以定制硅(Si)、蓝宝石(Al2O3)和碳化硅(SiC)衬底的AlGaN/GaN高电子迁移率晶体管(high electron mobility transistors,HEMTs)为研究对象,在CFBR-II(China Fast Burst Reactor-II)快中子脉冲堆开展了中子辐照注量范围为10^(13)~10^(15) c...以定制硅(Si)、蓝宝石(Al2O3)和碳化硅(SiC)衬底的AlGaN/GaN高电子迁移率晶体管(high electron mobility transistors,HEMTs)为研究对象,在CFBR-II(China Fast Burst Reactor-II)快中子脉冲堆开展了中子辐照注量范围为10^(13)~10^(15) cm^(-2)的辐照实验研究;运用Sentaurus TCAD软件对Si衬底HEMTs器件开展了数值模拟仿真。结果表明:HEMTs器件的I-V等特性的变化,随着中子辐照注量的增大,并未如预期呈现出单调的线性递减趋势;对于Si衬底的定制器件,在小于10^(15) cm^(-2)的辐照注量下,甚至出现了饱和漏电流增加现象。分析认为,辐照产生的施主型陷阱与受主型陷阱之间的竞争补偿作用过程,是导致实验现象出现的主要物理机制;与原生缺陷相关的施主型陷阱的产生和注量率效应,可用来解释实验观测到的反常增加趋势。基于不同种类陷阱对器件作用机制的定量分析,定位GaN缓冲层为器件的薄弱环节并提出了加固建议,推断器件性能会在注量为10^(15)~10^(16) cm^(-2)时出现显著退化及失效,并尝试开展多轮次搭载实验进行验证。展开更多
太空中的单粒子效应会对电子器件造成损伤,地面模拟是评估器件抗辐射性能的有效途径。现有的模拟方法大多是基于器件的物理底层模型进行电流源脉冲故障注入,不适用于百万门级大规模集成电路(very large scale integration,VLSI)。针对...太空中的单粒子效应会对电子器件造成损伤,地面模拟是评估器件抗辐射性能的有效途径。现有的模拟方法大多是基于器件的物理底层模型进行电流源脉冲故障注入,不适用于百万门级大规模集成电路(very large scale integration,VLSI)。针对该问题,提出了一种从器件高层行为模型注入单粒子翻转故障的方法,并基于8051 IP核进行了单粒子一位翻转和连续两位翻转的仿真和实验比较。研究结果表明,单粒子翻转故障可直接注入到器件的高层来评估系统的抗单粒子性能。展开更多
With the decrease of the device size,soft error induced by various particles becomes a serious problem for advanced CMOS technologies.In this paper,we review the evolution of two main aspects of soft error-SEU and SET...With the decrease of the device size,soft error induced by various particles becomes a serious problem for advanced CMOS technologies.In this paper,we review the evolution of two main aspects of soft error-SEU and SET,including the new mechanisms to induced SEUs,the advances of the MCUs and some newly observed phenomena of the SETs.The mechanisms and the trends with downscaling of these issues are briefly discussed.We also review the hardening strategies for different types of soft errors from different perspective and present the challenges in testing,modeling and hardening assurance of soft error issues we have to address in the future.展开更多
文摘太空中的单粒子效应会对电子器件造成损伤,地面模拟是评估器件抗辐射性能的有效途径。现有的模拟方法大多是基于器件的物理底层模型进行电流源脉冲故障注入,不适用于百万门级大规模集成电路(very large scale integration,VLSI)。针对该问题,提出了一种从器件高层行为模型注入单粒子翻转故障的方法,并基于8051 IP核进行了单粒子一位翻转和连续两位翻转的仿真和实验比较。研究结果表明,单粒子翻转故障可直接注入到器件的高层来评估系统的抗单粒子性能。
基金supported by the National Natural Science Foundation of China(Grant No.11175138)the Specialized Research Fund for the Doctoral Program of Higher Education of China(Grant No.20100201110018)+1 种基金the Key Program of the National Natural Science Foundation of China(Grant No.11235008)the State Key Laboratory Program(Grant No.20140134)
文摘With the decrease of the device size,soft error induced by various particles becomes a serious problem for advanced CMOS technologies.In this paper,we review the evolution of two main aspects of soft error-SEU and SET,including the new mechanisms to induced SEUs,the advances of the MCUs and some newly observed phenomena of the SETs.The mechanisms and the trends with downscaling of these issues are briefly discussed.We also review the hardening strategies for different types of soft errors from different perspective and present the challenges in testing,modeling and hardening assurance of soft error issues we have to address in the future.
