A new method was proposed for preparing AZ31/1060 composite plates with a corrugated interface,which involved cold-pressing a corrugated surface on the Al plate and then hot-pressing the assembled Mg/Al plate.The resu...A new method was proposed for preparing AZ31/1060 composite plates with a corrugated interface,which involved cold-pressing a corrugated surface on the Al plate and then hot-pressing the assembled Mg/Al plate.The results show that cold-pressing produces intense plastic deformation near the corrugated surface of the Al plate,which promotes dynamic recrystallization of the Al substrate near the interface during the subsequent hot-pressing.In addition,the initial corrugation on the surface of the Al plate also changes the local stress state near the interface during hot pressing,which has a large effect on the texture components of the substrates near the corrugated interface.The construction of the corrugated interface can greatly enhance the shear strength by 2−4 times due to the increased contact area and the strong“mechanical gearing”effect.Moreover,the mechanical properties are largely depended on the orientation relationship between corrugated direction and loading direction.展开更多
35% SiCp/2024 Al（volume fraction） composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface con...35% SiCp/2024 Al（volume fraction） composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface conditions were evaluated by tensile modules of elasticity and Brinell hardness measurement. The results show that the overall Si Cp/Al interface condition in this experiment is good and three kinds of Si Cp/Al interfaces are present in the composites, which include vast majority of clean planer interfaces, few slight reaction interfaces and tiny amorphous interfaces. The combination mechanism of Si C and Al in the clean planer interface is the formation of a semi-coherent interface by closely matching of atoms and there are no fixed or preferential crystallographic orientation relationships between Si C and Al. MgAl2O4 spinel particles act as an intermediate to form semi-coherent interface with SiC and Al respectively at the slight reaction interfaces. When the composite is aged at 190 °C for 9 h after being solution-treated at 510 °C for 2 h, numerous discoid-shaped and needle-shaped nanosized precipitates dispersively exist in the composite and are semi-coherent of low mismatch with Al matrix. The Brinell hardness of composites arrives peak value at this time.展开更多
The effects of interface shape on stress wave distribution and attenuation were investiga- ted using finite element method （ FEM ）. The simulation results indicate that when the stress wave propagates from SiC ceram...The effects of interface shape on stress wave distribution and attenuation were investiga- ted using finite element method （ FEM ）. The simulation results indicate that when the stress wave propagates from SiC ceramic to A1 alloy, the tensile stress decreases and the attenuation coefficient of the stress wave increases with increasing central angle of the concave interface between SiC and A1. But for the convex interface, the tensile stress increases and attenuation coefficient decreases with increasing central angle. As the stress wave propagates from A1 alloy to SiC ceramic, the atten- uation coefficient of stress wave decreases with increasing the central angle of the concave interface. For the convex interface, the attenuation coefficient increases with increasing central angle.展开更多
This paper studies two-dimensional analysis of the surface state effect on current gain for a 4H-SiC bipolar junction transistor （BJT）. Simulation results indicate the mechanism of current gain degradation, which is...This paper studies two-dimensional analysis of the surface state effect on current gain for a 4H-SiC bipolar junction transistor （BJT）. Simulation results indicate the mechanism of current gain degradation, which is surface Fermi level pinning leading to a strong downward bending of the energy bands to form the channel of surface electron recombination current. The experimental results are well-matched with the simulation, which is modeled by exponential distributions of the interface state density replacing the single interface state trap. Furthermore, the simulation reveals that the oxide quality of the base emitter junction interface is very important for 4H-SiC BJT performance.展开更多
For the manufacture of Al-based metalmatrix composites, the foundry productionroute can provide less expensive products witha greater flexibility in meeting designer’s needsamong a vaviety of fablication routes. Rece...For the manufacture of Al-based metalmatrix composites, the foundry productionroute can provide less expensive products witha greater flexibility in meeting designer’s needsamong a vaviety of fablication routes. Recent-ly, a commercially produced foundry ingot,the Duralcan composite of A356 Al alloy +20展开更多
On the basis of first principles calculations, we report that the type and density of charge carriers of epitaxial graphene on SiC（O001） can be deliberately controlled by decorating the buffer layer with specific at...On the basis of first principles calculations, we report that the type and density of charge carriers of epitaxial graphene on SiC（O001） can be deliberately controlled by decorating the buffer layer with specific atoms （i.e., F, C1, O, or N）. More importantly, a fine tuning of the doping behavior from intrinsic n-type to charge neutrality to p-type and interface magnetism is achieved via increasing the doping concentration of F atoms on the buffer layer. Our results suggest an interesting avenue to the application of epitaxial graphene in nanoscale electronic and spintronic devices.展开更多
Effective improvement in electrical properties of NO passivated SiC/SiO2 interface after being irradiated by electrons is demonstrated.The density of interface traps after being irradiated by 100-kGy electrons decreas...Effective improvement in electrical properties of NO passivated SiC/SiO2 interface after being irradiated by electrons is demonstrated.The density of interface traps after being irradiated by 100-kGy electrons decreases by about one order of magnitude,specifically,from 3×1012 cm-2·eV-1 to 4×1011 cm-2·eV-1 at 0.2 eV below the conduction band of 4H-SiC without any degradation of electric breakdown field.Particularly,the results of x-ray photoelectron spectroscopy measurement show that the C-N bonds are generated near the interface after electron irradiation,indicating that the carbon-related defects are further reduced.展开更多
Near-interface oxide traps （NIOTs） in 4H-SiC metal-oxide-semiconductor （MOS） structures fabricated with and without annealing in NO are systematically investigated in this paper. The properties of NIOTs in SiC MOS...Near-interface oxide traps （NIOTs） in 4H-SiC metal-oxide-semiconductor （MOS） structures fabricated with and without annealing in NO are systematically investigated in this paper. The properties of NIOTs in SiC MOS structures prepared with and without annealing in NO are studied and compared in detail. Two main categories of the NIOTs, the “slow” and “fast” NIOTs, are revealed and extracted. The densities of the “fast” NIOTs are determined to be 0.761011 cm-2 and 0.471011 cm-2 for the N2 post oxidation annealing （POA） sample and NO POA sample, respectively. The densities of “slow” NIOTs are 0.791011 cm-2 and 9.441011 cm-2 for the NO POA sample and N2 POA sample, respectively. It is found that the NO POA process only can significantly reduce “slow” NIOTs. However, it has a little effect on “fast” NIOTs. The negative and positive constant voltage stresses （CVS） reveal that electrons captured by those “slow” NIOTs and bulk oxide traps （BOTs） are hardly emitted by the constant voltage stress.展开更多
In the welding process of SiCp/Al composites,Al reacts with SiC particles in the molten pool to form Al_(4)C_(3),a brittle phase,damaging the reinforcement and causing a sharp decline in the mechanical properties of w...In the welding process of SiCp/Al composites,Al reacts with SiC particles in the molten pool to form Al_(4)C_(3),a brittle phase,damaging the reinforcement and causing a sharp decline in the mechanical properties of weld joints.To mitigate this,a method of welding SiCp/Al composites by pulsed laser welding with powder-filling is proposed,inhibiting the interface reaction between Al and SiC particles in the molten pool.This study investigates the effect of pulse frequency on the temperature field of the molten pool,and combines thermal-fluid numerical simulation to analyze the peak temperature at different pulse frequencies,optimizing the Si content to ultimately inhibit the interface reaction in the molten pool.Results indicate that an appropriate pulse frequency achieves good welding formation and effectively regulates the peak temperature of the molten pool.Only a small amount of brittle phase is present in the weld joint,creating favorable conditions for the addition of alloying elements.The interface reaction is slowed down by adjusting the pulse frequency,though it is not completely inhibited.When the addition of Si content reaches 8%,the occurrence of the interface reaction is effectively inhibited.In weld joints with the addition of 8wt%Si powder,no Al_(4)C_(3)brittle phase is present,and the tensile strength of the weld joint is 266 MPa,up to 70%of the base material.展开更多
A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes p...A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes possessing good bonding interface have higher shear strength than that of pure aluminum and can bear both axial and radial deformation.The original interface between aluminum layer and ferrite layer was observed by scanning electron microscopy（SEM）.The results show that the clad tubes with good bonding properties possess the interface in wave and straight shape.The Fe/Al clad tube was used to manufacture the T-shape by hydro-bulging.It is found that the good-bonding interface of the Fe/Al clad tube plays a dominant role in the formation of the T-shape.展开更多
A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fractu...A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.展开更多
The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of...The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.展开更多
Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding prope...Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.展开更多
The interface reaction between the SiC particles （ SiCp ） and Fe was stndicd during sintering the SiCp reinforced Fe matrix composites at 1423 K for 1 h. In the composite having 3wt% （weight ratio） SiCp （the 3SiC...The interface reaction between the SiC particles （ SiCp ） and Fe was stndicd during sintering the SiCp reinforced Fe matrix composites at 1423 K for 1 h. In the composite having 3wt% （weight ratio） SiCp （the 3SiCp/ Fe composite）, the interface reaction products of Fe3 Si, the carbon precipitates, and Fe3 C or pearlite were generated. Fe3 Si coustructs the bright matrix of the reaction zone in the original situation of the SiCp. The carbon precipitates are randondy embedded in the reaction zone. Fe3 C or pearlite exists at the grain boundaries of the Fe matrix. As increasing the SiCp concentration in the SiCp/ Fe composite, the inteusity of the interface reaction between SiCp and Fe iacreases. After the 10SiCp/ Fe composite （ having 10wt .% SiCp ） sintered at 1423 K for 1 h, all of SiCp are decomposed, and replaced by the reaction zone composed of Fe3 Si and the carbon precipitates. No Fe3 C or pearlite was genertaed during the reaction. The effects of the techniques of oxidizing of SiCp , coating SiCp by interaction with the Cr powder, and alloying the Fe matrix by adding the Cr element on the interface stability of the SiCp/ Fe composite system were also investigated, respectitely. The oxide membrane and the coating layer on SiCp can inhibit the interface reaction between SiCp and Fe by isolating SiCp from the Fe matrix during sintering. The interface reaction does not occur in the 3 SiCp/ Fe- 10 Cr composite but in the 3 SiCp/ Fe-5 Cr composite. In the SiCp/ Fe-Cr alloy composites, the interface reaction between SiCp and the Fe- Cr alloys is weaker than that between SiCp and Fe . The Cr element behaves as a diluent, it causes a redaction in the interface reaction, which is proportional to the amount of the element added.展开更多
This review summarizes the work carried out in the field of interface study in carbon nanotube reinforced aluminum （CNT/A1） composites. Much research work has been conducted to reveal the evolution of CNT/A1 interfa...This review summarizes the work carried out in the field of interface study in carbon nanotube reinforced aluminum （CNT/A1） composites. Much research work has been conducted to reveal the evolution of CNT/A1 interface in producing the composite with the purpose of achieving uniform distribution of CNTs and tight interfacial bonding. The effect and principles of coating were reviewed along with the illustration of ＂intermetallic interphases＂ design. Different roles of CNT/Al interface in structural and functional application were elucidated, and the future work that needs attention was addressed.展开更多
The （submicron ＋ micron） SiCp-reinforced magnesium matrix composite was fabricated by stir casting. After the application of forging and extrusion, the interface between SiCp and Mg in the composite was investigate...The （submicron ＋ micron） SiCp-reinforced magnesium matrix composite was fabricated by stir casting. After the application of forging and extrusion, the interface between SiCp and Mg in the composite was investigated by transmission electron microscopy. Results show that the interfacial characterization was different at the interfaces of micron-SiCp/Mg and submicron-SiCp/Mg. While most interfaces between micron-SiCp and Mg were clean, the precip- itated Mg17A112 phase as well as dispersedly distributed nano-MgO particles was observed at some interfaces. Unlike the interface between micron-SiCp and Mg, no interfacial reaction product was found at the interface between submicron-SiCp and Mg in the present study. Besides, the specific orientation relationships were found at the interfaces between submicron- SiCp and Mg, which was thought to have developed during hot deformation process. At the fracture surface of the composite, the microcracks were found at the interface between micron-SiCp and Mg, while the interfacial bonding between submicron-SiCp and Mg was very well.展开更多
Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,an...Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.展开更多
基金supported by Guangdong Major Project of Basic and Applied Basic Research, China (No. 2020B0301030006)Fundamental Research Funds for the Central Universities, China (No. SWU-XDJH202313)+1 种基金Chongqing Postdoctoral Science Foundation Funded Project, China (No. 2112012728014435)the Chongqing Postgraduate Research and Innovation Project, China (No. CYS23197)。
文摘A new method was proposed for preparing AZ31/1060 composite plates with a corrugated interface,which involved cold-pressing a corrugated surface on the Al plate and then hot-pressing the assembled Mg/Al plate.The results show that cold-pressing produces intense plastic deformation near the corrugated surface of the Al plate,which promotes dynamic recrystallization of the Al substrate near the interface during the subsequent hot-pressing.In addition,the initial corrugation on the surface of the Al plate also changes the local stress state near the interface during hot pressing,which has a large effect on the texture components of the substrates near the corrugated interface.The construction of the corrugated interface can greatly enhance the shear strength by 2−4 times due to the increased contact area and the strong“mechanical gearing”effect.Moreover,the mechanical properties are largely depended on the orientation relationship between corrugated direction and loading direction.
基金Project(51371077)supported by the National Natural Science Foundation of China
文摘35% SiCp/2024 Al（volume fraction） composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface conditions were evaluated by tensile modules of elasticity and Brinell hardness measurement. The results show that the overall Si Cp/Al interface condition in this experiment is good and three kinds of Si Cp/Al interfaces are present in the composites, which include vast majority of clean planer interfaces, few slight reaction interfaces and tiny amorphous interfaces. The combination mechanism of Si C and Al in the clean planer interface is the formation of a semi-coherent interface by closely matching of atoms and there are no fixed or preferential crystallographic orientation relationships between Si C and Al. MgAl2O4 spinel particles act as an intermediate to form semi-coherent interface with SiC and Al respectively at the slight reaction interfaces. When the composite is aged at 190 °C for 9 h after being solution-treated at 510 °C for 2 h, numerous discoid-shaped and needle-shaped nanosized precipitates dispersively exist in the composite and are semi-coherent of low mismatch with Al matrix. The Brinell hardness of composites arrives peak value at this time.
基金Supported by the National Basic Research Program of China("973" Program)(613135)
文摘The effects of interface shape on stress wave distribution and attenuation were investiga- ted using finite element method （ FEM ）. The simulation results indicate that when the stress wave propagates from SiC ceramic to A1 alloy, the tensile stress decreases and the attenuation coefficient of the stress wave increases with increasing central angle of the concave interface between SiC and A1. But for the convex interface, the tensile stress increases and attenuation coefficient decreases with increasing central angle. As the stress wave propagates from A1 alloy to SiC ceramic, the atten- uation coefficient of stress wave decreases with increasing the central angle of the concave interface. For the convex interface, the attenuation coefficient increases with increasing central angle.
文摘This paper studies two-dimensional analysis of the surface state effect on current gain for a 4H-SiC bipolar junction transistor （BJT）. Simulation results indicate the mechanism of current gain degradation, which is surface Fermi level pinning leading to a strong downward bending of the energy bands to form the channel of surface electron recombination current. The experimental results are well-matched with the simulation, which is modeled by exponential distributions of the interface state density replacing the single interface state trap. Furthermore, the simulation reveals that the oxide quality of the base emitter junction interface is very important for 4H-SiC BJT performance.
文摘For the manufacture of Al-based metalmatrix composites, the foundry productionroute can provide less expensive products witha greater flexibility in meeting designer’s needsamong a vaviety of fablication routes. Recent-ly, a commercially produced foundry ingot,the Duralcan composite of A356 Al alloy +20
基金supported by the National Natural Science Foundation of China(Grant Nos.61335006,61378073,and 61527817)the Beijing Municipal Science and Technology Committee,China(Grant No.Z151100003315006)Fundamental Research Funds for the Central Universities of Beijing Jiaotong University,China(Grant No.2012YJS123)
文摘On the basis of first principles calculations, we report that the type and density of charge carriers of epitaxial graphene on SiC（O001） can be deliberately controlled by decorating the buffer layer with specific atoms （i.e., F, C1, O, or N）. More importantly, a fine tuning of the doping behavior from intrinsic n-type to charge neutrality to p-type and interface magnetism is achieved via increasing the doping concentration of F atoms on the buffer layer. Our results suggest an interesting avenue to the application of epitaxial graphene in nanoscale electronic and spintronic devices.
基金Project supported by the National Key Research and Development Program of China(Grant No.2016YFB0100601)the National Natural Science Foundation of China(Grant Nos.61674169 and 61974159).
文摘Effective improvement in electrical properties of NO passivated SiC/SiO2 interface after being irradiated by electrons is demonstrated.The density of interface traps after being irradiated by 100-kGy electrons decreases by about one order of magnitude,specifically,from 3×1012 cm-2·eV-1 to 4×1011 cm-2·eV-1 at 0.2 eV below the conduction band of 4H-SiC without any degradation of electric breakdown field.Particularly,the results of x-ray photoelectron spectroscopy measurement show that the C-N bonds are generated near the interface after electron irradiation,indicating that the carbon-related defects are further reduced.
基金Project supported by the National Key Basic Research Program of China(Grant No.2015CB759600)the Natural Science Basic Research Plan in Shaanxi Province,China(Grant No.2017JM6003)the National Natural Science Foundation of China(Grant Nos.61774117 61404098 and 61274079)
文摘Near-interface oxide traps （NIOTs） in 4H-SiC metal-oxide-semiconductor （MOS） structures fabricated with and without annealing in NO are systematically investigated in this paper. The properties of NIOTs in SiC MOS structures prepared with and without annealing in NO are studied and compared in detail. Two main categories of the NIOTs, the “slow” and “fast” NIOTs, are revealed and extracted. The densities of the “fast” NIOTs are determined to be 0.761011 cm-2 and 0.471011 cm-2 for the N2 post oxidation annealing （POA） sample and NO POA sample, respectively. The densities of “slow” NIOTs are 0.791011 cm-2 and 9.441011 cm-2 for the NO POA sample and N2 POA sample, respectively. It is found that the NO POA process only can significantly reduce “slow” NIOTs. However, it has a little effect on “fast” NIOTs. The negative and positive constant voltage stresses （CVS） reveal that electrons captured by those “slow” NIOTs and bulk oxide traps （BOTs） are hardly emitted by the constant voltage stress.
基金Supported by Equipment Pre-Research Foundation of China(Grant No.50923030512)。
文摘In the welding process of SiCp/Al composites,Al reacts with SiC particles in the molten pool to form Al_(4)C_(3),a brittle phase,damaging the reinforcement and causing a sharp decline in the mechanical properties of weld joints.To mitigate this,a method of welding SiCp/Al composites by pulsed laser welding with powder-filling is proposed,inhibiting the interface reaction between Al and SiC particles in the molten pool.This study investigates the effect of pulse frequency on the temperature field of the molten pool,and combines thermal-fluid numerical simulation to analyze the peak temperature at different pulse frequencies,optimizing the Si content to ultimately inhibit the interface reaction in the molten pool.Results indicate that an appropriate pulse frequency achieves good welding formation and effectively regulates the peak temperature of the molten pool.Only a small amount of brittle phase is present in the weld joint,creating favorable conditions for the addition of alloying elements.The interface reaction is slowed down by adjusting the pulse frequency,though it is not completely inhibited.When the addition of Si content reaches 8%,the occurrence of the interface reaction is effectively inhibited.In weld joints with the addition of 8wt%Si powder,no Al_(4)C_(3)brittle phase is present,and the tensile strength of the weld joint is 266 MPa,up to 70%of the base material.
基金Project(BA2006067)supported by Achievement Transitional Foundation of Jiangsu Province,China
文摘A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes possessing good bonding interface have higher shear strength than that of pure aluminum and can bear both axial and radial deformation.The original interface between aluminum layer and ferrite layer was observed by scanning electron microscopy（SEM）.The results show that the clad tubes with good bonding properties possess the interface in wave and straight shape.The Fe/Al clad tube was used to manufacture the T-shape by hydro-bulging.It is found that the good-bonding interface of the Fe/Al clad tube plays a dominant role in the formation of the T-shape.
基金Projects (51274054,51375070,51271042) supported by the National Natural Science Foundation of ChinaProjects (2013M530913) supported by the China Postdoctoral Science Foundation
文摘A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.
基金the National Natural Science Foundation of China (No. 50375019).
文摘The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.
基金Project supported by the Fundamental Materials Development funded by the Korean Ministry of Knowledge Economy
文摘Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.
基金Funded by the Natural Science Foundation of Anhui Province(No.050440704)
文摘The interface reaction between the SiC particles （ SiCp ） and Fe was stndicd during sintering the SiCp reinforced Fe matrix composites at 1423 K for 1 h. In the composite having 3wt% （weight ratio） SiCp （the 3SiCp/ Fe composite）, the interface reaction products of Fe3 Si, the carbon precipitates, and Fe3 C or pearlite were generated. Fe3 Si coustructs the bright matrix of the reaction zone in the original situation of the SiCp. The carbon precipitates are randondy embedded in the reaction zone. Fe3 C or pearlite exists at the grain boundaries of the Fe matrix. As increasing the SiCp concentration in the SiCp/ Fe composite, the inteusity of the interface reaction between SiCp and Fe iacreases. After the 10SiCp/ Fe composite （ having 10wt .% SiCp ） sintered at 1423 K for 1 h, all of SiCp are decomposed, and replaced by the reaction zone composed of Fe3 Si and the carbon precipitates. No Fe3 C or pearlite was genertaed during the reaction. The effects of the techniques of oxidizing of SiCp , coating SiCp by interaction with the Cr powder, and alloying the Fe matrix by adding the Cr element on the interface stability of the SiCp/ Fe composite system were also investigated, respectitely. The oxide membrane and the coating layer on SiCp can inhibit the interface reaction between SiCp and Fe by isolating SiCp from the Fe matrix during sintering. The interface reaction does not occur in the 3 SiCp/ Fe- 10 Cr composite but in the 3 SiCp/ Fe-5 Cr composite. In the SiCp/ Fe-Cr alloy composites, the interface reaction between SiCp and the Fe- Cr alloys is weaker than that between SiCp and Fe . The Cr element behaves as a diluent, it causes a redaction in the interface reaction, which is proportional to the amount of the element added.
基金financially supported by the National Basic Research Program of China (No.2012CB619600)the National Natural Science Foundation of China (Nos.51131004,51071100,and 51001071)+1 种基金the National High Technology Research and Development Program of China (No.2012AA030311)Shanghai Science & Technology Committee (Nos.11JC1405500)
文摘This review summarizes the work carried out in the field of interface study in carbon nanotube reinforced aluminum （CNT/A1） composites. Much research work has been conducted to reveal the evolution of CNT/A1 interface in producing the composite with the purpose of achieving uniform distribution of CNTs and tight interfacial bonding. The effect and principles of coating were reviewed along with the illustration of ＂intermetallic interphases＂ design. Different roles of CNT/Al interface in structural and functional application were elucidated, and the future work that needs attention was addressed.
基金financially supported by the National Natural Science Foundation of China (Nos.51201112,51101043,and 51174143)the Natural Science Foundation of Shanxi province (No.2013021013-3)
文摘The （submicron ＋ micron） SiCp-reinforced magnesium matrix composite was fabricated by stir casting. After the application of forging and extrusion, the interface between SiCp and Mg in the composite was investigated by transmission electron microscopy. Results show that the interfacial characterization was different at the interfaces of micron-SiCp/Mg and submicron-SiCp/Mg. While most interfaces between micron-SiCp and Mg were clean, the precip- itated Mg17A112 phase as well as dispersedly distributed nano-MgO particles was observed at some interfaces. Unlike the interface between micron-SiCp and Mg, no interfacial reaction product was found at the interface between submicron-SiCp and Mg in the present study. Besides, the specific orientation relationships were found at the interfaces between submicron- SiCp and Mg, which was thought to have developed during hot deformation process. At the fracture surface of the composite, the microcracks were found at the interface between micron-SiCp and Mg, while the interfacial bonding between submicron-SiCp and Mg was very well.
基金Project(51474189)supported by the National Natural Science Foundation of ChinaProject(QN2015214)supported by the Educational Commission of Hebei Province,China
文摘Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.
