The International Software Benchmarking and Standards Group (ISBSG) data-base was used to build estimation models for estimating software functional test effort. The analysis of the data revealed three test productivi...The International Software Benchmarking and Standards Group (ISBSG) data-base was used to build estimation models for estimating software functional test effort. The analysis of the data revealed three test productivity patterns representing economies or diseconomies of scale and these patterns served as a basis for investigating the characteristics of the corresponding projects. Three groups of projects related to the three different productivity patterns, characterized by domain, team size, elapsed time and rigor of verification and validation carried out during development, were found to be statistically significant. Within each project group, the variations in test effort can be explained, in addition to functional size, by 1) the processes executed during development, and 2) the processes adopted for testing. Portfolios of estimation models were built using combinations of the three independent variables. Performance of the estimation models built using the function point method innovated by the Common Software Measurement International Consortium (COSMIC) known as COSMIC Function Points, and the one advocated by the International Function Point Users Group (IFPUG) known as IFPUG Function Points, were compared to evaluate the impact of these respective sizing methods on test effort estimation.展开更多
The flat cylindrical indentation tests with different sizes of punch radius were investigated using finite element method （FEM） aimed to reveal the effect of punch size on the indentation behavior of the film/substr...The flat cylindrical indentation tests with different sizes of punch radius were investigated using finite element method （FEM） aimed to reveal the effect of punch size on the indentation behavior of the film/substrate system. Based on the FEM results analysis, two methods was proposed to separate film＇s reduced Young＇s modulus from a film/substrate system. The first method was based on a new weight function that quantifies film＇s and substrate＇s contributions to the overall mechanical properties of the film/substrate system in the flat cylindrical indentation test. The second method, a numerical approach, including fitting and extrapolation procedures was put forward. Both of the results from the two methods showed a reasonable agreement with the one input FE model. At last, the effect of maximum indentation depth and the surface micro-roughness of the thin film on the reduced Young＇s modulus of the film/substrate system were discussed. The methods proposed in the present study provide some new conceptions on evaluating other properties of thin films, e.g. creep, for which a flat-ended punch is also employed.展开更多
文摘The International Software Benchmarking and Standards Group (ISBSG) data-base was used to build estimation models for estimating software functional test effort. The analysis of the data revealed three test productivity patterns representing economies or diseconomies of scale and these patterns served as a basis for investigating the characteristics of the corresponding projects. Three groups of projects related to the three different productivity patterns, characterized by domain, team size, elapsed time and rigor of verification and validation carried out during development, were found to be statistically significant. Within each project group, the variations in test effort can be explained, in addition to functional size, by 1) the processes executed during development, and 2) the processes adopted for testing. Portfolios of estimation models were built using combinations of the three independent variables. Performance of the estimation models built using the function point method innovated by the Common Software Measurement International Consortium (COSMIC) known as COSMIC Function Points, and the one advocated by the International Function Point Users Group (IFPUG) known as IFPUG Function Points, were compared to evaluate the impact of these respective sizing methods on test effort estimation.
基金supports from National Natural Science Foundation of China (Nos.50775183 and 50805118)Research Fund for Doctoral Programof higher Education (N6CJ0001)National High Technical Research and Development Programme of China (No.2009AA04Z418)
文摘The flat cylindrical indentation tests with different sizes of punch radius were investigated using finite element method （FEM） aimed to reveal the effect of punch size on the indentation behavior of the film/substrate system. Based on the FEM results analysis, two methods was proposed to separate film＇s reduced Young＇s modulus from a film/substrate system. The first method was based on a new weight function that quantifies film＇s and substrate＇s contributions to the overall mechanical properties of the film/substrate system in the flat cylindrical indentation test. The second method, a numerical approach, including fitting and extrapolation procedures was put forward. Both of the results from the two methods showed a reasonable agreement with the one input FE model. At last, the effect of maximum indentation depth and the surface micro-roughness of the thin film on the reduced Young＇s modulus of the film/substrate system were discussed. The methods proposed in the present study provide some new conceptions on evaluating other properties of thin films, e.g. creep, for which a flat-ended punch is also employed.
