Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electroni...Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electronics,posing a major obstacle to the integra-tion of electronics.The innovation of integrating 3D-printed conformal shielding(c-SE)modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE func-tion without occupying additional space.Herein,the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity.Accordingly,the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing.In particular,the SE performance of 3D-printed frame is up to 61.4 dB,simultaneously accompanied with an ultralight architecture of 0.076 g cm^(-3) and a superhigh specific shielding of 802.4 dB cm3 g^(-1).Moreover,as a proof-of-concept,the 3D-printed c-SE module is in situ integrated into core electronics,successfully replacing the traditional metal-based module to afford multiple functions for electromagnetic compatibility and thermal dissipa-tion.Thus,this scientific innovation completely makes up the blank for assembling carbon-based c-SE modules and sheds a brilliant light on developing the next generation of high-performance shielding materials with arbitrarily-customized structure for integrated electronics.展开更多
Self-powered microelectronics are essential for the sustained and autonomous operations of wireless electronics and microrobots.However,they are challenged by integratable microenergy supplies.Herein,we report a singl...Self-powered microelectronics are essential for the sustained and autonomous operations of wireless electronics and microrobots.However,they are challenged by integratable microenergy supplies.Herein,we report a single-layer(SL)MoS_(2)/graphene heterostructure for stable Zn-ion microbatteries.The MoS_(2)/graphene heterostructure not only provides high chemical affinity for Zn and generates perfect lattice matching for Zn(002)deposition,but also facilitates homogeneous current density distribution.As a result,Zn metal is reversibly epitaxially plating/stripping at/from the heterostructure,without the formation of dendrites.The MoS_(2)/graphene-based Zn||MnO2 microbattery with a tiny footprint area sub-0.1 mm2 shows a stable high capacity of 0.16 mAh cm-^(2)at 0.5 mA cm-^(2)within 470 cycles.Using a single piece of crystalline MoS_(2)/graphene film,on-chip microbatteries and transistors were simultaneously fabricated via a facile lithography process,achieving highly integrated self-powered field-effect transistors and photodetector.The SL MoS_(2)/graphene-based self-powered monolithically integrated microsystem paves a new way for the multi-functionalization and miniaturization of next-generation electronics.展开更多
High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-...High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.展开更多
Additive manufacturing(AM)is a free-form technology that shows great potential in the integrated creation of three-dimensional(3D)electronics.However,the fabrication of 3D conformal circuits that fulfill the requireme...Additive manufacturing(AM)is a free-form technology that shows great potential in the integrated creation of three-dimensional(3D)electronics.However,the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature,high conductivity and high resolution remains a challenge.In this paper,a hybrid AM method combining the fused deposition modeling(FDM)and hydrophobic treatment assisted laser activation metallization(LAM)was proposed for manufacturing the polyetheretherketone(PEEK)-based 3D electronics,by which the conformal copper patterns were deposited on the 3D-printed PEEK parts,and the adhesion between them reached the 5B high level.Moreover,the 3D components could support the thermal cycling test from-55℃ to 125℃ for more than 100 cycles.Particularly,the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface,not affected by the inevitable printing borders and pores in the FDM-printed parts,then making the resolution of the electroless plated copper lines improved significantly.In consequence,Cu lines with width and spacing of only60μm and 100μm were obtained on both as-printed and after-polished PEEK substrates.Finally,the potential of this technique to fabricate 3D conformal electronics was demonstrated.展开更多
Dear Editor： There is accumulating evidence that human blood electronic circuit components and their application circuits become more and more important to cyborg implant/engineering, man-machine interface, hu- man ...Dear Editor： There is accumulating evidence that human blood electronic circuit components and their application circuits become more and more important to cyborg implant/engineering, man-machine interface, hu- man disease detection and healing, and artificial brain evolutionusl. Here, we report the first development of human plasma-based amplifier circuit in the dis- crete as well as integrated circuit （IC） configuration mode. Electrolytes in the human blood contain an enormous number of charge carriers such as positive and negative molecule/atom ions, which are electri- cally conducting media and therefore can be utilized for developing electronic circuit components and their application circuits. These electronic circuits obvi- ously have very high application impact potential towards bio-medical engineering and medical science and technology.展开更多
Combining with the development of automated manual transmission （AMT）, the various throttle control demands are analyzed under different working conditions of AMT such as tracking acceleration pedal, start, shift an...Combining with the development of automated manual transmission （AMT）, the various throttle control demands are analyzed under different working conditions of AMT such as tracking acceleration pedal, start, shift and so on. Based on simulation, the responding throttle control strategies are proposed, and a simple but effective throttle control method is presented. The testing results have proved that the strategies are effective for improving the pedal tracking precision and the qualities of start and shift.展开更多
Integration can diversify the function of a device with the same volume, therefore it facilitates the development of portable, wearable and flexible electronics. In this review, we described several kinds of novel and...Integration can diversify the function of a device with the same volume, therefore it facilitates the development of portable, wearable and flexible electronics. In this review, we described several kinds of novel and unconventional multifunctional integrated supercapacitors which can not only be used to storage energy but also be applied to other fields such as photodetecting, electrochromics, monitoring physiological/mechanical activities, gas sensor, and so on. First, a brief introduction of the significance and advantages of multifunctional integrated supercapacitors was presented. Then we outlined the enormous progress which has been made in the area of multifunctional integrated supercapacitors. In the end, the prospects and further developments in this exciting field were also suggested.展开更多
The rapid rise of artificial intelligence(AI)-integrated electronics,has created an urgent demand for microscale energy storage systems that are not only compact but also capable of intelligent interaction,rapid respo...The rapid rise of artificial intelligence(AI)-integrated electronics,has created an urgent demand for microscale energy storage systems that are not only compact but also capable of intelligent interaction,rapid responsiveness,and seamless system-level integration.Traditional power sources struggle to meet the stringent requirements of miniaturized and multifunctional electronics,where device footprints shrink to the sub-centimeter or even millimeter scale while functionality expands toward adaptive sensing,and wireless communication.展开更多
Compound eyes(CEs)that feature ultra-compact structures and extraordinary versatility have revealed great potential for cutting-edge applications.However,the optoelectronic integration of CEs with available photodetec...Compound eyes(CEs)that feature ultra-compact structures and extraordinary versatility have revealed great potential for cutting-edge applications.However,the optoelectronic integration of CEs with available photodetectors is still challenging because the planar charge-coupled device(CCD)/complementary metal oxide semiconductor(CMOS)detector cannot match the spatially distributed images formed by CE ommatidia.To reach this end,we report here the optoelectronic integration of CEs by manufacturing 3D nonuniform ommatidia for developing an ultra-compact on-chip camera.As a proof-of-concept,we fabricated microscale CEs with uniform and nonuniform ommatidia through femtosecond laser two-photon photopolymerization,and compared their focusing/imaging performance both theoretically and experimentally.By engineering the surface profiles of the ommatidia at different positions of the CE,the images formed by all the ommatidia can be tuned on a plane.In this way,the nonuniform CE can be directly integrated with a commercial CMOS photodetector,forming an ultra-compact CE camera.Additionally,we further combine the CE camera with a microfluidic chip,which can further serve as an on-chip microscopic monitoring system.We anticipate that such an ultra-compact CE camera may find broad applications in microfluidics,robotics,and micro-optics.展开更多
Fiber-shaped supercapacitors(FSSCs)show great potential in portable and wearable electronics due to their unique advantages of high safety,environmental friendliness,high performances,outstanding flexibility and integ...Fiber-shaped supercapacitors(FSSCs)show great potential in portable and wearable electronics due to their unique advantages of high safety,environmental friendliness,high performances,outstanding flexibility and integrability.They can directly act as the power sources or be easily integrated with other flexible devices to constitute self-powered and sustainable energy suppliers,providing excellent adaptability to irregular surfaces.This review mainly summarizes the recently reported works of FSSCs including preparation methods of various fiber electrodes,construction strategies of FSSCs and multi-functional device integrations,exploration of reaction mechanisms and strategies to improve the electrochemical performance and provision of suggestions on further designing and optimization of FSSCs.Meanwhile,it shares our perspectives on challenges and opportunities in this field,shedding light on the development of high-performance fiber-shaped supercapacitors with multifunctions.展开更多
In recent decades,silicon photonics has attracted much attention in telecom and data-com areas.Constituted of high refractive-index contrast waveguides on silicon-on-insulator(SOI),a variety of integrated photonic pas...In recent decades,silicon photonics has attracted much attention in telecom and data-com areas.Constituted of high refractive-index contrast waveguides on silicon-on-insulator(SOI),a variety of integrated photonic passive and active devices have been implemented supported by excellent optical properties of silicon in the mid-infrared spectrum.The main advantage of the silicon photonics is the ability to use complementary metal oxide semiconductor(CMOS)process-compatible fabrication technologies,resulting in high-volume production at low cost.On the other hand,explosively growing traffic in the telecom,data center and high-performance computer demands the data flow to have high speed,wide bandwidth,low cost,and high energy-efficiency,as well as the photonics and electronics to be integrated for ultra-fast data transfer in networks.In practical applications,silicon photonics started with optical interconnect transceivers in the data-com first,and has been now extended to innovative applications such as multi-port optical switches in the telecom network node and integrated optical phased arrays(OPAs)in light detection and ranging(LiDAR).This paper overviews the progresses of silicon photonics from four points reflecting the recent advances mentioned above.CMOS-based silicon photonic platform technologies,applications to optical transceiver in the data-com network,applications to multi-port optical switches in the telecom network and applications to OPA in LiDAR system.展开更多
The paper aims to research on online mind map as interface of learning resource integration and sharing.We developed a web application that provides a interface to allow users to create a knowledge mind map.With the o...The paper aims to research on online mind map as interface of learning resource integration and sharing.We developed a web application that provides a interface to allow users to create a knowledge mind map.With the online mind mapping tool,the electronic learning resource will be discovered and shared in the form of subject-oriented package,it is more flexibly than the other E-Learning systems,and the interaction and cooperation of the users are strengthened to some extent.展开更多
In this hard disk record system,the IDE hard disk is controlled by FPGA(Field Programmable Gate Array),and the image is recorded to file format directly.In the same time,the recorded image is real-time and lossless.Al...In this hard disk record system,the IDE hard disk is controlled by FPGA(Field Programmable Gate Array),and the image is recorded to file format directly.In the same time,the recorded image is real-time and lossless.All of this is convenient for subsequent processing.展开更多
Reconfigurable photonic integrated circuits(PICs)can implement arbitrary operations and signal processing functionalities directly in the optical domain.Run-time configuration of these circuits requires an electronic ...Reconfigurable photonic integrated circuits(PICs)can implement arbitrary operations and signal processing functionalities directly in the optical domain.Run-time configuration of these circuits requires an electronic control layer to adjust the working point of their building elements and compensate for thermal drifts or degradations of the input signal.As the advancement of photonic foundries enables the fabrication of chips of increasing complexity,developing scalable electronic controllers becomes crucial for the operation of complex PICs.In this paper,we present an electronic application-specific integrated circuit(ASIC)designed for reconfiguration of PICs featuring numerous tunable elements.Each channel of the ASIC controller independently addresses one optical component of the PIC,and multiple parallel local feedback loops are operated to achieve full control.The proposed design is validated through real-time reconfiguration of a 16-channel silicon photonics adaptive universal beam coupler.Results demonstrate automatic coupling of an arbitrary input beam to a single-mode waveguide,dynamic compensation of beam wavefront distortions and successful transmission of a 50 Gbit/s signal through an optical free-space link.The low power consumption and compactness of the electronic chip provide a scalable paradigm that can be seamlessly extended to larger photonic architectures.展开更多
Stretchable and flexible electronics represent emerging and exciting directions for future electronics,while transfer printing plays an essential and mainstream role in integrating electronics onto application substra...Stretchable and flexible electronics represent emerging and exciting directions for future electronics,while transfer printing plays an essential and mainstream role in integrating electronics onto application substrates.However,existing transfer printing approaches have restrictions for electronics in terms of stiffness and dimensionality,as well as limitations for substrates in terms of surface and adhesion.Here,we report a versatile soap bubble transfer printing technique that,through a volume modulation strategy,enables the adhesion-independent,damage-free,and lowcontamination integration of rigid,flexible,and three-dimensional curved electronics onto substrates with complex surfaces and challenging adhesion.To demonstrate the versatility and compatibility of the soap bubble transfer printing technique,we performed not only special behaviors such as wraplike,multilayer,selective,and interior printing,but also integrated flexible electronics onto various human organ models,which holds promise for health monitoring in both noninvasive and invasive manners.展开更多
Separation and capture technology for small molecules is of great significance,including for the goal of adsorbing and separating CO2.Accurately controlling the pore size to achieve separation of molecules with simila...Separation and capture technology for small molecules is of great significance,including for the goal of adsorbing and separating CO2.Accurately controlling the pore size to achieve separation of molecules with similar sizes remains a challenging task in rigid porous materials,such as inorganic zeolites.We propose precise pore size engineering of“larger pore”faujasite(FAU)zeolite by depositing carbon atoms inside its framework.Low-dose electron microscopy with high spatial resolution is used to visualize the carbon deposition process and the corresponding evolution of pore size.Pore size changes as a function of carbon deposition time are also studied by gas adsorption using N_(2).The carbon-modulated FAU samples with optimized pore sizes exhibit excellent gas separation of CO_(2) relative to other small molecules.For a 50/50 H_(2)/CO_(2) mixture,the separation factor was increased by 31%with a breakthrough time difference over 1200 s/g as compared to the neat FAU.We thus tailor the gas adsorption of FAU through partial filling of pores with deposited carbon and note that this can be generalized for the pore size engineering of many porous materials for use in industrial gas separation applications.展开更多
基金This work is financially supported by the National Natural Science Foundation of China(52303036)the Natural Science Foundation of Guangxi Province(2020GXNSFAA297028)+4 种基金the Guangxi Science and Technology Base and Talent Special Project(GUIKE AD23026179)the International Science&Technology Cooperation Project of Chengdu(2021-GH03-00009-HZ)the Program of Innovative Research Team for Young Scientists of Sichuan Province(22CXTD0019)the Natural Science Foundation of Sichuan Province(2023NSFSC0986)the Opening Project of State Key Laboratory of Polymer Materials Engineering(Sichuan University)(Sklpme2023-3-18).
文摘Electromagnetic interference shielding(EMI SE)modules are the core com-ponent of modern electronics.However,the tra-ditional metal-based SE modules always take up indispensable three-dimensional space inside electronics,posing a major obstacle to the integra-tion of electronics.The innovation of integrating 3D-printed conformal shielding(c-SE)modules with packaging materials onto core electronics offers infinite possibilities to satisfy ideal SE func-tion without occupying additional space.Herein,the 3D printable carbon-based inks with various proportions of graphene and carbon nanotube nanoparticles are well-formulated by manipulating their rheological peculiarity.Accordingly,the free-constructed architectures with arbitrarily-customized structure and multifunctionality are created via 3D printing.In particular,the SE performance of 3D-printed frame is up to 61.4 dB,simultaneously accompanied with an ultralight architecture of 0.076 g cm^(-3) and a superhigh specific shielding of 802.4 dB cm3 g^(-1).Moreover,as a proof-of-concept,the 3D-printed c-SE module is in situ integrated into core electronics,successfully replacing the traditional metal-based module to afford multiple functions for electromagnetic compatibility and thermal dissipa-tion.Thus,this scientific innovation completely makes up the blank for assembling carbon-based c-SE modules and sheds a brilliant light on developing the next generation of high-performance shielding materials with arbitrarily-customized structure for integrated electronics.
基金supported by the National Key Research and Development Program(2022YFE0121000)the Fundamental Research Funds for the Central Universities,the Innovation Foundation for Doctor Dissertation of Northwestern Polytechnical University(CX2021042)+2 种基金the National Natural Science Foundation of China(62288102)the Natural Science Foundation of Shaanxi(5110210130),the Key Research and Development Program of Shaanxi(5140220004)the Fundamental Research Funds for the Central Universities(G2022WD01007 and D5000230125).
文摘Self-powered microelectronics are essential for the sustained and autonomous operations of wireless electronics and microrobots.However,they are challenged by integratable microenergy supplies.Herein,we report a single-layer(SL)MoS_(2)/graphene heterostructure for stable Zn-ion microbatteries.The MoS_(2)/graphene heterostructure not only provides high chemical affinity for Zn and generates perfect lattice matching for Zn(002)deposition,but also facilitates homogeneous current density distribution.As a result,Zn metal is reversibly epitaxially plating/stripping at/from the heterostructure,without the formation of dendrites.The MoS_(2)/graphene-based Zn||MnO2 microbattery with a tiny footprint area sub-0.1 mm2 shows a stable high capacity of 0.16 mAh cm-^(2)at 0.5 mA cm-^(2)within 470 cycles.Using a single piece of crystalline MoS_(2)/graphene film,on-chip microbatteries and transistors were simultaneously fabricated via a facile lithography process,achieving highly integrated self-powered field-effect transistors and photodetector.The SL MoS_(2)/graphene-based self-powered monolithically integrated microsystem paves a new way for the multi-functionalization and miniaturization of next-generation electronics.
基金Fok Ying Tung Education Foundation(No.91058)the Natural Science Foundation of High Education Institutions of Jiangsu Province(No.08KJD470004)Qing Lan Project of Jiangsu Province of 2008
文摘High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.
基金supported by the National Natural Science Foundation of China(Grant No.51901082)the National Postdoctoral Program for Innovative Talents(BX20200137)the National Defense Basic Scientific Research Program of China(JCKY2018110C060)。
文摘Additive manufacturing(AM)is a free-form technology that shows great potential in the integrated creation of three-dimensional(3D)electronics.However,the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature,high conductivity and high resolution remains a challenge.In this paper,a hybrid AM method combining the fused deposition modeling(FDM)and hydrophobic treatment assisted laser activation metallization(LAM)was proposed for manufacturing the polyetheretherketone(PEEK)-based 3D electronics,by which the conformal copper patterns were deposited on the 3D-printed PEEK parts,and the adhesion between them reached the 5B high level.Moreover,the 3D components could support the thermal cycling test from-55℃ to 125℃ for more than 100 cycles.Particularly,the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface,not affected by the inevitable printing borders and pores in the FDM-printed parts,then making the resolution of the electroless plated copper lines improved significantly.In consequence,Cu lines with width and spacing of only60μm and 100μm were obtained on both as-printed and after-polished PEEK substrates.Finally,the potential of this technique to fabricate 3D conformal electronics was demonstrated.
文摘Dear Editor： There is accumulating evidence that human blood electronic circuit components and their application circuits become more and more important to cyborg implant/engineering, man-machine interface, hu- man disease detection and healing, and artificial brain evolutionusl. Here, we report the first development of human plasma-based amplifier circuit in the dis- crete as well as integrated circuit （IC） configuration mode. Electrolytes in the human blood contain an enormous number of charge carriers such as positive and negative molecule/atom ions, which are electri- cally conducting media and therefore can be utilized for developing electronic circuit components and their application circuits. These electronic circuits obvi- ously have very high application impact potential towards bio-medical engineering and medical science and technology.
基金This project is supported by Provincial Open Foundation of Key Lab forAutomobile of Jiangsu, China (No.KJS02076) and 985 Project of AutomotiveEngineering Innovation Platform of Jilin University, China.
文摘Combining with the development of automated manual transmission （AMT）, the various throttle control demands are analyzed under different working conditions of AMT such as tracking acceleration pedal, start, shift and so on. Based on simulation, the responding throttle control strategies are proposed, and a simple but effective throttle control method is presented. The testing results have proved that the strategies are effective for improving the pedal tracking precision and the qualities of start and shift.
基金financial support of the National Natural Science Foundation of China(No.51502009)the Key Laboratory of Jiangxi Province for Persistent Pollutants Control and Resources Recycle(No.ST201522008)
文摘Integration can diversify the function of a device with the same volume, therefore it facilitates the development of portable, wearable and flexible electronics. In this review, we described several kinds of novel and unconventional multifunctional integrated supercapacitors which can not only be used to storage energy but also be applied to other fields such as photodetecting, electrochromics, monitoring physiological/mechanical activities, gas sensor, and so on. First, a brief introduction of the significance and advantages of multifunctional integrated supercapacitors was presented. Then we outlined the enormous progress which has been made in the area of multifunctional integrated supercapacitors. In the end, the prospects and further developments in this exciting field were also suggested.
基金financially supported by the National Natural Science Foundation of China(grants 22479128,22125903,and 22439003)the National Key R&D Program of China(grant 2022YFA1504100)+3 种基金the United Foundation for Dalian Institute of Chemical Physics,Chinese Academy of Sciences,and Shenyang Institute of Automation,Chinese Academy of Sciences(DICP&SIA UN202501)the State Key Laboratory of Catalysis(no.2024SKL-A-001)the Energy Revolution S&T Program of Yulin Innovation Institute of Clean Energy(grant E412010508)the China National Postdoctoral Program for Innovative Talents(BX20240334).
文摘The rapid rise of artificial intelligence(AI)-integrated electronics,has created an urgent demand for microscale energy storage systems that are not only compact but also capable of intelligent interaction,rapid responsiveness,and seamless system-level integration.Traditional power sources struggle to meet the stringent requirements of miniaturized and multifunctional electronics,where device footprints shrink to the sub-centimeter or even millimeter scale while functionality expands toward adaptive sensing,and wireless communication.
基金financial supports from Natural Science Foundation of China(Grant No.61935008,T2325014,62205174 and 62275100)。
文摘Compound eyes(CEs)that feature ultra-compact structures and extraordinary versatility have revealed great potential for cutting-edge applications.However,the optoelectronic integration of CEs with available photodetectors is still challenging because the planar charge-coupled device(CCD)/complementary metal oxide semiconductor(CMOS)detector cannot match the spatially distributed images formed by CE ommatidia.To reach this end,we report here the optoelectronic integration of CEs by manufacturing 3D nonuniform ommatidia for developing an ultra-compact on-chip camera.As a proof-of-concept,we fabricated microscale CEs with uniform and nonuniform ommatidia through femtosecond laser two-photon photopolymerization,and compared their focusing/imaging performance both theoretically and experimentally.By engineering the surface profiles of the ommatidia at different positions of the CE,the images formed by all the ommatidia can be tuned on a plane.In this way,the nonuniform CE can be directly integrated with a commercial CMOS photodetector,forming an ultra-compact CE camera.Additionally,we further combine the CE camera with a microfluidic chip,which can further serve as an on-chip microscopic monitoring system.We anticipate that such an ultra-compact CE camera may find broad applications in microfluidics,robotics,and micro-optics.
基金upported by the National Natural Science Foundation of China(No.21875226)the Science Fund for Distinguished Young Scholars of Sichuan Province(No.2017JQ0036)the Chengdu Rongpiao Talent plan,the Sichuan'Ten-thousand Talents Program",the"QianYingBaiTuan"Plan of China Mianyang Science City,the Science Foundation of Institute of Chemical Materials(No.O11100301)the"Global Experts Recruitment"program.
文摘Fiber-shaped supercapacitors(FSSCs)show great potential in portable and wearable electronics due to their unique advantages of high safety,environmental friendliness,high performances,outstanding flexibility and integrability.They can directly act as the power sources or be easily integrated with other flexible devices to constitute self-powered and sustainable energy suppliers,providing excellent adaptability to irregular surfaces.This review mainly summarizes the recently reported works of FSSCs including preparation methods of various fiber electrodes,construction strategies of FSSCs and multi-functional device integrations,exploration of reaction mechanisms and strategies to improve the electrochemical performance and provision of suggestions on further designing and optimization of FSSCs.Meanwhile,it shares our perspectives on challenges and opportunities in this field,shedding light on the development of high-performance fiber-shaped supercapacitors with multifunctions.
文摘In recent decades,silicon photonics has attracted much attention in telecom and data-com areas.Constituted of high refractive-index contrast waveguides on silicon-on-insulator(SOI),a variety of integrated photonic passive and active devices have been implemented supported by excellent optical properties of silicon in the mid-infrared spectrum.The main advantage of the silicon photonics is the ability to use complementary metal oxide semiconductor(CMOS)process-compatible fabrication technologies,resulting in high-volume production at low cost.On the other hand,explosively growing traffic in the telecom,data center and high-performance computer demands the data flow to have high speed,wide bandwidth,low cost,and high energy-efficiency,as well as the photonics and electronics to be integrated for ultra-fast data transfer in networks.In practical applications,silicon photonics started with optical interconnect transceivers in the data-com first,and has been now extended to innovative applications such as multi-port optical switches in the telecom network node and integrated optical phased arrays(OPAs)in light detection and ranging(LiDAR).This paper overviews the progresses of silicon photonics from four points reflecting the recent advances mentioned above.CMOS-based silicon photonic platform technologies,applications to optical transceiver in the data-com network,applications to multi-port optical switches in the telecom network and applications to OPA in LiDAR system.
基金the Innovation Program of Shanghai Municipal Education Commission(No.12ZZ060)the National Textile and Apparel Council Project of China(No.2011-10255-7)
文摘The paper aims to research on online mind map as interface of learning resource integration and sharing.We developed a web application that provides a interface to allow users to create a knowledge mind map.With the online mind mapping tool,the electronic learning resource will be discovered and shared in the form of subject-oriented package,it is more flexibly than the other E-Learning systems,and the interaction and cooperation of the users are strengthened to some extent.
文摘In this hard disk record system,the IDE hard disk is controlled by FPGA(Field Programmable Gate Array),and the image is recorded to file format directly.In the same time,the recorded image is real-time and lossless.All of this is convenient for subsequent processing.
基金supported by the Italian National Recovery and Resilience Plan(NRRP)of Nex tGeneration EU,partnership on“Telecommunications of the Future”(Program“RESTART”,Structural Project“Rigoletto,”and Focused Project“HePIC”)under Grant PE00000001.We thank Polifab,the nanofabrication facility of Politecnico di Milano,for dicing and wire-bonding the chips.
文摘Reconfigurable photonic integrated circuits(PICs)can implement arbitrary operations and signal processing functionalities directly in the optical domain.Run-time configuration of these circuits requires an electronic control layer to adjust the working point of their building elements and compensate for thermal drifts or degradations of the input signal.As the advancement of photonic foundries enables the fabrication of chips of increasing complexity,developing scalable electronic controllers becomes crucial for the operation of complex PICs.In this paper,we present an electronic application-specific integrated circuit(ASIC)designed for reconfiguration of PICs featuring numerous tunable elements.Each channel of the ASIC controller independently addresses one optical component of the PIC,and multiple parallel local feedback loops are operated to achieve full control.The proposed design is validated through real-time reconfiguration of a 16-channel silicon photonics adaptive universal beam coupler.Results demonstrate automatic coupling of an arbitrary input beam to a single-mode waveguide,dynamic compensation of beam wavefront distortions and successful transmission of a 50 Gbit/s signal through an optical free-space link.The low power consumption and compactness of the electronic chip provide a scalable paradigm that can be seamlessly extended to larger photonic architectures.
基金Supported by the National Science Foundation of USA ( the most recent one being num bered PHY- 970 4 5 2 0 ) and by the U niversities of Missouri and Nebraska ( U SA )
基金supported by the National Natural Science Foundation of China(12272079,12172189,11921002)fundamental research funds for the central universities(DUT21YG213)。
文摘Stretchable and flexible electronics represent emerging and exciting directions for future electronics,while transfer printing plays an essential and mainstream role in integrating electronics onto application substrates.However,existing transfer printing approaches have restrictions for electronics in terms of stiffness and dimensionality,as well as limitations for substrates in terms of surface and adhesion.Here,we report a versatile soap bubble transfer printing technique that,through a volume modulation strategy,enables the adhesion-independent,damage-free,and lowcontamination integration of rigid,flexible,and three-dimensional curved electronics onto substrates with complex surfaces and challenging adhesion.To demonstrate the versatility and compatibility of the soap bubble transfer printing technique,we performed not only special behaviors such as wraplike,multilayer,selective,and interior printing,but also integrated flexible electronics onto various human organ models,which holds promise for health monitoring in both noninvasive and invasive manners.
基金supported by the National Natural Science Foundation of China(Nos.T2322019(B.S.)and 22275133(B.S.))Suzhou Science and Technology Development Plan(No.ZXL2023179(B.S.))+2 种基金Science Foundation of Jiangsu Province(No.BK20220484(B.S.))Suzhou Key Laboratory of Functional Nano&Soft Materials,Collaborative Innovation Center of Suzhou Nano Science&Technologythe 111 Project,Joint International Research Laboratory of Carbon-Based Functional Materials and Devices,and the Institute for Basic Science(IBS-R019-D1)of Republic of Korea.
文摘Separation and capture technology for small molecules is of great significance,including for the goal of adsorbing and separating CO2.Accurately controlling the pore size to achieve separation of molecules with similar sizes remains a challenging task in rigid porous materials,such as inorganic zeolites.We propose precise pore size engineering of“larger pore”faujasite(FAU)zeolite by depositing carbon atoms inside its framework.Low-dose electron microscopy with high spatial resolution is used to visualize the carbon deposition process and the corresponding evolution of pore size.Pore size changes as a function of carbon deposition time are also studied by gas adsorption using N_(2).The carbon-modulated FAU samples with optimized pore sizes exhibit excellent gas separation of CO_(2) relative to other small molecules.For a 50/50 H_(2)/CO_(2) mixture,the separation factor was increased by 31%with a breakthrough time difference over 1200 s/g as compared to the neat FAU.We thus tailor the gas adsorption of FAU through partial filling of pores with deposited carbon and note that this can be generalized for the pore size engineering of many porous materials for use in industrial gas separation applications.
