期刊文献+
共找到2篇文章
< 1 >
每页显示 20 50 100
Corrosion and Copper Foil Formation Behavior of Laser-Welded Joint and Spin-Formed Materials of Commercially Pure Titanium in H_(2)SO_(4)/CuSO_(4) Electrolyte 被引量:1
1
作者 Ren Lina Song Yanfei +4 位作者 Qi Liang Yang Jian Yang Jiadian Lei Xiaowei Zhang Jianxun 《稀有金属材料与工程》 北大核心 2025年第6期1467-1477,共11页
Based on the microstructure characterization,electrochemical impedance spectroscopy,potentiodynamic polarization,and immersion corrosion,this work comparatively analyzed the differences in the electrochemical corrosio... Based on the microstructure characterization,electrochemical impedance spectroscopy,potentiodynamic polarization,and immersion corrosion,this work comparatively analyzed the differences in the electrochemical corrosion morphology and post-foil formation surface morphology of laser beam welded(LBW)sample and spin-formed sample,and compared the corrosion resistance and Cu foil formation ability of two samples in H_(2)SO_(4)/NaCl solution and CuSO_(4) reducing electrolyte.Results show that in H_(2)SO_(4) and NaCl solutions,LBW sample and spin-formed sample exhibit excellent passivation ability and corrosion resistance.Both samples show uniform corrosion morphologies and similar corrosion resistance in the strong acidic solution containing Cl^(-).Meanwhile,the Cu foil formation ability of the welded joint is similar to that of the spin-formed sample,and both samples obtain intact Cu foils with high-quality surfaces and small differences in properties. 展开更多
关键词 Ti cathode laser beam welding spin forming CORROSION cu foil electroplating
原文传递
Performance improvement of Ga N-based light-emitting diodes transferred from Si(111) substrate onto electroplating Cu submount with embedded wide p-electrodes
2
作者 柳铭岗 王云茜 +11 位作者 杨亿斌 林秀其 向鹏 陈伟杰 韩小标 臧文杰 廖强 林佳利 罗慧 吴志盛 刘扬 张佰君 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第3期428-433,共6页
Crack-free Ga N/In Ga N multiple quantum wells(MQWs) light-emitting diodes(LEDs) are transferred from Si substrate onto electroplating Cu submount with embedded wide p-electrodes. The vertical-conducting n-side-up... Crack-free Ga N/In Ga N multiple quantum wells(MQWs) light-emitting diodes(LEDs) are transferred from Si substrate onto electroplating Cu submount with embedded wide p-electrodes. The vertical-conducting n-side-up configuration of the LED is achieved by using the through-hole structure. The widened embedded p-electrode covers almost the whole transparent conductive layer(TCL), which could not be applied in the conventional p-side-up LEDs due to the electrodeshading effect. Therefore, the widened p-electrode improves the current spreading property and the uniformity of luminescence. The working voltage and series resistance are thereby reduced. The light output of embedded wide p-electrode LEDs on Cu is enhanced by 147% at a driving current of 350 m A, in comparison to conventional LEDs on Si. 展开更多
关键词 light-emitting diodes embedded wide p-electrodes Si substrate electroplating cu submount
原文传递
上一页 1 下一页 到第
使用帮助 返回顶部