Mini light-emitting diodes(Mini-LEDs)show great application potential in high-end displays owing to their superior pixel density,brightness,responsiveness,and efficiency.However,current packaging materials for Mini-LE...Mini light-emitting diodes(Mini-LEDs)show great application potential in high-end displays owing to their superior pixel density,brightness,responsiveness,and efficiency.However,current packaging materials for Mini-LEDs are predominantly thermally cured,which is energy-and time-consuming and can adversely affect electronic components.In this study,a novel UV-curable silicone resin containing phenyl,disulfide,and acryloyl groups(SPASR)is developed from commercially available siloxanes.The resin exhibits a refractive index(n_(d))higher than 1.5,and it can be cured within 30 s under UV irradiation.After curing,it exhibits an optical transparency exceeding 92%,a lap adhesion strength of up to1.84 MPa,and good thermostability(T_(5%)>265℃).Notably,the volume shrinkage is less than 4.83%,attributed to the release of photopolymerization stress via UV-induced disulfide metathesis during UV curing.Mini-LEDs encapsulated with this resin show luminescence properties comparable to those of conventional thermally-cured sealants,and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h.Consequently,these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation,offering a more reliable and efficient solution for the electronics industry.展开更多
基金financially supported by the National Natural Science Foundation of China(No.52273104)。
文摘Mini light-emitting diodes(Mini-LEDs)show great application potential in high-end displays owing to their superior pixel density,brightness,responsiveness,and efficiency.However,current packaging materials for Mini-LEDs are predominantly thermally cured,which is energy-and time-consuming and can adversely affect electronic components.In this study,a novel UV-curable silicone resin containing phenyl,disulfide,and acryloyl groups(SPASR)is developed from commercially available siloxanes.The resin exhibits a refractive index(n_(d))higher than 1.5,and it can be cured within 30 s under UV irradiation.After curing,it exhibits an optical transparency exceeding 92%,a lap adhesion strength of up to1.84 MPa,and good thermostability(T_(5%)>265℃).Notably,the volume shrinkage is less than 4.83%,attributed to the release of photopolymerization stress via UV-induced disulfide metathesis during UV curing.Mini-LEDs encapsulated with this resin show luminescence properties comparable to those of conventional thermally-cured sealants,and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h.Consequently,these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation,offering a more reliable and efficient solution for the electronics industry.
