The development tendency of“More than Display”is proposed for the display and semiconductor technologies,and the new-brand architecture of heterogeneous integration system in display(HiSID)is established in accordan...The development tendency of“More than Display”is proposed for the display and semiconductor technologies,and the new-brand architecture of heterogeneous integration system in display(HiSID)is established in accordance with the demands of third generation Micro/Mini-LED devices.Many functional units(e.g.,display units,storage units,sensing units,com-munication units and computing units)are integrated into one display main-board based on the semiconductor technology and electronic packaging.The advantages and details of miniaturization,intelligent,advanced integration,signal integrity with low latency performance,process compatibility and reliability are introduced.The interconnection requirements and design of the HiSID model with artificial intelligence are also summarized in this paper.It will provide technical guidance and references for the commercial application,core technology,and breakthrough direction of the HiSID module in display technology.展开更多
The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical ...The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.展开更多
文摘The development tendency of“More than Display”is proposed for the display and semiconductor technologies,and the new-brand architecture of heterogeneous integration system in display(HiSID)is established in accordance with the demands of third generation Micro/Mini-LED devices.Many functional units(e.g.,display units,storage units,sensing units,com-munication units and computing units)are integrated into one display main-board based on the semiconductor technology and electronic packaging.The advantages and details of miniaturization,intelligent,advanced integration,signal integrity with low latency performance,process compatibility and reliability are introduced.The interconnection requirements and design of the HiSID model with artificial intelligence are also summarized in this paper.It will provide technical guidance and references for the commercial application,core technology,and breakthrough direction of the HiSID module in display technology.
基金The work was partially funded by the Swedish Research Council,by the European 7^(th)Framework Programme under grant agreement FP7-NEMIAC(No.288670)by the European Research Council through the ERC Advanced Grant xMEMs(No.267528)and the ERC Starting Grant M&M’s(No.277879).
文摘The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.
