Polymer nanowire(NW)organic field-effect transistors(OFETs)integrated on highly aligned large-area flexible substrates are candidate structures for the development of high-performance flexible electronics.This work pr...Polymer nanowire(NW)organic field-effect transistors(OFETs)integrated on highly aligned large-area flexible substrates are candidate structures for the development of high-performance flexible electronics.This work presents a universal technique,coaxial focused electrohydrodynamic jet(CFEJ)printing technology,to fabricate highly aligned 90-nm-diameter polymer arrays.This method allows for the preparation of uniformly shaped and precisely positioned nanowires directly on flexible substrates without transfer,thus ensuring their electrical properties.Using indacenodithiophene-co-benzothiadiazole(IDT-BT)and poly(9,9-dioctylfluorene-co-benzothiadiazole)(F8-BT)as example materials,5 cm^(2) arrays were prepared with only minute size variations,which is extremely difficult to do using previously reported methods.According to 2D-GIXRD analysis,the molecules inside the nanowires mainly adopted face-onπ-stacking crystallite arrangements.This is quite different from the mixed arrangement of thin films.Nanowire-based OFETs exhibited a high average hole mobility of 1.1 cm^(2) V^(−1) s^(−1) and good device uniformity,indicating the applicability of CFEJ printing as a potential batch manufacturing and integration process for high-performance,scalable polymer nanowire-based OFET circuits.This technique can be used to fabricate various polymer arrays,enabling the use of organic polymer semiconductors in large-area,high-performance electronic devices and providing a new path for the fabrication of flexible displays and wearable electronics in the future.展开更多
Three-dimensional(3D)conductive structures significantly reduce flexible circuit complexity and enhance circuit integration.Direct extrusion printing technology offers the advantages of various material applicability ...Three-dimensional(3D)conductive structures significantly reduce flexible circuit complexity and enhance circuit integration.Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects.The printing resolution is,however,highly dependent on the needle size.A micro-printing method was proposed based on fluid drawing to fabricate freestanding 3D conductive structures.The delicate structure is drawn out under the tension when printing.The printing material is a high-viscosity ink composed of silver nanoparticles(AgNPs)and polyvinylpyrrolidone(PVP).The viscosity is controlled by evaporating the ink’s solvent for drawing prints.This unique printing method utilizes a single needle,controlled by precise air pressure and speed,to construct 3D filamentary structures with varied wire widths.The 3D conductive structures exhibit superior structural retention and enhanced conductivity by thermal treatment.The drawing printing method has been successfully implemented on flexible circuits,including light-emitting diode(LED)arrays,thermal imaging displays,and multivibrator circuits.This work establishes a novel paradigm for flexible electronics manufacturing through fluid-drawing printing,achieving unprecedented customization and compatibility in fabricating 3D interconnects.展开更多
基金This research was supported by the National Key R&D Program of China(Grant No.2018YFA0703200,D.W.)National Natural Science Foundation of China(51975104 and 62074138,D.W.52003274,Z.Z.)+2 种基金the Fundamental Research Funds for the Central Universities(DUT22LAB405,DUT22QN227)Defense Industrial Technology Development Program(JCKY2020204B004)Ningbo Institute of Dalian University of Technology.The 2D-GIXRD data were obtained at 1W1A,Beijing Synchrotron Radiation Facility.The authors gratefully acknowledge the assistance of researchers of the Diffuse X-ray Scattering Station during the experiments.Special thanks are due to Dr.Cai Rui in the Instrumental Analysis Center of Dalian University of Technology for assistance with AFM analysis.
文摘Polymer nanowire(NW)organic field-effect transistors(OFETs)integrated on highly aligned large-area flexible substrates are candidate structures for the development of high-performance flexible electronics.This work presents a universal technique,coaxial focused electrohydrodynamic jet(CFEJ)printing technology,to fabricate highly aligned 90-nm-diameter polymer arrays.This method allows for the preparation of uniformly shaped and precisely positioned nanowires directly on flexible substrates without transfer,thus ensuring their electrical properties.Using indacenodithiophene-co-benzothiadiazole(IDT-BT)and poly(9,9-dioctylfluorene-co-benzothiadiazole)(F8-BT)as example materials,5 cm^(2) arrays were prepared with only minute size variations,which is extremely difficult to do using previously reported methods.According to 2D-GIXRD analysis,the molecules inside the nanowires mainly adopted face-onπ-stacking crystallite arrangements.This is quite different from the mixed arrangement of thin films.Nanowire-based OFETs exhibited a high average hole mobility of 1.1 cm^(2) V^(−1) s^(−1) and good device uniformity,indicating the applicability of CFEJ printing as a potential batch manufacturing and integration process for high-performance,scalable polymer nanowire-based OFET circuits.This technique can be used to fabricate various polymer arrays,enabling the use of organic polymer semiconductors in large-area,high-performance electronic devices and providing a new path for the fabrication of flexible displays and wearable electronics in the future.
基金supported by the National Natural Science Foundation of China(Grant No.U24A20137,52475587,52103224,52405610)Science and Technology Program of Liaoning Province(2023JH1/10400044)+1 种基金Natural Science Foundation of Ningbo Municipality(2022J008)Fundamental Research Funds for the Central Universities(DUT23RC(3)051,DUT24RC(3)048)。
文摘Three-dimensional(3D)conductive structures significantly reduce flexible circuit complexity and enhance circuit integration.Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects.The printing resolution is,however,highly dependent on the needle size.A micro-printing method was proposed based on fluid drawing to fabricate freestanding 3D conductive structures.The delicate structure is drawn out under the tension when printing.The printing material is a high-viscosity ink composed of silver nanoparticles(AgNPs)and polyvinylpyrrolidone(PVP).The viscosity is controlled by evaporating the ink’s solvent for drawing prints.This unique printing method utilizes a single needle,controlled by precise air pressure and speed,to construct 3D filamentary structures with varied wire widths.The 3D conductive structures exhibit superior structural retention and enhanced conductivity by thermal treatment.The drawing printing method has been successfully implemented on flexible circuits,including light-emitting diode(LED)arrays,thermal imaging displays,and multivibrator circuits.This work establishes a novel paradigm for flexible electronics manufacturing through fluid-drawing printing,achieving unprecedented customization and compatibility in fabricating 3D interconnects.
