined with simulated results.Metallographic inspections and micro-hardness testing are conducted near the interface of diffusion bonded joints.For the purpose of identifying the failure mechanisms of the joints,both microscopic tensile and fatigue tests are conducted on the self-developed in-situ microscopic fatigue testing system.Based on the microscopic observations,the mechanism of interfacial failure is addressed.The observation result shows that for 316LSS diffusion-bonded joints,microstructure evolution and effect of micro-voids play a key role in interfacial failure mechanism.Finally,a new life prediction model in terms of the increment of electrical resistance is developed and confirmed by the experimental results.The proposed study is initiated that constituted a primary interfacial failure mechanism on micron scale and provide the life prediction for reliability of components sealed by diffusion bonding.
文摘The microstructure,diffusional and mechanical bonding behavior and microhardness distribution of laminated composites fabricated by ECAP process were investigated.Al?Cu and Cu?Ni laminated composites were produced by ECAP process up to4passes at room temperature and high temperature(300°C).The results of microstructure characterization by SEM and shear strength test revealed that the joints between the layers of4-pass ECAPed samples were considerably stronger than those of1-pass ECAPed samples due to tolerating higher values of plastic deformations during ECAP.Furthermore,shear strength data showed that increasing ECAP temperature caused a notable increase in shear strength of the specimens.The reason lies in the formation of diffusional joint between the interface of both Al/Cu and Cu/Ni layers at high temperature.The shear bonding strength of ECAPed Cu/Ni/Cu composite at high temperature was remarkably higher than that of ECAPed Cu/Al/Cu composite.
