通过定量表征宽温域下,各强化机制对纳米颗粒增强金属基复合材料(nanoparticle reinforced metal matrix composites,NRMMCs)的屈服强度以及晶界滑移对金属基体屈服强度的影响,建立了不含拟合参数的NRMMCs温度相关性屈服强度理论表征模...通过定量表征宽温域下,各强化机制对纳米颗粒增强金属基复合材料(nanoparticle reinforced metal matrix composites,NRMMCs)的屈服强度以及晶界滑移对金属基体屈服强度的影响,建立了不含拟合参数的NRMMCs温度相关性屈服强度理论表征模型.模型仅需金属基体任意一个参考温度下的屈服强度及相关材料参数,如比热容、热膨胀系数、熔点等,即可预测NRMMCs在任意温度下的屈服强度.模型预测结果与目前获取到的四组所有实验数据均取得了良好的一致性,实现了对NRMMCs宽温域屈服强度的合理预测.在此基础上,探讨了主要强化机制对NRMMCs屈服强度的影响及其随温度和颗粒尺寸的演化规律,为设计和开发适用于宽温域下的NRMMCs提供了理论依据和有效建议。展开更多
Understanding the fracture behavior of vertical cracks in piezoelectric semiconductor(PS)structures is vital due to their impacts on device reliability.This study establishes a model for a PS strip with a vertical cra...Understanding the fracture behavior of vertical cracks in piezoelectric semiconductor(PS)structures is vital due to their impacts on device reliability.This study establishes a model for a PS strip with a vertical crack under combined mechanical and electric loading,considering both central and edge cracks.Using Fourier transforms and dislocation density functions,the Mode-Ⅲproblem is converted to Cauchy-type singular integral equations.The crack surface fields,intensity factors,and energy release rate are derived.The accuracy of the proposed model is verified through the finite element(FE)simulation via COMSOL Multiphysics.The results for low electron concentrations align with those of the intrinsic piezoelectric materials,validating the correctness of the present model as well.The combined effects of crack position,applied electric loading,and initial carrier concentration on the crack propagation are analyzed.The normalized electric displacement factor shows heightened sensitivity to crack size,electromechanical loading,and carrier concentration.The crack position significantly influences the crack surface fields and normalized intensity factors due to the boundary proximity effect.展开更多
文摘通过定量表征宽温域下,各强化机制对纳米颗粒增强金属基复合材料(nanoparticle reinforced metal matrix composites,NRMMCs)的屈服强度以及晶界滑移对金属基体屈服强度的影响,建立了不含拟合参数的NRMMCs温度相关性屈服强度理论表征模型.模型仅需金属基体任意一个参考温度下的屈服强度及相关材料参数,如比热容、热膨胀系数、熔点等,即可预测NRMMCs在任意温度下的屈服强度.模型预测结果与目前获取到的四组所有实验数据均取得了良好的一致性,实现了对NRMMCs宽温域屈服强度的合理预测.在此基础上,探讨了主要强化机制对NRMMCs屈服强度的影响及其随温度和颗粒尺寸的演化规律,为设计和开发适用于宽温域下的NRMMCs提供了理论依据和有效建议。
基金Project supported by the Guangdong Basic and Applied Basic Research Foundation of China(Nos.2022B1515020099 and 2024A1515240026)the National Natural Science Foundation of China(No.12372147)the Fundamental Research Funds for the Central Universities of China(No.HIT.OCEF.2024019)。
文摘Understanding the fracture behavior of vertical cracks in piezoelectric semiconductor(PS)structures is vital due to their impacts on device reliability.This study establishes a model for a PS strip with a vertical crack under combined mechanical and electric loading,considering both central and edge cracks.Using Fourier transforms and dislocation density functions,the Mode-Ⅲproblem is converted to Cauchy-type singular integral equations.The crack surface fields,intensity factors,and energy release rate are derived.The accuracy of the proposed model is verified through the finite element(FE)simulation via COMSOL Multiphysics.The results for low electron concentrations align with those of the intrinsic piezoelectric materials,validating the correctness of the present model as well.The combined effects of crack position,applied electric loading,and initial carrier concentration on the crack propagation are analyzed.The normalized electric displacement factor shows heightened sensitivity to crack size,electromechanical loading,and carrier concentration.The crack position significantly influences the crack surface fields and normalized intensity factors due to the boundary proximity effect.
