Alkali-free SiO_(2)-Al_(2)O_(3)-CaO-MgO with different SiO_(2)/Al_(2)O_(3)mass ratios was prepared by conventional melt quenching method.The glass network structure,thermodynamic properties and elastic modulus changes...Alkali-free SiO_(2)-Al_(2)O_(3)-CaO-MgO with different SiO_(2)/Al_(2)O_(3)mass ratios was prepared by conventional melt quenching method.The glass network structure,thermodynamic properties and elastic modulus changes with SiO_(2)and Al_(2)O_(3)ratios were investigated using various techniques.It is found that when SiO_(2)is replaced by Al_(2)O_(3),the Q^(4) to Q^(3) transition of silicon-oxygen network decreases while the aluminum-oxygen network increases,which result in the transformation of Si-O-Si bonds to Si-O-Al bonds and an increase in glass network connectivity even though the intermolecular bond strength decreases.The glass transition temperature(T_(g))increases continuously,while the thermal expansion coefficient increases and high-temperature viscosity first decreases and then increases.Meanwhile,the elastic modulus values increase from 93 to 102 GPa.This indicates that the elastic modulus is mainly affected by packing factor and dissociation energy,and elements with higher packing factors and dissociation energies supplant those with lower values,resulting in increased rigidity within the glass.展开更多
基金Supported by the National Key Research Program(No.2024-1129-954-112)National Natural Science Foundation of China(No.52372033)Guangxi Science and Technology Major Program(No.AA24263054)。
文摘Alkali-free SiO_(2)-Al_(2)O_(3)-CaO-MgO with different SiO_(2)/Al_(2)O_(3)mass ratios was prepared by conventional melt quenching method.The glass network structure,thermodynamic properties and elastic modulus changes with SiO_(2)and Al_(2)O_(3)ratios were investigated using various techniques.It is found that when SiO_(2)is replaced by Al_(2)O_(3),the Q^(4) to Q^(3) transition of silicon-oxygen network decreases while the aluminum-oxygen network increases,which result in the transformation of Si-O-Si bonds to Si-O-Al bonds and an increase in glass network connectivity even though the intermolecular bond strength decreases.The glass transition temperature(T_(g))increases continuously,while the thermal expansion coefficient increases and high-temperature viscosity first decreases and then increases.Meanwhile,the elastic modulus values increase from 93 to 102 GPa.This indicates that the elastic modulus is mainly affected by packing factor and dissociation energy,and elements with higher packing factors and dissociation energies supplant those with lower values,resulting in increased rigidity within the glass.
