Electrolytic copper foil has gained significant attention as an essential component in lithium-ion batteries(LIBs),printed circuit boards(PCBs),and chip packaging substrates(CPSs)applications.With the advancement of L...Electrolytic copper foil has gained significant attention as an essential component in lithium-ion batteries(LIBs),printed circuit boards(PCBs),and chip packaging substrates(CPSs)applications.With the advancement of LIBs towards higher energy densities and the increasing density of electronic components on circuits,copper foil is required to have demanding properties,such as extremely thin thickness and extremely high tensile strength.This comprehensive review firstly summarizes recent progress on the fabrication of electrolytic copper foil,and the effects of process parameters,cathode substrate,and additives on the electrodeposition behavior,microstructure,and properties of copper foil are discussed in detail.Then the regulation strategies of mechanical properties of electrolytic copper foil are also summarized,including the formation of nanotwins and texture.Furthermore,the recent advances in novel electrolytic copper foils,such as composite foils and extra-thin copper foils,are also overviewed.Lastly,the remaining challenges and perspectives on the further development of electrolytic copper foils are presented.展开更多
The effects of trace cerium(Ce)addition on the microstructural and textural evolution and the dynamic recrystallization(DRX)of the ultrahigh-purity copper(Cu)containing small amounts of sulfur(S)were investigated usin...The effects of trace cerium(Ce)addition on the microstructural and textural evolution and the dynamic recrystallization(DRX)of the ultrahigh-purity copper(Cu)containing small amounts of sulfur(S)were investigated using a Gleeble-1500 thermal simulation tester at 600℃.The results show that with increasing Ce content,the grain size of the Cu-S(S2)alloy gradually decreases and the grain boundary embrittlement induced by S impurities is considerably inhibited.The addition of Ce promotes the DRX process of the S2 alloy and changes its DRX mechanism from discontinuous to continuous and twinning-induced DRX mechanisms.The texture component and intensity of the S2 alloy vary with the increase of Ce content.The addition of 120×10^(-6) Ce(mass fraction)is favorable for the grain orientation randomization,which is attributed to the promoted DRX.展开更多
Mechanical properties and fracture behavior of Cu-0.84Co 0.23Be alloy after plastic deformation and heat treatment were comparatively investigated.Severe plastic deformation by hot extrusion and cold drawing was adopt...Mechanical properties and fracture behavior of Cu-0.84Co 0.23Be alloy after plastic deformation and heat treatment were comparatively investigated.Severe plastic deformation by hot extrusion and cold drawing was adopted to induce large plastic strain of Cu 0.84Co-0.23Be alloy.The tensile strength and elongation are up to 476.6 MPa and 18%,respectively.The fractured surface consists of deep dimples and micro voids.Due to the formation of su-persaturated solid solution on the Cu matrix by solution treatment at 950℃for 1 h,the tensile strength decreased to 271.9 MPa,while the elongation increased to 42%.The fracture morphology is parabolic dimple.Furthermore,the tensile strength increased significantly to 580.2 MPa after aging at 480℃for 4 h.During the aging process,a large number of precipitates formed and distributed on the Cu matrix.The fracture feature of aged specimens with low elongation(4.6%)exhibits an obvious brittle intergranular fracture.It is confirmed that the mechanical properties and fracture behavior are dominated by the microstrueture characteristics of Cu-0.84Co 0.23Be alloy after plastic de-formation and heat treatment.In addition,the fracture behavior at 450℃of aged Cu-0.84Co 0.23Be alloy was also studied.The tensile strength and elongation are 383.6 MPa and 11.2%,respectively.The fractured morphologies are mainly candy-shaped with partial parabolic dimples and equiaxed dimples.The fracture mode is multi mixed mechanism that brittle intergranular fracture plays a dominant role and ductile fracture is secondary.展开更多
BACKGROUND:Opportunistic infection of Candida albicans(C.albicans) has become a serious problem in immunocompromised patients.The study aimed to explore the mechanism of enterogenous infection of C.albicans in immunoc...BACKGROUND:Opportunistic infection of Candida albicans(C.albicans) has become a serious problem in immunocompromised patients.The study aimed to explore the mechanism of enterogenous infection of C.albicans in immunocompromised rats under severe acute pancreatitis(SAP).METHODS:Sprague Dawley(SD) rats(n=100) were randomly assigned into 5 groups as the following:blank group,cyclophosphamide+ceftriaxone+SAP group,cyclophosphamide+ceftriaxone group,cyclophosphamide+SAP group,and cyclophosphamide group.The rats were sacrificed at 5and 10 days,and their jejunum,colon,mesenteric lymph nodes,pancreas,intestinal content,and blood were quickly collected to detect C.albicans.A region of the 25 S rRNA gene was chosen and amplified by polymerase chain reaction(PCR) to differentiate C.albicans genotypes.The amplified products were further sequenced and compared to judge their homology.RESULTS:Compared with the Cyclophosphamide group,the combination of immunosuppressants and broad-spectrum antibiotics significantly increased the colonization of C.albicans in intestine in 5 and 10 days.Pure SAP stress did not increase the opportunistic infection of C.albicans.The PCR products of C.albicans isolates all belonged to the genotype A family,and sequence alignment showed that the amplified fragments were homologous.CONCLUSION:The damage of immune system and broad-spectrum antimicrobial agents are important risk factors for opportunistic fungal infection.Intestinal tract is an important source for genotype-A C.albicans to translocate and invade into bloodstream.展开更多
A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micr...A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated.Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed,forming distinct slip and non-slip zones.Additionally,horizontal strain concentration bands develop within the drawn wire.As the wire diameter compression ratio increases,the strength of the slip systems and the extent of slip zones inside the deformation zone also increase.However,the fluctuating stress state,induced by contact pressure and frictional stress,results in a rough and uneven wire surface and diminishes the stability of the drawing process.展开更多
A new Cu-Cr-Sc alloy was designed,prepared and subjected to deformation heat treatment.Transmission electron microscopy(TEM),electron backscatter diffraction(EBSD)and X-ray diffraction(XRD)were employed to investigate...A new Cu-Cr-Sc alloy was designed,prepared and subjected to deformation heat treatment.Transmission electron microscopy(TEM),electron backscatter diffraction(EBSD)and X-ray diffraction(XRD)were employed to investigate the effects of Sc on the microstructural changes in the Cu-Cr alloy in different states,examine the changes in the precipitates during aging,reveal the intrinsic correlation between the structure and property in the peak aging state,and evaluate the Sc distribution in the Cu-Cr alloy.The addition of Sc significantly increased the yield strength of the Cu-Cr alloy by~24.6%after aging at 480℃for 1 h,while it had a high electrical conductivity of81.5%international annealed copper standard(IACS).This enhancement was attributed to the effective inhibition of Cr phase coarsening and recrystallization through the addition of Sc,which strengthened the alloy.Furthermore,in the Cu-Cr-Sc alloy,most of the Sc atoms precipitated as the Cu_(4)Sc phase,with a small amount of Sc segregating at the grain boundaries to pin them.This grain boundary pinning helped to inhibit grain growth and further improve the strength.The main strengthening mechanisms identified in Cu-Cr-Sc alloys were dislocation strengthening and precipitation strengthening.展开更多
基金supported by the National Key R&D Plan Program of China(No.2021YFB3400800)Henan Key Research and Development Program(No.231111241000)+1 种基金the Joint Fund of Henan Province Science and Technology R&D Program(No.225200810026)Zhongyuan Scholar Workstation Funded Program(No.224400510025).
文摘Electrolytic copper foil has gained significant attention as an essential component in lithium-ion batteries(LIBs),printed circuit boards(PCBs),and chip packaging substrates(CPSs)applications.With the advancement of LIBs towards higher energy densities and the increasing density of electronic components on circuits,copper foil is required to have demanding properties,such as extremely thin thickness and extremely high tensile strength.This comprehensive review firstly summarizes recent progress on the fabrication of electrolytic copper foil,and the effects of process parameters,cathode substrate,and additives on the electrodeposition behavior,microstructure,and properties of copper foil are discussed in detail.Then the regulation strategies of mechanical properties of electrolytic copper foil are also summarized,including the formation of nanotwins and texture.Furthermore,the recent advances in novel electrolytic copper foils,such as composite foils and extra-thin copper foils,are also overviewed.Lastly,the remaining challenges and perspectives on the further development of electrolytic copper foils are presented.
基金financially supported by the National Natural Science Foundation of China(Nos.52071133,U21A2051)the Henan Province Science and Technology Tackling Key Problems Project,China(No.222102230001)+2 种基金the Zhongyuan Scholar Workstation Funded Project,China(No.224400510025)the Henan Key Research and Development Project,China(No.221111230600)Luoyang Major Science and Technology Innovation Special Project,China(No.2201017A)。
文摘The effects of trace cerium(Ce)addition on the microstructural and textural evolution and the dynamic recrystallization(DRX)of the ultrahigh-purity copper(Cu)containing small amounts of sulfur(S)were investigated using a Gleeble-1500 thermal simulation tester at 600℃.The results show that with increasing Ce content,the grain size of the Cu-S(S2)alloy gradually decreases and the grain boundary embrittlement induced by S impurities is considerably inhibited.The addition of Ce promotes the DRX process of the S2 alloy and changes its DRX mechanism from discontinuous to continuous and twinning-induced DRX mechanisms.The texture component and intensity of the S2 alloy vary with the increase of Ce content.The addition of 120×10^(-6) Ce(mass fraction)is favorable for the grain orientation randomization,which is attributed to the promoted DRX.
基金Sponsored by National Key Research and Development Program of China(2016YFB0301401)State Key Program of National Natural Science Foundation of China(U1502274)+1 种基金Innovation Scientists and Technicians Troop Construction Projects of Henan Province of China(C20150014)Program for Innovation Research Team(in Science and Technology)in University of Henan Province of China(14IRTSTHN007)
文摘Mechanical properties and fracture behavior of Cu-0.84Co 0.23Be alloy after plastic deformation and heat treatment were comparatively investigated.Severe plastic deformation by hot extrusion and cold drawing was adopted to induce large plastic strain of Cu 0.84Co-0.23Be alloy.The tensile strength and elongation are up to 476.6 MPa and 18%,respectively.The fractured surface consists of deep dimples and micro voids.Due to the formation of su-persaturated solid solution on the Cu matrix by solution treatment at 950℃for 1 h,the tensile strength decreased to 271.9 MPa,while the elongation increased to 42%.The fracture morphology is parabolic dimple.Furthermore,the tensile strength increased significantly to 580.2 MPa after aging at 480℃for 4 h.During the aging process,a large number of precipitates formed and distributed on the Cu matrix.The fracture feature of aged specimens with low elongation(4.6%)exhibits an obvious brittle intergranular fracture.It is confirmed that the mechanical properties and fracture behavior are dominated by the microstrueture characteristics of Cu-0.84Co 0.23Be alloy after plastic de-formation and heat treatment.In addition,the fracture behavior at 450℃of aged Cu-0.84Co 0.23Be alloy was also studied.The tensile strength and elongation are 383.6 MPa and 11.2%,respectively.The fractured morphologies are mainly candy-shaped with partial parabolic dimples and equiaxed dimples.The fracture mode is multi mixed mechanism that brittle intergranular fracture plays a dominant role and ductile fracture is secondary.
基金supported by grants from the Research Foundation of Shanghai Minhang District Municipal Commission of Health and Family Planning(2013MW12)the Research Foundation of Shanghai Municipal Commission of Health and Family Planning(201540136)
文摘BACKGROUND:Opportunistic infection of Candida albicans(C.albicans) has become a serious problem in immunocompromised patients.The study aimed to explore the mechanism of enterogenous infection of C.albicans in immunocompromised rats under severe acute pancreatitis(SAP).METHODS:Sprague Dawley(SD) rats(n=100) were randomly assigned into 5 groups as the following:blank group,cyclophosphamide+ceftriaxone+SAP group,cyclophosphamide+ceftriaxone group,cyclophosphamide+SAP group,and cyclophosphamide group.The rats were sacrificed at 5and 10 days,and their jejunum,colon,mesenteric lymph nodes,pancreas,intestinal content,and blood were quickly collected to detect C.albicans.A region of the 25 S rRNA gene was chosen and amplified by polymerase chain reaction(PCR) to differentiate C.albicans genotypes.The amplified products were further sequenced and compared to judge their homology.RESULTS:Compared with the Cyclophosphamide group,the combination of immunosuppressants and broad-spectrum antibiotics significantly increased the colonization of C.albicans in intestine in 5 and 10 days.Pure SAP stress did not increase the opportunistic infection of C.albicans.The PCR products of C.albicans isolates all belonged to the genotype A family,and sequence alignment showed that the amplified fragments were homologous.CONCLUSION:The damage of immune system and broad-spectrum antimicrobial agents are important risk factors for opportunistic fungal infection.Intestinal tract is an important source for genotype-A C.albicans to translocate and invade into bloodstream.
基金the National Natural Science Foundation of China(Nos.U21A2051,52173297,52071133)the R&D Projects of Henan Academy of Sciences of China(No.220910009)+2 种基金the Key R&D and Promotion Projects of Henan Province of China(No.212102210441)the Joint Fund of Henan Science and Technology R&D Plan of China(No.222103810037)the Zhongyuan Scholar Workstation Funded Project of China(No.214400510028).
文摘A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated.Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed,forming distinct slip and non-slip zones.Additionally,horizontal strain concentration bands develop within the drawn wire.As the wire diameter compression ratio increases,the strength of the slip systems and the extent of slip zones inside the deformation zone also increase.However,the fluctuating stress state,induced by contact pressure and frictional stress,results in a rough and uneven wire surface and diminishes the stability of the drawing process.
基金financially supported by the National Natural Science Foundation of China(Nos.52173297,52071133 and U21A2051)Zhongyuan Scholar Workstation Funded Project(Nos.214400510028 and 224400510025)+7 种基金R&D Projects of Henan Academy of Sciences(No.220910009)the Natural Science Foundation of Henan Province(No.202300410139)the Key Scientific Research Projects of Colleges and Universities in Henan Province(No.24A430015)Henan Provincial Key Research and Development Program(No.231111231700)Beijing Nova Program(No.20230484371)Zhongyuan Youth Talent Support Program(No.202311)the Science and Technology R&D Plan Joint Fund of Henan Province(No.225200810052)the Key scientific research projects of colleges and universities in Henan province(No.23A43008)。
文摘A new Cu-Cr-Sc alloy was designed,prepared and subjected to deformation heat treatment.Transmission electron microscopy(TEM),electron backscatter diffraction(EBSD)and X-ray diffraction(XRD)were employed to investigate the effects of Sc on the microstructural changes in the Cu-Cr alloy in different states,examine the changes in the precipitates during aging,reveal the intrinsic correlation between the structure and property in the peak aging state,and evaluate the Sc distribution in the Cu-Cr alloy.The addition of Sc significantly increased the yield strength of the Cu-Cr alloy by~24.6%after aging at 480℃for 1 h,while it had a high electrical conductivity of81.5%international annealed copper standard(IACS).This enhancement was attributed to the effective inhibition of Cr phase coarsening and recrystallization through the addition of Sc,which strengthened the alloy.Furthermore,in the Cu-Cr-Sc alloy,most of the Sc atoms precipitated as the Cu_(4)Sc phase,with a small amount of Sc segregating at the grain boundaries to pin them.This grain boundary pinning helped to inhibit grain growth and further improve the strength.The main strengthening mechanisms identified in Cu-Cr-Sc alloys were dislocation strengthening and precipitation strengthening.
