Although bimodal copper(Cu)pastes can balance sintering driving force and material stability,they still require higher temperatures and pressures to achieve densification due to the lack of an optimal particle stackin...Although bimodal copper(Cu)pastes can balance sintering driving force and material stability,they still require higher temperatures and pressures to achieve densification due to the lack of an optimal particle stacking model and systematic optimization design.Here,a multimodal nonspherical particle stacking model was developed using computer simulation technology,resulting in sphere-flake hybrid Cu pastes with high stacking density,enhanced sintering driving force,and low shrinkage.The design principles for bimodal Cu pastes are further refined by synergistically combining computer simulations with experimental validation.The optimized bimodal ratio achieved a joint shear strength of 42.51 MPa under pressureless sintering at 250℃ for 15 min.Moreover,the Cu paste demonstrated compatibility with Ni/Ag/Au metallization and large-area sintering.It is believed that the computer-designed sphere-flake hybrid pastes offer high potential for high-power electronics packaging.展开更多
基金supported by the National Natural Science Foundation of China(No.52201289)the Natural Science Foundation of Jiangsu Province(No.BK20221095)+1 种基金China Postdoctoral Science Foundation(No.2022M720055)the Fundamental Research Funds for the Central Universities(No.JUSRP202406005).
文摘Although bimodal copper(Cu)pastes can balance sintering driving force and material stability,they still require higher temperatures and pressures to achieve densification due to the lack of an optimal particle stacking model and systematic optimization design.Here,a multimodal nonspherical particle stacking model was developed using computer simulation technology,resulting in sphere-flake hybrid Cu pastes with high stacking density,enhanced sintering driving force,and low shrinkage.The design principles for bimodal Cu pastes are further refined by synergistically combining computer simulations with experimental validation.The optimized bimodal ratio achieved a joint shear strength of 42.51 MPa under pressureless sintering at 250℃ for 15 min.Moreover,the Cu paste demonstrated compatibility with Ni/Ag/Au metallization and large-area sintering.It is believed that the computer-designed sphere-flake hybrid pastes offer high potential for high-power electronics packaging.
