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Continuous synthesis of ammonia
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作者 Hang Wang Qi Wang Chuan-De Wu 《Chinese Journal of Structural Chemistry》 2025年第3期1-3,共3页
Ammonia(NH_(3))is considered as one of the essential feedstocks in the fertilizer and chemical industries,serving as an ideal zero-carbon energy carrier.The ammonia synthesis process relies on Haber-Bosch process,prim... Ammonia(NH_(3))is considered as one of the essential feedstocks in the fertilizer and chemical industries,serving as an ideal zero-carbon energy carrier.The ammonia synthesis process relies on Haber-Bosch process,primarily involving the reaction between hydrogen(H_(2))and nitrogen(N_(2))at temperatures ranging from 400 to 500℃ and pressures exceeding 100 bar.A global total of 180 million metric tons of ammonia were produced annually in centralized industrial plants through the Haber-Bosch process,which consumes roughly 1% of the global energy supply and contributes over 1.3% of global carbon dioxide emissions[1]. 展开更多
关键词 NITROGEN haber bosch process TEMPERATURES zero carbon energy carrier chemical industry HYDROGEN fertilizer industry pressures
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Investigation of etching method for fabricating deep through holes on ultra-high resistivity silicon
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作者 Lin Du Shengrui Xu +3 位作者 Ying Wang Ling Lü Jincheng Zhang Yue Hao 《Journal of Semiconductors》 EI CAS CSCD 2017年第5期106-110,共5页
In this paper,the etching characteristics of the ultra-high resistivity silicon(UHRS) by using the Bosch process were investigated.The experimental results indicated that the sulfur hexafluoride flux,the temperature... In this paper,the etching characteristics of the ultra-high resistivity silicon(UHRS) by using the Bosch process were investigated.The experimental results indicated that the sulfur hexafluoride flux,the temperature of the substrate,the platen power and the etching intermittence had important influence on the etching rate and the etching morphology of the UHRS.The profiles and morphologies of sidewall were characterized with scanning electron microscopy(SEM).By using an improved three-stage Bosch process,380-μm deep through holes were fabricated on the UHRS with the average etching rate of about 3.14 μm/min.Meanwhile,the fabrication mechanism of deep through holes on the UHRS by using the three-stage Bosch process was illustrated on the basis of the experimental results. 展开更多
关键词 ultra-high resistivity silicon deep through hole three-stage etching method bosch process
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