To enhance device performance and reduce fabrication cost,a series of electron transporting material(ETM)-free perovskite solar cells(PSCs)is developed by TCAD Atlas.The accuracy of the physical mode of PSCs is verifi...To enhance device performance and reduce fabrication cost,a series of electron transporting material(ETM)-free perovskite solar cells(PSCs)is developed by TCAD Atlas.The accuracy of the physical mode of PSCs is verified,due to the simulations of PEDOT:PSS-CH_(3)NH_(3)PbI_(3)-PCBM and CuSCN-CH_(3)NH_(3)PbI_(3)-PCBM p-i-n PSCs showing a good agreement with experimental results.Different hole transporting materials(HTMs)are selected and directly combined with n-CH_(3)NH_(3)PbI_(3),and the CuSCN-CH_(3)NH_(3)PbI_(3) is the best in these ETM-free PSCs.To further study the CuSCN-CH_(3)NH_(3)PbI_(3) PSC,the influences of back electrode material,gradient band gap,thickness,doping concentration,and bulk defect density on the performance are investigated.Energy band and distribution of electric field are utilized to optimize the design.As a result,the efficiency of CuSCN-CH_(3)NH_(3)PbI_(3) PSC is achieved to be 26.64%.This study provides the guideline for designing and improving the performances of ETM-free PSCs.展开更多
Reported are the results of reduction the bending of thin crystalline silicon solar cells after printing and sintering of back electrode by changing the back electrode paste and adjusting the screen printing parameter...Reported are the results of reduction the bending of thin crystalline silicon solar cells after printing and sintering of back electrode by changing the back electrode paste and adjusting the screen printing parameters without effecting the electrical properties of the cell.Theory and experiments showed that the bending of the cell is changed with its thickness of substrate,the thinner cell,the more serious bending.The bending of the cell is decreased with the thickness decrease of the back contact paste.The substrate with the thickness of 190 μm printing with sheet aluminum paste shows a relatively lower bend compared with that of the substrate printing with ordinary aluminum paste,and the minimum bend is 0.55 mm which is reduced by 52%.展开更多
基金the Fundamental Research Funds for the Central Universities of China(Grant No.JD2020JGPY0010)the China Post-Doctoral Science Foundation(Grant No.2020M671834).
文摘To enhance device performance and reduce fabrication cost,a series of electron transporting material(ETM)-free perovskite solar cells(PSCs)is developed by TCAD Atlas.The accuracy of the physical mode of PSCs is verified,due to the simulations of PEDOT:PSS-CH_(3)NH_(3)PbI_(3)-PCBM and CuSCN-CH_(3)NH_(3)PbI_(3)-PCBM p-i-n PSCs showing a good agreement with experimental results.Different hole transporting materials(HTMs)are selected and directly combined with n-CH_(3)NH_(3)PbI_(3),and the CuSCN-CH_(3)NH_(3)PbI_(3) is the best in these ETM-free PSCs.To further study the CuSCN-CH_(3)NH_(3)PbI_(3) PSC,the influences of back electrode material,gradient band gap,thickness,doping concentration,and bulk defect density on the performance are investigated.Energy band and distribution of electric field are utilized to optimize the design.As a result,the efficiency of CuSCN-CH_(3)NH_(3)PbI_(3) PSC is achieved to be 26.64%.This study provides the guideline for designing and improving the performances of ETM-free PSCs.
基金Yunnan Provincial Natural Science Fundation(2007E197 M)
文摘Reported are the results of reduction the bending of thin crystalline silicon solar cells after printing and sintering of back electrode by changing the back electrode paste and adjusting the screen printing parameters without effecting the electrical properties of the cell.Theory and experiments showed that the bending of the cell is changed with its thickness of substrate,the thinner cell,the more serious bending.The bending of the cell is decreased with the thickness decrease of the back contact paste.The substrate with the thickness of 190 μm printing with sheet aluminum paste shows a relatively lower bend compared with that of the substrate printing with ordinary aluminum paste,and the minimum bend is 0.55 mm which is reduced by 52%.
