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A 28 nm 576K RRAM-based computing-in-memory macro featuring hybrid programming with area efficiency of 2.82 TOPS/mm^(2)
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作者 Siqi Liu Songtao Wei +7 位作者 Peng Yao Dong Wu Lu Jie sining pan Jianshi Tang Bin Gao He Qian Huaqiang Wu 《Journal of Semiconductors》 2025年第6期112-119,共8页
Computing-in-memory(CIM)has been a promising candidate for artificial-intelligent applications thanks to the absence of data transfer between computation and storage blocks.Resistive random access memory(RRAM)based CI... Computing-in-memory(CIM)has been a promising candidate for artificial-intelligent applications thanks to the absence of data transfer between computation and storage blocks.Resistive random access memory(RRAM)based CIM has the advantage of high computing density,non-volatility as well as high energy efficiency.However,previous CIM research has predominantly focused on realizing high energy efficiency and high area efficiency for inference,while little attention has been devoted to addressing the challenges of on-chip programming speed,power consumption,and accuracy.In this paper,a fabri-cated 28 nm 576K RRAM-based CIM macro featuring optimized on-chip programming schemes is proposed to address the issues mentioned above.Different strategies of mapping weights to RRAM arrays are compared,and a novel direct-current ADC design is designed for both programming and inference stages.Utilizing the optimized hybrid programming scheme,4.67×programming speed,0.15×power saving and 4.31×compact weight distribution are realized.Besides,this macro achieves a normalized area efficiency of 2.82 TOPS/mm2 and a normalized energy efficiency of 35.6 TOPS/W. 展开更多
关键词 computing-in-memory on-chip programming scheme hybrid programming resistive random access memory matrix-vector-multiplication acceleration
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Experimental and numerical study of thermal fatigue behavior under variable amplitude induced by pulsed laser
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作者 sining pan Gang Yu +2 位作者 XiuLi He ShaoXia Li Ru Chen 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS CSCD 2018年第10期88-91,共4页
Thermal fatigue is the typical failure mode of high-temperature combustion chamber components used in power plants and in the aerospace and transportation industries [1-3]. With growing demand for good performance and... Thermal fatigue is the typical failure mode of high-temperature combustion chamber components used in power plants and in the aerospace and transportation industries [1-3]. With growing demand for good performance and high reliability, thermal fatigue is becoming a serious problem. The thermal working conditions of combustion chamber components include start-stop cycles and routine working cycles simultaneously [4,5]. The former refer to large temperature changes, with the amplitude of 200℃-500℃ and time period of several hundred seconds that are responsible for low-cycle fatigue (LCF) damage. The latter correspond to low temperature amplitudes of 20℃-60℃, with time period of milliseconds, and are responsible for high-cycle fatigue (HCF) damages. 展开更多
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