The electrochemical reaction mechanism and electrocrystallization process of Cu on copper electrode in the eutectic NaC1-KC1-CuC1 molten salt were investigated by means of cyclic voltammetry, chronopotentiometry and c...The electrochemical reaction mechanism and electrocrystallization process of Cu on copper electrode in the eutectic NaC1-KC1-CuC1 molten salt were investigated by means of cyclic voltammetry, chronopotentiometry and chronoamperometry tech-nique at 710℃. The results show that the electrochemical reaction process of Cu is a quasi-reversible process mix-controlled by Cu＋ diffusion rate and electron transport rate;the electrochemical reduction mechanism is Cu＋e→Cu;the electrocrystallization process of copper is an instantaneous hemispheroid three-dimensional nucleation process; the Cu diffusino coefficient is 4.3×10^-4cm^2·s^-1 under the experimental conditions.展开更多
基金supported by the National Natural Science Foundation of China (No.51074060)
文摘The electrochemical reaction mechanism and electrocrystallization process of Cu on copper electrode in the eutectic NaC1-KC1-CuC1 molten salt were investigated by means of cyclic voltammetry, chronopotentiometry and chronoamperometry tech-nique at 710℃. The results show that the electrochemical reaction process of Cu is a quasi-reversible process mix-controlled by Cu＋ diffusion rate and electron transport rate;the electrochemical reduction mechanism is Cu＋e→Cu;the electrocrystallization process of copper is an instantaneous hemispheroid three-dimensional nucleation process; the Cu diffusino coefficient is 4.3×10^-4cm^2·s^-1 under the experimental conditions.
