Superior strength and high-temperature performance make γ-TiAl vital for lightweight aero-engines. However, its inherent brittleness poses machining problems. This study employed Elliptical Ultrasonic Vibration Milli...Superior strength and high-temperature performance make γ-TiAl vital for lightweight aero-engines. However, its inherent brittleness poses machining problems. This study employed Elliptical Ultrasonic Vibration Milling (EUVM) to address these problems. Considering the influence of machining parameters on vibration patterns of EUVM, a separation time model was established to analyze the vibration evolutionary process, thereby instructing the cutting mechanism. On this basis, deep discussions regarding chip formation, cutting force, edge breakage, and subsurface layer deformation were conducted for EUVM and Conventional Milling (CM). Chip morphology showed the chip formation was rooted in the periodic brittle fracture. Local dimples proved that the thermal effect of high-speed cutting improved the plasticity of γ-TiAl. EUVM achieved a maximum 18.17% reduction in cutting force compared with CM. The force variation mechanism differed with changes in the cutting speed or the vibration amplitude, and its correlation with thermal softening, strain hardening, and vibratory cutting effects was analyzed. EUVM attained desirable edge breakage by achieving smaller fracture lengths. The fracture mechanisms of different phases were distinct, causing a surge in edge fracture size of γ-TiAl under microstructural differences. In terms of subsurface deformation, EUVM also showed strengthening effects. Noteworthy, the lamellar deformation patterns under the cutting removal state differed from the quasi-static, which was categorized by the orientation angles. Additionally, the electron backscattering diffraction provided details of the influence of microstructural difference on the orientation and the deformation of grains in the subsurface layer. The results demonstrate that EUVM is a promising machining method for γ-TiAl and guide further research and development of EUVM γ-TiAl.展开更多
The undeformed chip thickness and grinding force are key parameters for revealing the material removal mechanism in the grinding process.However,they are difficult to be well expressed due to the ununiformed protrusio...The undeformed chip thickness and grinding force are key parameters for revealing the material removal mechanism in the grinding process.However,they are difficult to be well expressed due to the ununiformed protrusion height and random position distribution of abrasive grains on the abrasive wheel surface.This study investigated the distribution of undeformed chip thickness and grinding force considering the non-uniform characteristics of abrasive wheel in the grinding of K4002 nickel-based superalloy.First,a novel grinding force model was established through a kinematic-geometric analysis and a grain-workpiece contact analysis.Then,a series of grinding experiments were conducted for verifying the model.The results indicate that the distribution of undeformed chip thickness is highly consistent with the Gaussian distribution formula.The increase in the grinding depth mainly leads to an increase in the average value of Gaussian distribution.On the contrary,the increase in the workpiece infeed speed or the decrease in the grinding speed mainly increases the standard deviation of Gaussian distribution.The average and maximum errors of the grinding force model are 4.9%and 14.6%respectively,indicating that the model is of high predication accuracy.展开更多
Objective Cerebral palsy(CP)is a prevalent neurodevelopmental disorder acquired during the perinatal period,with periventricular white matter injury(PWMI)serving as its primary pathological hallmark.PWMI is characteri...Objective Cerebral palsy(CP)is a prevalent neurodevelopmental disorder acquired during the perinatal period,with periventricular white matter injury(PWMI)serving as its primary pathological hallmark.PWMI is characterized by the loss of oligodendrocytes(OLs)and the disintegration of myelin sheaths,leading to impaired neural connectivity and motor dysfunction.Neural stem cells(NSCs)represent a promising regenerative source for replenishing lost OLs;however,conventional twodimensional(2D)in vitro culture systems lack the three-dimensional(3D)physiological microenvironment.Microfluidic chip technology has emerged as a powerful tool to overcome this limitation by enabling precise spatial and temporal control over 3D microenvironmental conditions,including the establishment of stable concentration gradients of bioactive molecules.Catalpol,an iridoid glycoside derived from traditional medicinal plants,exhibits dual antioxidant and anti-apoptotic properties.Despite its therapeutic potential,the capacity of catalpol to drive NSC differentiation toward OLs under biomimetic 3D conditions,as well as the underlying molecular mechanisms,remains poorly understood.This study aims to develop a microfluidic-based 3D biomimetic platform to systematically investigate the concentration-dependent effects of catalpol on promoting NSCs-to-OLs differentiation and to elucidate the role of the caveolin-1(Cav-1)signaling pathway in this process.Methods We developed a novel multiplexed microfluidic device featuring parallel microchannels with integrated gradient generators capable of establishing and maintaining precise linear concentration gradients(0-3 g/L catalpol)across 3D NSCs cultures.This platform facilitated the continuous perfusion culture of NSC-derived 3D spheroids,mimicking the dynamic in vivo microenvironment.Real-time cell viability was assessed using Calcein-AM/propidium iodide(PI)dual staining,with fluorescence imaging quantifying live/dead cell ratios.Oligodendrocyte differentiation was evaluated through quantitative reverse transcription polymerase chain reaction(qRT-PCR)for MBP and SOX10 gene expression,complemented by immunofluorescence staining to visualize corresponding protein changes.To dissect the molecular mechanism,the Cav-1-specific pharmacological inhibitor methyl‑β‑cyclodextrin(MCD)was employed to perturb the pathway,and its effects on differentiation markers were analyzed.Results Catalpol demonstrated excellent biocompatibility,with cell viability exceeding 96%across the entire tested concentration range(0-3 g/L),confirming its non-cytotoxic nature.At the optimal concentration of 0-3 g/L,catalpol significantly upregulated both MBP and SOX10 expression(P<0.05,P<0.01),indicating robust promotion of oligodendroglial differentiation.Intriguingly,Cav-1 mRNA expression was progressively downregulated during NSC differentiation into OLs.Further inhibition of Cav-1 with MCD further enhanced this effect,leading to a statistically significant increase in OL-specific gene expression(P<0.05,P<0.01),suggesting Cav-1 acts as a negative regulator of OLs differentiation.Conclusion This study established an integrated microfluidic gradient chip-3D NSC spheroid culture system,which combines the advantages of precise chemical gradient control with physiologically relevant 3D cell culture.The findings demonstrate that 3 g/L catalpol effectively suppresses Cav-1 signaling to drive NSC differentiation into functional OLs.This work not only provides novel insights into the Cav-1-dependent mechanisms of myelination but also delivers a scalable technological platform for future research on remyelination therapies,with potential applications in cerebral palsy and other white matter disorders.The platform’s modular design permits adaptation for screening other neurogenic compounds or investigating additional signaling pathways involved in OLs maturation.展开更多
大会介绍中国健康信息处理大会(China Health Information Processing Conference,CHIP)是中国中文信息学会(CIPS)医疗健康与生物信息处理专业委员会开展的“以信息处理技术助力探索生命之奥秘、提高健康之质量、提升医疗之水平”为主...大会介绍中国健康信息处理大会(China Health Information Processing Conference,CHIP)是中国中文信息学会(CIPS)医疗健康与生物信息处理专业委员会开展的“以信息处理技术助力探索生命之奥秘、提高健康之质量、提升医疗之水平”为主旨的年度会议。CHIP是中国健康信息处理领域的重要会议,是世界各地学术界、企业界和政府部门的研究人员和从业人士分享创意,进一步推广领域研究成果和经验的重要平台。本次第十一届中国健康信息处理大会(CHIP 2025)将于2025年11月14-16日在广东东莞举行。我们诚挚地邀请大家莅临CHIP 2025,共襄盛举。展开更多
Recent years have witnessed transformative changes brought about by artificial intelligence(AI)techniques with billions of parameters for the realization of high accuracy,proposing high demand for the advanced and AI ...Recent years have witnessed transformative changes brought about by artificial intelligence(AI)techniques with billions of parameters for the realization of high accuracy,proposing high demand for the advanced and AI chip to solve these AI tasks efficiently and powerfully.Rapid progress has been made in the field of advanced chips recently,such as the development of photonic computing,the advancement of the quantum processors,the boost of the biomimetic chips,and so on.Designs tactics of the advanced chips can be conducted with elaborated consideration of materials,algorithms,models,architectures,and so on.Though a few reviews present the development of the chips from their unique aspects,reviews in the view of the latest design for advanced and AI chips are few.Here,the newest development is systematically reviewed in the field of advanced chips.First,background and mechanisms are summarized,and subsequently most important considerations for co-design of the software and hardware are illustrated.Next,strategies are summed up to obtain advanced and AI chips with high excellent performance by taking the important information processing steps into consideration,after which the design thought for the advanced chips in the future is proposed.Finally,some perspectives are put forward.展开更多
We present a compact cold atom platform where an optical grating chip and planar coil chip are placed inside a compact vacuum chamber to create a magneto-optical trap.This approach significantly reduces the system vol...We present a compact cold atom platform where an optical grating chip and planar coil chip are placed inside a compact vacuum chamber to create a magneto-optical trap.This approach significantly reduces the system volume to about 20×20×20 cm^(3) compared to conventional vacuum systems and offers greater flexibility in accessing the trapped atoms.We demonstrate the trapping of 3×10^(5) cold rubidium atoms at a temperature of 100μK in a vacuum pressure below 10^(−7) mbar.The simplified optical geometry,low power consumption,and high degree of integration make this a promising platform for portable and versatile cold-atom devices in quantum sensing,timing,and information processing.展开更多
The optical soliton characteristics of GaSb-based~2μm wavelength integrated optical chips have broad application prospects in optoelectronic fields such as optical communications,infrared countermeasures,and gas envi...The optical soliton characteristics of GaSb-based~2μm wavelength integrated optical chips have broad application prospects in optoelectronic fields such as optical communications,infrared countermeasures,and gas environment monitoring.In the research of two-section integrated optical chips,more attention is paid to their passive mode-locked characteristics.The ability of its structure to generate stable soliton transmission has not yet been studied,which will limit its further application in high-performance near-mid infrared optoelectronic technology.In this paper,we design and prepare a GaSb-based~2μm wave-length two-section integrated semiconductor laser chip structure,and test and analyze its related properties of soliton,includ-ing power−injection current−voltage(P−I−V),temperature and mode-locked characteristics.Experimental results show that the chip can achieve stable mode-locked operation at nearly~2μm wavelength and present the working characteristics of near opti-cal soliton states and multi-peak optical soliton states.By comparing and analyzing the measured optical pulse sequence curve with the numerical fitting based on the pure fourth order soliton approximation solution,it is confirmed that the two-section integrated optical chip structure can generate stable transmission of multi-peak optical soliton.This provides a research direc-tion for developing near-mid infrared mode-locked integrated optical chips with high-performance property of optical soliton.展开更多
Vibration detection using sensors with both wide working frequency range,good sensitivity,and other good performances is a topic of great interest in fields such as inertial navigation,deep-sea fishing boat engines co...Vibration detection using sensors with both wide working frequency range,good sensitivity,and other good performances is a topic of great interest in fields such as inertial navigation,deep-sea fishing boat engines condition monitoring,seismic monitoring,attitude,and heading reference system,etc.This paper investigates two 6H-SIC MEMS diaphragms,one triangular and the other square,used in a fiber optic Fabry–Perot(FP)accelerometer in an experimental scenario.The triangular chip shows a wide working frequency range of 630 Hz–5300 Hz,a natural frequency of 44.3 k Hz,and a mechanical sensitivity of 0.154 nm/g.An optimal structure of the square chip used in a probe such as a fiber optic FP accelerometer also shows a wide working frequency range of 120 Hz–2300 Hz;a good sensitivity of 31.5 m V/g,a resonance frequency of7873 Hz,an accuracy of 0.96%F.S.,a frequency measurement error of 1.15%,and an excellent linearity of 0.9995.展开更多
Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulatin...Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.展开更多
Photonic computing has emerged as a promising technology for the ever-increasing computational demands of machine learning and artificial intelligence.Due to the advantages in computing speed,integrated photonic chips...Photonic computing has emerged as a promising technology for the ever-increasing computational demands of machine learning and artificial intelligence.Due to the advantages in computing speed,integrated photonic chips have attracted wide research attention on performing convolutional neural network algorithm.Programmable photonic chips are vital for achieving practical applications of photonic computing.Herein,a programmable photonic chip based on ultrafast laser-induced phase change is fabricated for photonic computing.Through designing the ultrafast laser pulses,the Sb film integrated into photonic waveguides can be reversibly switched between crystalline and amorphous phase,resulting in a large contrast in refractive index and extinction coefficient.As a consequence,the light transmission of waveguides can be switched between write and erase states.To determine the phase change time,the transient laser-induced phase change dynamics of Sb film are revealed at atomic scale,and the time-resolved transient reflectivity is measured.Based on the integrated photonic chip,photonic convolutional neural networks are built to implement machine learning algorithm,and images recognition task is achieved.This work paves a route for fabricating programmable photonic chips by designed ultrafast laser,which will facilitate the application of photonic computing in artificial intelligence.展开更多
The combining microelectronic devices and associated technologies onto a single silicon chip poses a substantial challenge.However,in recent years,the area of silicon photonics has experienced remarkable advancements ...The combining microelectronic devices and associated technologies onto a single silicon chip poses a substantial challenge.However,in recent years,the area of silicon photonics has experienced remarkable advancements and notable leaps in performance.The performance of silicon on insulator(SOI)based photonic devices,such as fast silicon optical modulators,photonic transceivers,optical filters,etc.,have been discussed.This would be a step forward in creating standalone silicon photonic devices,strengthening the possibility of single on-chip nanophotonic integrated circuits.Suppose an integrated silicon photonic chip is designed and fabricated.In that case,it might drastically modify these combined photonic component costs,power consumption,and size,bringing substantial,perhaps revolutionary,changes to the next-generation communications sector.Yet,the monolithic integration of photonic and electrical circuitry is a significant technological difficulty.A complicated set of factors must be carefully considered to determine which application will have the best chance of success employing silicon-based integrated product solutions.The processing limitations connected to the current process flow,the process generation(sometimes referred to as lithography node generation),and packaging requirements are a few of these factors to consider.This review highlights recent developments in integrated silicon photonic devices and their proven applications,including but not limited to photonic waveguides,photonic amplifiers and filters,onchip photonic transceivers,and the state-of-the-art of silicon photonic in multidimensional quantum systems.The investigated devices aim to expedite the transfer of silicon photonics from academia to industry by opening the next phase in on-chip silicon photonics and enabling the application of silicon photonic-based devices in various optical systems.展开更多
We experimentally investigate the effective working regions of a planar-integrated magneto-optical trap(MOT).By scanning a blocking point in the incident laser beam,we identify four effective working regions of the la...We experimentally investigate the effective working regions of a planar-integrated magneto-optical trap(MOT).By scanning a blocking point in the incident laser beam,we identify four effective working regions of the laser beam contributing to MOT:a central region corresponding to the downward incident beam and three regions associated with the upward diffracted beams.The latter three regions are the effective regions of the grating chip.It is demonstrated that only three3.5 mm radius grating regions can produce a MOT that is capable of trapping 105atoms with a temperature below 150μK,retaining over 60%of atoms compared to a complete grating chip.This finding suggests that more than 60%of the grating chip area can be saved for other on-chip components,such as metasurfaces and nanophotonic devices,without significantly compromising MOT performance,paving the way for more compact and versatile atom–photon interfaces.展开更多
In order to solve the problems of low overload power in MEMS cantilever beams and low sensitivity in traditional MEMS fixed beams,a novel MEMS microwave power detection chip based on the dual-guided fixed beam is desi...In order to solve the problems of low overload power in MEMS cantilever beams and low sensitivity in traditional MEMS fixed beams,a novel MEMS microwave power detection chip based on the dual-guided fixed beam is designed.A gap between guiding beams and measuring electrodes is designed to accelerate the release of the sacrificial layer,effectively enhanc-ing chip performance.A load sensing model for the MEMS fixed beam microwave power detection chip is proposed,and the mechanical characteristics are analyzed based on the uniform load applied.The overload power and sensitivity are investi-gated using the load sensing model,and experimental results are compared with theoretical results.The detection chip exhibits excellent microwave characteristic in the 9-11 GHz frequency band,with a return loss less than-10 dB.At a signal fre-quency of 10 GHz,the theoretical sensitivity is 13.8 fF/W,closely matching the measured value of 14.3 fF/W,with a relative error of only 3.5%.These results demonstrate that the proposed load sensing model provides significant theoretical support for the design and performance optimization of MEMS microwave power detection chips.展开更多
Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(I...Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(IMC)at the interconnect interface is(Ni,Cu)_(3)Sn_(4)phase,and meanwhile a small amount of(Cu,Ni)_(6)Sn_(5)phase with a size of 50−100 nm is formed around(Ni,Cu)_(3)Sn_(4)phase.The orientation relationship of[-1-56](Ni,Cu)_(3)Sn_(4)//[152](Cu,Ni)_(6)Sn_(5)and(601)(Ni,Cu)_(3)Sn_(4)//(-201)(Cu,Ni)_(6)Sn_(5)is found between these two phases,and the atomic matching at the interface of the two phases is low.The highest shear force of 77.3 gf is achieved in the 64.8Sn35.2Pb microbump at the peak temperature of 250℃and parameter V1 because dense IMCs and no cracks form at the interconnect interface.Two typical fracture modes of microbumps are determined as solder fracture and mixed fracture.The high thermal stress presenting in the thick IMCs layer induces crack initiation,and cracks propagate along theα/βphase boundaries in the Sn-Pb solder under shear force,leading to a mixed fracture mode in the microbumps.展开更多
Wearable flexible sensor devices have the characteristics of lightweight and miniaturization.Currently,power supply and detection components limit the portability of wearable flexible sensor devices.Meanwhile,conventi...Wearable flexible sensor devices have the characteristics of lightweight and miniaturization.Currently,power supply and detection components limit the portability of wearable flexible sensor devices.Meanwhile,conventional liquid electrolytes are unsuitable for the integration of sensing devices.To address these constraints,wearable biofuel cells and flexible electrochromic displays have been introduced,which can improve integration with other devices,safety,and color-coded display data.Meanwhile,electrode chips prepared through screen printing technology can further improve portability.In this work,a wearable sensor device with screen-printed chips was constructed and used for non-invasive detection of glucose.Agarose gel electrolytes doped with PDA-CNTs were prepared,and the mechanical strength and moisture retention were significantly improved compared with traditional gel electrolytes.Glucose in interstitial fluid was non-invasive extracted to the skin surface using reverse iontophoresis.As a biofuel for wearable biofuel cells,glucose drives self-powered sensor and electrochromic display to produce color change,allowing for visually measurement of glucose levels in body fluids.Accurate detection results can be visualized by reading the RGB value with a cell phone.展开更多
In the 9 December 2024 issue of Nature[1],a team of Google engineers reported breakthrough results using“Willow”,their lat-est quantum computing chip(Fig.1).By meeting a milestone“below threshold”reduction in the ...In the 9 December 2024 issue of Nature[1],a team of Google engineers reported breakthrough results using“Willow”,their lat-est quantum computing chip(Fig.1).By meeting a milestone“below threshold”reduction in the rate of errors that plague super-conducting circuit-based quantum computing systems(Fig.2),the work moves the field another step towards its promised super-charged applications,albeit likely still many years away.Areas expected to benefit from quantum computing include,among others,drug discovery,materials science,finance,cybersecurity,and machine learning.展开更多
Monocrystalline Cu exhibits excellent electrical and signal-transmission properties due to its absence of grain boundaries,making it a critical material for the production of micro-machinery and micro-components;howev...Monocrystalline Cu exhibits excellent electrical and signal-transmission properties due to its absence of grain boundaries,making it a critical material for the production of micro-machinery and micro-components;however,achieving ultrahigh precision and ultralow damage machining of functional devices using traditional techniques such as grinding and polishing is extremely challenging.Consequently,nanocutting has emerged as an efficient means to fabricate monocrystalline materials with complex surface characteristics and high surface integrity.Nevertheless,the macroscopic cutting theory of metal materials cannot be applied to nanocutting.Accordingly,in this paper,both simulations and experiments were conducted to examine the chip deformation mechanisms of monocrystalline Cu.First,large-scale molecular dynamics(MD)simulations were conducted to gain a comprehensive understanding of the deformation behavior during nanocutting.This included examining the influencing factors and the variation patterns of the chip deformation coefficient,cutting force,and minimum cutting thickness.Subsequently,nanocutting experiments were performed using a specially designed nanocutting platform with high-resolution online observation by scanning electron microscopy.The experimental results served to verify the accuracy and reliability of theMDmodeling,as they exhibited excellent consistency with the simulated results.Although this work considered monocrystalline Cu,it is believed that the elucidated chip deformation mechanisms could also be applied to other face-centered-cubic metals.These results are of great value for advancing the understanding of the mechanisms of ultraprecision cutting.展开更多
High-throughput genotyping tools can effectively promote molecular breeding in crops.In this study,genotyping by target sequencing(GBTS)system was utilized to develop a genome-wide liquid SNP chip for facilitating gen...High-throughput genotyping tools can effectively promote molecular breeding in crops.In this study,genotyping by target sequencing(GBTS)system was utilized to develop a genome-wide liquid SNP chip for facilitating genetics and breeding in melon(Cucumis melo L.),a globally cultivated economically important horticultural crop.Based on over eight million SNPs derived from 823 representative melon accessions,16K,8K,4K,2K,1K,500,250 and 125 informative SNPs were screened and evaluated for their polymorphisms,conservation of flanking sequences,and distributions.The set of 2K SNPs was found to be optimal for representing the maximum diversity with the lowest number of SNPs,and it was selected to develop the liquid chip,named“Melon2K”.Using Melon2K,more than 1500 SNPs were detected across 17 samples of five melon cultivars,and the phylogenetic relationships were clearly constructed.Within the same cultivar,genetic differences were also assessed between different samples.We evaluated the performance of Melon2K in genetic background selection during the breeding process,obtaining the introgression lines of interested trait with more than 97%genetic background of elite variety by only two rounds of backcrossing.These results suggest that Melon2K provides a cost-effective,efficient and reliable platform for genetic analysis and molecular breeding in melon.展开更多
This paper describes a 2D/3D vision chip with integrated sensing and processing capabilities.The 2D/3D vision chip architecture includes a 2D/3D image sensor and a programmable visual processor.In this architecture,we...This paper describes a 2D/3D vision chip with integrated sensing and processing capabilities.The 2D/3D vision chip architecture includes a 2D/3D image sensor and a programmable visual processor.In this architecture,we design a novel on-chip processing flow with die-to-die image transmission and low-latency fixed-point image processing.The vision chip achieves real-time end-to-end processing of convolutional neural networks(CNNs)and conventional image processing algo-rithms.Furthermore,an end-to-end 2D/3D vision system is built to exhibit the capacity of the vision chip.The vision system achieves real-timing applications under 2D and 3D scenes,such as human face detection(processing delay 10.2 ms)and depth map reconstruction(processing delay 4.1 ms).The frame rate of image acquisition,image process,and result display is larger than 30 fps.展开更多
基金co-supported by the Science Center for Gas Turbine Project, China(No. P2022-AB-IV-001-002)the National Natural Science Foundation of China (No. 91960203)+1 种基金the Fundamental Research Funds for the Central Universities (No. D5000230048)the Innovation Capability Support Program of Shaanxi (No. 2022TD-60)
文摘Superior strength and high-temperature performance make γ-TiAl vital for lightweight aero-engines. However, its inherent brittleness poses machining problems. This study employed Elliptical Ultrasonic Vibration Milling (EUVM) to address these problems. Considering the influence of machining parameters on vibration patterns of EUVM, a separation time model was established to analyze the vibration evolutionary process, thereby instructing the cutting mechanism. On this basis, deep discussions regarding chip formation, cutting force, edge breakage, and subsurface layer deformation were conducted for EUVM and Conventional Milling (CM). Chip morphology showed the chip formation was rooted in the periodic brittle fracture. Local dimples proved that the thermal effect of high-speed cutting improved the plasticity of γ-TiAl. EUVM achieved a maximum 18.17% reduction in cutting force compared with CM. The force variation mechanism differed with changes in the cutting speed or the vibration amplitude, and its correlation with thermal softening, strain hardening, and vibratory cutting effects was analyzed. EUVM attained desirable edge breakage by achieving smaller fracture lengths. The fracture mechanisms of different phases were distinct, causing a surge in edge fracture size of γ-TiAl under microstructural differences. In terms of subsurface deformation, EUVM also showed strengthening effects. Noteworthy, the lamellar deformation patterns under the cutting removal state differed from the quasi-static, which was categorized by the orientation angles. Additionally, the electron backscattering diffraction provided details of the influence of microstructural difference on the orientation and the deformation of grains in the subsurface layer. The results demonstrate that EUVM is a promising machining method for γ-TiAl and guide further research and development of EUVM γ-TiAl.
基金financially supported by the National Natural Science Foundation of China(Nos.92160301,92060203,52175415 and 52205475)the Science Center for Gas Turbine Project(Nos.P2022-AB-Ⅳ-002-001 and P2023-B-Ⅳ-003-001)+3 种基金the Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology(No.JSKL2223K01)the Natural Science Foundation of Jiangsu Province(No.BK20210295)the Superior Postdoctoral Project of Jiangsu Province(No.2022ZB215)the Henan Science and Technology Public Relations Project(No.212102210445).
文摘The undeformed chip thickness and grinding force are key parameters for revealing the material removal mechanism in the grinding process.However,they are difficult to be well expressed due to the ununiformed protrusion height and random position distribution of abrasive grains on the abrasive wheel surface.This study investigated the distribution of undeformed chip thickness and grinding force considering the non-uniform characteristics of abrasive wheel in the grinding of K4002 nickel-based superalloy.First,a novel grinding force model was established through a kinematic-geometric analysis and a grain-workpiece contact analysis.Then,a series of grinding experiments were conducted for verifying the model.The results indicate that the distribution of undeformed chip thickness is highly consistent with the Gaussian distribution formula.The increase in the grinding depth mainly leads to an increase in the average value of Gaussian distribution.On the contrary,the increase in the workpiece infeed speed or the decrease in the grinding speed mainly increases the standard deviation of Gaussian distribution.The average and maximum errors of the grinding force model are 4.9%and 14.6%respectively,indicating that the model is of high predication accuracy.
基金supported by grants from the Liaoning Province Excellent Talent Program Project(XLYC1902031)Dalian Science and Technology Talent Innovation Plan Grant(2022RG18)Basic Research Project of the Department of Education of Liaoning Province(LJKQZ20222395)。
文摘Objective Cerebral palsy(CP)is a prevalent neurodevelopmental disorder acquired during the perinatal period,with periventricular white matter injury(PWMI)serving as its primary pathological hallmark.PWMI is characterized by the loss of oligodendrocytes(OLs)and the disintegration of myelin sheaths,leading to impaired neural connectivity and motor dysfunction.Neural stem cells(NSCs)represent a promising regenerative source for replenishing lost OLs;however,conventional twodimensional(2D)in vitro culture systems lack the three-dimensional(3D)physiological microenvironment.Microfluidic chip technology has emerged as a powerful tool to overcome this limitation by enabling precise spatial and temporal control over 3D microenvironmental conditions,including the establishment of stable concentration gradients of bioactive molecules.Catalpol,an iridoid glycoside derived from traditional medicinal plants,exhibits dual antioxidant and anti-apoptotic properties.Despite its therapeutic potential,the capacity of catalpol to drive NSC differentiation toward OLs under biomimetic 3D conditions,as well as the underlying molecular mechanisms,remains poorly understood.This study aims to develop a microfluidic-based 3D biomimetic platform to systematically investigate the concentration-dependent effects of catalpol on promoting NSCs-to-OLs differentiation and to elucidate the role of the caveolin-1(Cav-1)signaling pathway in this process.Methods We developed a novel multiplexed microfluidic device featuring parallel microchannels with integrated gradient generators capable of establishing and maintaining precise linear concentration gradients(0-3 g/L catalpol)across 3D NSCs cultures.This platform facilitated the continuous perfusion culture of NSC-derived 3D spheroids,mimicking the dynamic in vivo microenvironment.Real-time cell viability was assessed using Calcein-AM/propidium iodide(PI)dual staining,with fluorescence imaging quantifying live/dead cell ratios.Oligodendrocyte differentiation was evaluated through quantitative reverse transcription polymerase chain reaction(qRT-PCR)for MBP and SOX10 gene expression,complemented by immunofluorescence staining to visualize corresponding protein changes.To dissect the molecular mechanism,the Cav-1-specific pharmacological inhibitor methyl‑β‑cyclodextrin(MCD)was employed to perturb the pathway,and its effects on differentiation markers were analyzed.Results Catalpol demonstrated excellent biocompatibility,with cell viability exceeding 96%across the entire tested concentration range(0-3 g/L),confirming its non-cytotoxic nature.At the optimal concentration of 0-3 g/L,catalpol significantly upregulated both MBP and SOX10 expression(P<0.05,P<0.01),indicating robust promotion of oligodendroglial differentiation.Intriguingly,Cav-1 mRNA expression was progressively downregulated during NSC differentiation into OLs.Further inhibition of Cav-1 with MCD further enhanced this effect,leading to a statistically significant increase in OL-specific gene expression(P<0.05,P<0.01),suggesting Cav-1 acts as a negative regulator of OLs differentiation.Conclusion This study established an integrated microfluidic gradient chip-3D NSC spheroid culture system,which combines the advantages of precise chemical gradient control with physiologically relevant 3D cell culture.The findings demonstrate that 3 g/L catalpol effectively suppresses Cav-1 signaling to drive NSC differentiation into functional OLs.This work not only provides novel insights into the Cav-1-dependent mechanisms of myelination but also delivers a scalable technological platform for future research on remyelination therapies,with potential applications in cerebral palsy and other white matter disorders.The platform’s modular design permits adaptation for screening other neurogenic compounds or investigating additional signaling pathways involved in OLs maturation.
文摘大会介绍中国健康信息处理大会(China Health Information Processing Conference,CHIP)是中国中文信息学会(CIPS)医疗健康与生物信息处理专业委员会开展的“以信息处理技术助力探索生命之奥秘、提高健康之质量、提升医疗之水平”为主旨的年度会议。CHIP是中国健康信息处理领域的重要会议,是世界各地学术界、企业界和政府部门的研究人员和从业人士分享创意,进一步推广领域研究成果和经验的重要平台。本次第十一届中国健康信息处理大会(CHIP 2025)将于2025年11月14-16日在广东东莞举行。我们诚挚地邀请大家莅临CHIP 2025,共襄盛举。
基金supported by the Hong Kong Polytechnic University(1-WZ1Y,1-W34U,4-YWER).
文摘Recent years have witnessed transformative changes brought about by artificial intelligence(AI)techniques with billions of parameters for the realization of high accuracy,proposing high demand for the advanced and AI chip to solve these AI tasks efficiently and powerfully.Rapid progress has been made in the field of advanced chips recently,such as the development of photonic computing,the advancement of the quantum processors,the boost of the biomimetic chips,and so on.Designs tactics of the advanced chips can be conducted with elaborated consideration of materials,algorithms,models,architectures,and so on.Though a few reviews present the development of the chips from their unique aspects,reviews in the view of the latest design for advanced and AI chips are few.Here,the newest development is systematically reviewed in the field of advanced chips.First,background and mechanisms are summarized,and subsequently most important considerations for co-design of the software and hardware are illustrated.Next,strategies are summed up to obtain advanced and AI chips with high excellent performance by taking the important information processing steps into consideration,after which the design thought for the advanced chips in the future is proposed.Finally,some perspectives are put forward.
基金supported by the National Key R&D Program(Grant Nos.2021YFA1402004 and 2021YFF0603701)the National Natural Science Foundation of China(Grant Nos.12134014,U21A20433,U21A6006,and 92265108)+1 种基金the Fundamental Research Funds for the Central Universitiesthe University of Science and Technology of China(USTC)Research Funds of the Double First-Class Initiative。
文摘We present a compact cold atom platform where an optical grating chip and planar coil chip are placed inside a compact vacuum chamber to create a magneto-optical trap.This approach significantly reduces the system volume to about 20×20×20 cm^(3) compared to conventional vacuum systems and offers greater flexibility in accessing the trapped atoms.We demonstrate the trapping of 3×10^(5) cold rubidium atoms at a temperature of 100μK in a vacuum pressure below 10^(−7) mbar.The simplified optical geometry,low power consumption,and high degree of integration make this a promising platform for portable and versatile cold-atom devices in quantum sensing,timing,and information processing.
基金the National Natural Science Foundation of China(Grant Nos.62274048,62464006,62174046)the Ministry of Education,Singapore(Grant No.MOE-T2EP50121-0005)+1 种基金Hainan Province Science and Technology Special Fund(Grant No.ZDYF2025GXJS007)National Key R&D Program of China(Grant No.2023YFF0722400).
文摘The optical soliton characteristics of GaSb-based~2μm wavelength integrated optical chips have broad application prospects in optoelectronic fields such as optical communications,infrared countermeasures,and gas environment monitoring.In the research of two-section integrated optical chips,more attention is paid to their passive mode-locked characteristics.The ability of its structure to generate stable soliton transmission has not yet been studied,which will limit its further application in high-performance near-mid infrared optoelectronic technology.In this paper,we design and prepare a GaSb-based~2μm wave-length two-section integrated semiconductor laser chip structure,and test and analyze its related properties of soliton,includ-ing power−injection current−voltage(P−I−V),temperature and mode-locked characteristics.Experimental results show that the chip can achieve stable mode-locked operation at nearly~2μm wavelength and present the working characteristics of near opti-cal soliton states and multi-peak optical soliton states.By comparing and analyzing the measured optical pulse sequence curve with the numerical fitting based on the pure fourth order soliton approximation solution,it is confirmed that the two-section integrated optical chip structure can generate stable transmission of multi-peak optical soliton.This provides a research direc-tion for developing near-mid infrared mode-locked integrated optical chips with high-performance property of optical soliton.
基金Project supported by the National Natural Science Foundation of China(Grant No.32473216)Ningbo Youth Science and Technology Innovation Leading Talent Project(Grant No.2023QL004)。
文摘Vibration detection using sensors with both wide working frequency range,good sensitivity,and other good performances is a topic of great interest in fields such as inertial navigation,deep-sea fishing boat engines condition monitoring,seismic monitoring,attitude,and heading reference system,etc.This paper investigates two 6H-SIC MEMS diaphragms,one triangular and the other square,used in a fiber optic Fabry–Perot(FP)accelerometer in an experimental scenario.The triangular chip shows a wide working frequency range of 630 Hz–5300 Hz,a natural frequency of 44.3 k Hz,and a mechanical sensitivity of 0.154 nm/g.An optimal structure of the square chip used in a probe such as a fiber optic FP accelerometer also shows a wide working frequency range of 120 Hz–2300 Hz;a good sensitivity of 31.5 m V/g,a resonance frequency of7873 Hz,an accuracy of 0.96%F.S.,a frequency measurement error of 1.15%,and an excellent linearity of 0.9995.
文摘Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.
基金supported by the National Key R&D Program of China(2024YFB4609801)the National Natural Science Foundation of China(52075289)the Tsinghua-Jiangyin Innovation Special Fund(TJISF,2023JYTH0104).
文摘Photonic computing has emerged as a promising technology for the ever-increasing computational demands of machine learning and artificial intelligence.Due to the advantages in computing speed,integrated photonic chips have attracted wide research attention on performing convolutional neural network algorithm.Programmable photonic chips are vital for achieving practical applications of photonic computing.Herein,a programmable photonic chip based on ultrafast laser-induced phase change is fabricated for photonic computing.Through designing the ultrafast laser pulses,the Sb film integrated into photonic waveguides can be reversibly switched between crystalline and amorphous phase,resulting in a large contrast in refractive index and extinction coefficient.As a consequence,the light transmission of waveguides can be switched between write and erase states.To determine the phase change time,the transient laser-induced phase change dynamics of Sb film are revealed at atomic scale,and the time-resolved transient reflectivity is measured.Based on the integrated photonic chip,photonic convolutional neural networks are built to implement machine learning algorithm,and images recognition task is achieved.This work paves a route for fabricating programmable photonic chips by designed ultrafast laser,which will facilitate the application of photonic computing in artificial intelligence.
文摘The combining microelectronic devices and associated technologies onto a single silicon chip poses a substantial challenge.However,in recent years,the area of silicon photonics has experienced remarkable advancements and notable leaps in performance.The performance of silicon on insulator(SOI)based photonic devices,such as fast silicon optical modulators,photonic transceivers,optical filters,etc.,have been discussed.This would be a step forward in creating standalone silicon photonic devices,strengthening the possibility of single on-chip nanophotonic integrated circuits.Suppose an integrated silicon photonic chip is designed and fabricated.In that case,it might drastically modify these combined photonic component costs,power consumption,and size,bringing substantial,perhaps revolutionary,changes to the next-generation communications sector.Yet,the monolithic integration of photonic and electrical circuitry is a significant technological difficulty.A complicated set of factors must be carefully considered to determine which application will have the best chance of success employing silicon-based integrated product solutions.The processing limitations connected to the current process flow,the process generation(sometimes referred to as lithography node generation),and packaging requirements are a few of these factors to consider.This review highlights recent developments in integrated silicon photonic devices and their proven applications,including but not limited to photonic waveguides,photonic amplifiers and filters,onchip photonic transceivers,and the state-of-the-art of silicon photonic in multidimensional quantum systems.The investigated devices aim to expedite the transfer of silicon photonics from academia to industry by opening the next phase in on-chip silicon photonics and enabling the application of silicon photonic-based devices in various optical systems.
基金Project supported by the National Key R&D Program of China(Grant Nos.2021YFA1402004 and 2021YFF0603701)the National Natural Science Foundation of China(Grant Nos.12134014,U21A20433,U21A6006,and 92265108)+1 种基金supported by the Fundamental Research Funds for the Central UniversitiesUSTC Research Funds of the Double First-Class Initiative。
文摘We experimentally investigate the effective working regions of a planar-integrated magneto-optical trap(MOT).By scanning a blocking point in the incident laser beam,we identify four effective working regions of the laser beam contributing to MOT:a central region corresponding to the downward incident beam and three regions associated with the upward diffracted beams.The latter three regions are the effective regions of the grating chip.It is demonstrated that only three3.5 mm radius grating regions can produce a MOT that is capable of trapping 105atoms with a temperature below 150μK,retaining over 60%of atoms compared to a complete grating chip.This finding suggests that more than 60%of the grating chip area can be saved for other on-chip components,such as metasurfaces and nanophotonic devices,without significantly compromising MOT performance,paving the way for more compact and versatile atom–photon interfaces.
基金supported by the National Natural Science Foundation of China(61904089)the Province Natural Science Foundation of Jiangsu(BK20190731).
文摘In order to solve the problems of low overload power in MEMS cantilever beams and low sensitivity in traditional MEMS fixed beams,a novel MEMS microwave power detection chip based on the dual-guided fixed beam is designed.A gap between guiding beams and measuring electrodes is designed to accelerate the release of the sacrificial layer,effectively enhanc-ing chip performance.A load sensing model for the MEMS fixed beam microwave power detection chip is proposed,and the mechanical characteristics are analyzed based on the uniform load applied.The overload power and sensitivity are investi-gated using the load sensing model,and experimental results are compared with theoretical results.The detection chip exhibits excellent microwave characteristic in the 9-11 GHz frequency band,with a return loss less than-10 dB.At a signal fre-quency of 10 GHz,the theoretical sensitivity is 13.8 fF/W,closely matching the measured value of 14.3 fF/W,with a relative error of only 3.5%.These results demonstrate that the proposed load sensing model provides significant theoretical support for the design and performance optimization of MEMS microwave power detection chips.
基金Project(U2341254)supported by Ye Qisun Science Foundation of National Natural Science Foundation of ChinaProject(52475406)supported by the National Nature Science Foundation of ChinaProject(2024CY2-GJHX-32)supported by the Key R&D Program of Shaanxi Province,China。
文摘Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(IMC)at the interconnect interface is(Ni,Cu)_(3)Sn_(4)phase,and meanwhile a small amount of(Cu,Ni)_(6)Sn_(5)phase with a size of 50−100 nm is formed around(Ni,Cu)_(3)Sn_(4)phase.The orientation relationship of[-1-56](Ni,Cu)_(3)Sn_(4)//[152](Cu,Ni)_(6)Sn_(5)and(601)(Ni,Cu)_(3)Sn_(4)//(-201)(Cu,Ni)_(6)Sn_(5)is found between these two phases,and the atomic matching at the interface of the two phases is low.The highest shear force of 77.3 gf is achieved in the 64.8Sn35.2Pb microbump at the peak temperature of 250℃and parameter V1 because dense IMCs and no cracks form at the interconnect interface.Two typical fracture modes of microbumps are determined as solder fracture and mixed fracture.The high thermal stress presenting in the thick IMCs layer induces crack initiation,and cracks propagate along theα/βphase boundaries in the Sn-Pb solder under shear force,leading to a mixed fracture mode in the microbumps.
基金supported by the National Natural Science Foundation of China(No.22174055)Key R&D Program of Zhenjiang City(No.NY2022012)。
文摘Wearable flexible sensor devices have the characteristics of lightweight and miniaturization.Currently,power supply and detection components limit the portability of wearable flexible sensor devices.Meanwhile,conventional liquid electrolytes are unsuitable for the integration of sensing devices.To address these constraints,wearable biofuel cells and flexible electrochromic displays have been introduced,which can improve integration with other devices,safety,and color-coded display data.Meanwhile,electrode chips prepared through screen printing technology can further improve portability.In this work,a wearable sensor device with screen-printed chips was constructed and used for non-invasive detection of glucose.Agarose gel electrolytes doped with PDA-CNTs were prepared,and the mechanical strength and moisture retention were significantly improved compared with traditional gel electrolytes.Glucose in interstitial fluid was non-invasive extracted to the skin surface using reverse iontophoresis.As a biofuel for wearable biofuel cells,glucose drives self-powered sensor and electrochromic display to produce color change,allowing for visually measurement of glucose levels in body fluids.Accurate detection results can be visualized by reading the RGB value with a cell phone.
文摘In the 9 December 2024 issue of Nature[1],a team of Google engineers reported breakthrough results using“Willow”,their lat-est quantum computing chip(Fig.1).By meeting a milestone“below threshold”reduction in the rate of errors that plague super-conducting circuit-based quantum computing systems(Fig.2),the work moves the field another step towards its promised super-charged applications,albeit likely still many years away.Areas expected to benefit from quantum computing include,among others,drug discovery,materials science,finance,cybersecurity,and machine learning.
基金support of the National Natural Science Foundation of China(Grant No.51805371)the Innovation and Entrepreneurship Training Program of Tianjin University of Commerce(Grant No.202310069067).
文摘Monocrystalline Cu exhibits excellent electrical and signal-transmission properties due to its absence of grain boundaries,making it a critical material for the production of micro-machinery and micro-components;however,achieving ultrahigh precision and ultralow damage machining of functional devices using traditional techniques such as grinding and polishing is extremely challenging.Consequently,nanocutting has emerged as an efficient means to fabricate monocrystalline materials with complex surface characteristics and high surface integrity.Nevertheless,the macroscopic cutting theory of metal materials cannot be applied to nanocutting.Accordingly,in this paper,both simulations and experiments were conducted to examine the chip deformation mechanisms of monocrystalline Cu.First,large-scale molecular dynamics(MD)simulations were conducted to gain a comprehensive understanding of the deformation behavior during nanocutting.This included examining the influencing factors and the variation patterns of the chip deformation coefficient,cutting force,and minimum cutting thickness.Subsequently,nanocutting experiments were performed using a specially designed nanocutting platform with high-resolution online observation by scanning electron microscopy.The experimental results served to verify the accuracy and reliability of theMDmodeling,as they exhibited excellent consistency with the simulated results.Although this work considered monocrystalline Cu,it is believed that the elucidated chip deformation mechanisms could also be applied to other face-centered-cubic metals.These results are of great value for advancing the understanding of the mechanisms of ultraprecision cutting.
基金supported by the National Natural Science Foundation of China(Grant Nos.32102383,32225044 and 32130093)the Natural Science Foundation of Shandong Province(Grant No.ZR2021QC075)+1 种基金the Taishan Scholar Foundation of the People's Government of Shandong Province(Grant No.ts20190947)the Qingdao Agricultural University Doctoral Start-Up Fund。
文摘High-throughput genotyping tools can effectively promote molecular breeding in crops.In this study,genotyping by target sequencing(GBTS)system was utilized to develop a genome-wide liquid SNP chip for facilitating genetics and breeding in melon(Cucumis melo L.),a globally cultivated economically important horticultural crop.Based on over eight million SNPs derived from 823 representative melon accessions,16K,8K,4K,2K,1K,500,250 and 125 informative SNPs were screened and evaluated for their polymorphisms,conservation of flanking sequences,and distributions.The set of 2K SNPs was found to be optimal for representing the maximum diversity with the lowest number of SNPs,and it was selected to develop the liquid chip,named“Melon2K”.Using Melon2K,more than 1500 SNPs were detected across 17 samples of five melon cultivars,and the phylogenetic relationships were clearly constructed.Within the same cultivar,genetic differences were also assessed between different samples.We evaluated the performance of Melon2K in genetic background selection during the breeding process,obtaining the introgression lines of interested trait with more than 97%genetic background of elite variety by only two rounds of backcrossing.These results suggest that Melon2K provides a cost-effective,efficient and reliable platform for genetic analysis and molecular breeding in melon.
基金supported in part by the National Key Research and Development Program of China(Grant No.2019YFB2204300)in part by the National Natural Science Foundation of China(Grant Nos.62334008 and 62274154)in part by the Key Program of National Natural Science Foundation of China(Grant No.62134004).
文摘This paper describes a 2D/3D vision chip with integrated sensing and processing capabilities.The 2D/3D vision chip architecture includes a 2D/3D image sensor and a programmable visual processor.In this architecture,we design a novel on-chip processing flow with die-to-die image transmission and low-latency fixed-point image processing.The vision chip achieves real-time end-to-end processing of convolutional neural networks(CNNs)and conventional image processing algo-rithms.Furthermore,an end-to-end 2D/3D vision system is built to exhibit the capacity of the vision chip.The vision system achieves real-timing applications under 2D and 3D scenes,such as human face detection(processing delay 10.2 ms)and depth map reconstruction(processing delay 4.1 ms).The frame rate of image acquisition,image process,and result display is larger than 30 fps.
