基于板上芯片(chip on board,COB)封装技术的LED因其高光效和高密度集成等性能,逐渐成为照明、显示和特种光源领域的核心技术。聚焦COB封装材料体系,系统分析高折射率封装材料、高导热基板材料和荧光转材料,构建热-电-光耦合模型,提出...基于板上芯片(chip on board,COB)封装技术的LED因其高光效和高密度集成等性能,逐渐成为照明、显示和特种光源领域的核心技术。聚焦COB封装材料体系,系统分析高折射率封装材料、高导热基板材料和荧光转材料,构建热-电-光耦合模型,提出界面热阻优化与光色品质提升方案,使CON-LED的光效大幅提高,为高功率密度LED器件的产业化提供了理论性指导支持。展开更多
Carbon nanotubes(CNTs)supported CoB and CoBSn catalysts were synthesized for hydrogen production via NaBH4 hydrolysis.The roles of Sn-promoter and the effect of CNTs treatment on CoB catalysts were evaluated and discu...Carbon nanotubes(CNTs)supported CoB and CoBSn catalysts were synthesized for hydrogen production via NaBH4 hydrolysis.The roles of Sn-promoter and the effect of CNTs treatment on CoB catalysts were evaluated and discussed.It is found that after the addition of Sn promoter,the specific surface area and the generation of active CoB phase are increased,while the oxidation treatment of CNTs results in more loading amounts of active components and enrichment of electron at active sites as well as large surface area.Consequently,the Sn-doped CoB catalysts supported on CNTs with oxidation treatment exhibits a significantly improved activity with a high H_(2)generation rate of 2640 mL/(min·g).Meanwhile,this catalyst shows a low activation energy of 43.7 kJ/mol and relatively high reusability.展开更多
针对LED高光效、低功耗的要求,在分析LED光学性能的基础上,采用了COB（chip on board）即板上芯片封装技术。研究了不同电流下和点亮不同时间后,分析其LED光通量、光效和色温。研究分析影响LED光学性能的因素并进行测试。结果表明,用两...针对LED高光效、低功耗的要求,在分析LED光学性能的基础上,采用了COB（chip on board）即板上芯片封装技术。研究了不同电流下和点亮不同时间后,分析其LED光通量、光效和色温。研究分析影响LED光学性能的因素并进行测试。结果表明,用两种色温接近3 000 K的样品,电流由500 m A增大到900 m A,色温升高了1.685%、2.626%,光通量也随着电流的变大而升高68.532%、84.625%,但相反光效却降低了13.535%、9.971%;而在电流保持不变的情况下,点亮的时间由0~1 min、0~5 min、0~10 min,其色温分别上升了0.537%、1.209%、2.384%;0.369%、1.104%、2.943%,同时,光通量分别降低1.474%、4.855%、7.493%;2.073%、3.859%、7.793%,光效也分别降低2.527%、4.617%、6.671%;2.171%、4.903%、7.579%。实验发现,电流与点亮时间直接影响LED光学性能。展开更多
对比分析目前商用大功率COB(Chip On Board)封装硅胶的性能;总结近年来大功率COB LED封装的国内外研究进展,重点分析COB封装散热结构的研究情况;根据研究及应用情况,指出COB封装过程中的一些关键的技术问题,并针对这些问题给出一些合理...对比分析目前商用大功率COB(Chip On Board)封装硅胶的性能;总结近年来大功率COB LED封装的国内外研究进展,重点分析COB封装散热结构的研究情况;根据研究及应用情况,指出COB封装过程中的一些关键的技术问题,并针对这些问题给出一些合理化的解决方案。摘要:展开更多
文摘基于板上芯片(chip on board,COB)封装技术的LED因其高光效和高密度集成等性能,逐渐成为照明、显示和特种光源领域的核心技术。聚焦COB封装材料体系,系统分析高折射率封装材料、高导热基板材料和荧光转材料,构建热-电-光耦合模型,提出界面热阻优化与光色品质提升方案,使CON-LED的光效大幅提高,为高功率密度LED器件的产业化提供了理论性指导支持。
基金supported by National Natural Science Foundation of China(22276144).
文摘Carbon nanotubes(CNTs)supported CoB and CoBSn catalysts were synthesized for hydrogen production via NaBH4 hydrolysis.The roles of Sn-promoter and the effect of CNTs treatment on CoB catalysts were evaluated and discussed.It is found that after the addition of Sn promoter,the specific surface area and the generation of active CoB phase are increased,while the oxidation treatment of CNTs results in more loading amounts of active components and enrichment of electron at active sites as well as large surface area.Consequently,the Sn-doped CoB catalysts supported on CNTs with oxidation treatment exhibits a significantly improved activity with a high H_(2)generation rate of 2640 mL/(min·g).Meanwhile,this catalyst shows a low activation energy of 43.7 kJ/mol and relatively high reusability.
文摘针对LED高光效、低功耗的要求,在分析LED光学性能的基础上,采用了COB（chip on board）即板上芯片封装技术。研究了不同电流下和点亮不同时间后,分析其LED光通量、光效和色温。研究分析影响LED光学性能的因素并进行测试。结果表明,用两种色温接近3 000 K的样品,电流由500 m A增大到900 m A,色温升高了1.685%、2.626%,光通量也随着电流的变大而升高68.532%、84.625%,但相反光效却降低了13.535%、9.971%;而在电流保持不变的情况下,点亮的时间由0~1 min、0~5 min、0~10 min,其色温分别上升了0.537%、1.209%、2.384%;0.369%、1.104%、2.943%,同时,光通量分别降低1.474%、4.855%、7.493%;2.073%、3.859%、7.793%,光效也分别降低2.527%、4.617%、6.671%;2.171%、4.903%、7.579%。实验发现,电流与点亮时间直接影响LED光学性能。
