The mold-filling ability of the semisolid alloy has very important effects onthe quality and properties of the work pieces produced by the semisolid forming process. Thefactorial experiments show that all of the heati...The mold-filling ability of the semisolid alloy has very important effects onthe quality and properties of the work pieces produced by the semisolid forming process. Thefactorial experiments show that all of the heating factors, such as mold temperature, heatingtemperature and the keeping time of billets, have some effects on the mold-filling ability ofsemisolid alloy. According to the analysis of influencing extent on the filling ability, it is foundthat the most important one of the factors is the mold temperature instead of the billetstemperature, the next one is the heating temperature of the billet, and the keeping time rows on thethird. It is also found that there is an interrelation between the billet heating temperature andthe mold temperature. The effect of the interrelation on the mold-filling ability is even strongerthan the keeping time. The higher the mold temperature, heating temperature or the keeping time is,the better the mold-filling ability of the semisolid alloy is. The parameter to describe themold-filling ability, defined as the maximum filling height along the uptight direction or themaximum filling length along the horizontal direction, can be theoretically determined according tothe flowing theory of viscous fluid.展开更多
The bonding of steel plate to aluminum liquid was conducted using rapid solidification. The influence of diffusion time on interfacial structure was studied. The results showed that under the condition of 750癈 for th...The bonding of steel plate to aluminum liquid was conducted using rapid solidification. The influence of diffusion time on interfacial structure was studied. The results showed that under the condition of 750癈 for the temperature of aluminum liquid and 200癈 for the preheat temperature of steel plate, when diffusion time was shorter than 4.3 s, there was only Fe-AI solid solution at the interface. When diffusion time was longer than 4.3 s, Fe-AI compound began to form at the interface. The relationships between diffusion time t and thickness of Fe-AI compound layer H are H=-9.72+2.62t-0.08t2 (4.3 s<t<15 s) and H=2.79+0.647t-0.033t2 (t>15 s).展开更多
The bonding of solid steel plate to liquid aluminum was studied using rapidsolidification. The surface of solid steel plate was defatted, descaled, immersed (in K_2ZrF_6 fluxaqueous solution) and stoved. In order to d...The bonding of solid steel plate to liquid aluminum was studied using rapidsolidification. The surface of solid steel plate was defatted, descaled, immersed (in K_2ZrF_6 fluxaqueous solution) and stoved. In order to determine the thickness of Fe-Al compound layer at theinterface of steel-aluminum solid to liquid bonding under rapid solidification, the interface ofbonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationshipbetween bonding parameters (such as preheat temperature of steel plate, temperature of aluminumliquid and bonding time) and thickness of Fe-Al compound layer at the interface was established byartificial neural networks (ANN) perfectly. The maximum of relative error between the output and thedesired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacialshear strength of bonding plate (226℃ for preheat temperature of steel plate, 723℃ for temperatureof aluminum liquid and 15.8 s for bonding time), the reasonable thickness of Fe-Al compound layer10.8 μm was got.展开更多
文摘The mold-filling ability of the semisolid alloy has very important effects onthe quality and properties of the work pieces produced by the semisolid forming process. Thefactorial experiments show that all of the heating factors, such as mold temperature, heatingtemperature and the keeping time of billets, have some effects on the mold-filling ability ofsemisolid alloy. According to the analysis of influencing extent on the filling ability, it is foundthat the most important one of the factors is the mold temperature instead of the billetstemperature, the next one is the heating temperature of the billet, and the keeping time rows on thethird. It is also found that there is an interrelation between the billet heating temperature andthe mold temperature. The effect of the interrelation on the mold-filling ability is even strongerthan the keeping time. The higher the mold temperature, heating temperature or the keeping time is,the better the mold-filling ability of the semisolid alloy is. The parameter to describe themold-filling ability, defined as the maximum filling height along the uptight direction or themaximum filling length along the horizontal direction, can be theoretically determined according tothe flowing theory of viscous fluid.
基金This project is supported by the Advanced Technical Committee of China, No.715-009-060.
文摘The bonding of steel plate to aluminum liquid was conducted using rapid solidification. The influence of diffusion time on interfacial structure was studied. The results showed that under the condition of 750癈 for the temperature of aluminum liquid and 200癈 for the preheat temperature of steel plate, when diffusion time was shorter than 4.3 s, there was only Fe-AI solid solution at the interface. When diffusion time was longer than 4.3 s, Fe-AI compound began to form at the interface. The relationships between diffusion time t and thickness of Fe-AI compound layer H are H=-9.72+2.62t-0.08t2 (4.3 s<t<15 s) and H=2.79+0.647t-0.033t2 (t>15 s).
基金This project is financially supported by National Natural Science Foundation of China (No.50274047) and Advanced Technical Committee of China(No. 715-009-060)
文摘The bonding of solid steel plate to liquid aluminum was studied using rapidsolidification. The surface of solid steel plate was defatted, descaled, immersed (in K_2ZrF_6 fluxaqueous solution) and stoved. In order to determine the thickness of Fe-Al compound layer at theinterface of steel-aluminum solid to liquid bonding under rapid solidification, the interface ofbonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationshipbetween bonding parameters (such as preheat temperature of steel plate, temperature of aluminumliquid and bonding time) and thickness of Fe-Al compound layer at the interface was established byartificial neural networks (ANN) perfectly. The maximum of relative error between the output and thedesired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacialshear strength of bonding plate (226℃ for preheat temperature of steel plate, 723℃ for temperatureof aluminum liquid and 15.8 s for bonding time), the reasonable thickness of Fe-Al compound layer10.8 μm was got.
