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Radiomics identifies distinct cortical bone texture alterations in patients with CKD using HR-pQCT
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作者 youngjun lee Seokkyoon Hong +6 位作者 Miran lee Choongbeom Seo Sangjun Park Kenneth J.Lim Sharon M.Moe Stuart J.Warden Rachel K.Surowiec 《Bone Research》 2026年第2期569-580,共12页
Standard clinical imaging metrics perform poorly in predicting skeletal fragility in chronic kidney disease(CKD),particularly due to the complex and heterogeneous cortical deterioration that characterizes advanced dis... Standard clinical imaging metrics perform poorly in predicting skeletal fragility in chronic kidney disease(CKD),particularly due to the complex and heterogeneous cortical deterioration that characterizes advanced disease.Here,this study aimed to identify radiomic features derived from high-resolution peripheral quantitative computed tomography(HR-pQCT)in tibial cortical bone that distinguish CKD-related differences and may serve as markers of subtle cortical alterations undetected by conventional imaging.HR-pQCT image stacks were obtained from 72 participants(38 non-CKD and 34 with CKD stage 5D)at 7.3%(distal)and 30%(diaphyseal)proximally from the tibial endplate,resulting in a total of 24192 slices.In non-CKD cases,features were largely derived from first-order statistics,while complex features from higher-order statistics were more prominent in CKD cases.Although conventional HR-pQCT outcomes,such as volumetric bone mineral density,showed limited ability to differentiate CKD from non-CKD cortical bone in our population of stage 5D patients,the top features,such as Minimum and Strength,provided a significant distinction between the two groups(P<0.001,Effect size r=from 0.813 to 0.856).Our findings demonstrate that radiomic analysis identifies cortical bone differences associated with CKD that were not distinguished by conventional HR-pQCT metrics,highlighting its potential to improve bone quality assessment in this high-risk population. 展开更多
关键词 skeletal fragility conventional imaginghr radiomics tibial cortical bone cortical alterations clinical imaging metrics radiomic features high resolution peripheral quantitative computed tomography
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Microsphere-assisted hyperspectral imaging:super-resolution,non-destructive metrology for semiconductor devices
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作者 Jangryul Park Youngsun Choi +10 位作者 Soonyang Kwon youngjun lee Jiwoong Kim Jae-joon Kim Jihye lee Jeongho Ahn Hidong Kwak Yusin Yang Taeyong Jo Myungjun lee Kwangrak Kim 《Light: Science & Applications》 SCIE EI CSCD 2024年第6期1098-1111,共14页
As semiconductor devices shrink and their manufacturing processes advance,accurately measuring in-cell critical dimensions(CD)becomes increasingly crucial.Traditional test element group(TEG)measurements are becoming i... As semiconductor devices shrink and their manufacturing processes advance,accurately measuring in-cell critical dimensions(CD)becomes increasingly crucial.Traditional test element group(TEG)measurements are becoming inadequate for representing the fine,repetitive patterns in cell blocks.Conventional non-destructive metrology technologies like optical critical dimension(OCD)are limited due to their large spot diameter of approximately 25μm,which impedes their efficacy for detailed in-cell structural analysis.Consequently,there is a pressing need for small-spot and non-destructive metrology methods.To address this limitation,we demonstrate a microsphere-assisted hyperspectral imaging(MAHSI)system,specifically designed for small spot optical metrology with super-resolution.Utilizing microsphere-assisted super-resolution imaging,this system achieves an optical resolution of 66 nm within a field of view of 5.6μm×5.6μm.This approach effectively breaks the diffraction limit,significantly enhancing the magnification of the system.The MAHSI system incorporating hyperspectral imaging with a wavelength range of 400–790 nm,enables the capture of the reflection spectrum at each camera pixel.The achieved pixel resolution,which is equivalent to the measuring spot size,is 14.4 nm/pixel and the magnification is 450X.The MAHSI system enables measurement of local uniformity in critical areas like corners and edges of DRAM cell blocks,areas previously challenging to inspect with conventional OCD methods.To our knowledge,this approach represents the first global implementation of microsphere-assisted hyperspectral imaging to address the metrology challenges in complex 3D structures of semiconductor devices. 展开更多
关键词 METROLOGY RESOLUTION enable
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