The abuse of opioids is harmful to the national economy and health.The U.S.government has spent a lot of time,energy and money to deal with this phenomenon.Based on the topic background and team discussion,we deeply e...The abuse of opioids is harmful to the national economy and health.The U.S.government has spent a lot of time,energy and money to deal with this phenomenon.Based on the topic background and team discussion,we deeply excavated the data and information provided in the topic,determined the current use of opioids,and constructed an improved SIR model to determine the source of drug abuse,the mechanism of drug abuse diffusion and the origin of each state through reverse derivation,which provided guidance for the government in the context of opioid abuse.Based on the above results,we simulated and analyzed the improved SIR model and determined the accuracy and stability of the model in the data set.展开更多
Monolithic three-dimensional(M3D)integration represents a transformative approach in semiconductor technology,enabling the vertical integration of diverse functionalities within a single chip.This review explores the ...Monolithic three-dimensional(M3D)integration represents a transformative approach in semiconductor technology,enabling the vertical integration of diverse functionalities within a single chip.This review explores the evolution of M3D integration from traditional bulk semiconductors to low-dimensional materials like two-dimensioanl(2D)transition metal dichalcogenides(TMDCs)and carbon nanotubes(CNTs).Key applications include logic circuits,static random access memory(SRAM),resistive random access memory(RRAM),sensors,optoelectronics,and artificial intelligence(AI)processing.M3D integration enhances device performance by reducing footprint,improving power efficiency,and alleviating the von Neumann bottleneck.The integration of 2D materials in M3D structures demonstrates significant advancements in terms of scalability,energy efficiency,and functional diversity.Challenges in manufacturing and scaling are discussed,along with prospects for future research directions.Overall,the M3D integration with low-dimensional materials presents a promising pathway for the development of next-generation electronic devices and systems.展开更多
文摘The abuse of opioids is harmful to the national economy and health.The U.S.government has spent a lot of time,energy and money to deal with this phenomenon.Based on the topic background and team discussion,we deeply excavated the data and information provided in the topic,determined the current use of opioids,and constructed an improved SIR model to determine the source of drug abuse,the mechanism of drug abuse diffusion and the origin of each state through reverse derivation,which provided guidance for the government in the context of opioid abuse.Based on the above results,we simulated and analyzed the improved SIR model and determined the accuracy and stability of the model in the data set.
基金fundings from the National Natural Science Foundation of China(Nos.62274013 and 92163206)the National Key Research and Development Program of China(No.2023YFB3405600)Science Fund for Creative Research Groups of the National Natural Science Foundation of China(No.12321004)。
文摘Monolithic three-dimensional(M3D)integration represents a transformative approach in semiconductor technology,enabling the vertical integration of diverse functionalities within a single chip.This review explores the evolution of M3D integration from traditional bulk semiconductors to low-dimensional materials like two-dimensioanl(2D)transition metal dichalcogenides(TMDCs)and carbon nanotubes(CNTs).Key applications include logic circuits,static random access memory(SRAM),resistive random access memory(RRAM),sensors,optoelectronics,and artificial intelligence(AI)processing.M3D integration enhances device performance by reducing footprint,improving power efficiency,and alleviating the von Neumann bottleneck.The integration of 2D materials in M3D structures demonstrates significant advancements in terms of scalability,energy efficiency,and functional diversity.Challenges in manufacturing and scaling are discussed,along with prospects for future research directions.Overall,the M3D integration with low-dimensional materials presents a promising pathway for the development of next-generation electronic devices and systems.
