The actual effective partition coefficients of Mg and Cr in a cross-section of a dendrite arm in a direct-chill(DC)-casting ingot of 7475 aluminum alloy are obtained.Meanwhile,by analyzing the microstructure,the mecha...The actual effective partition coefficients of Mg and Cr in a cross-section of a dendrite arm in a direct-chill(DC)-casting ingot of 7475 aluminum alloy are obtained.Meanwhile,by analyzing the microstructure,the mechanism of the heterogeneous distribution of E(Al_(18)Mg_(3)Cr_(2))dispersoids in this DC ingot is revealed.The results show that the actual effective partition coefficients of Mg and Cr are 0.650 and 1.392,respectively,and they describe the heterogeneous distributions of Mg and Cr along the direction of radius of the cross-section of the dendrite arm of the alloy.After homogenization treatment at 470℃ for 24 h,Mg diffuses uniformly,but Cr hardly diffuses.Both the concentrations of Mg and Cr and the sites of heterogeneous nucleation in the alloy are the determinants of the formation of E dispersoids simultaneously.The heat treatment at 250℃ for 72 h provides a large number of the sites of heterogeneous nucleation of the formation of fine E dispersoids that will be formed in the center of the cross-section during the subsequent heat treatment at higher temperature.展开更多
Silicone rubber(SR) composites are most widely used as thermal interface materials(TIMs) for electronics heat dissipation. Thermal impedance as the main bottleneck limiting the performance of TIMs is usually neglected...Silicone rubber(SR) composites are most widely used as thermal interface materials(TIMs) for electronics heat dissipation. Thermal impedance as the main bottleneck limiting the performance of TIMs is usually neglected. Herein, the thermal impedance of SR composites loaded with different levels of hexagonal boron nitride(h-BN) as TIMs was elaborated for the first time by the ASTM D 5470 standard test and finite element analysis. It was found that elastic modulus and surface roughness of SR composites increased with the increase of h-BN content, indicating that the conformity was reduced. When the assembly pressure was 0.69 MPa, there existed an optimal h-BN content at which the contact resistance was minimum(0.39 K·cm^(2)·W^(-1)). Although the decreased bond line thickness(BLT) by increasing the assembly pressure was beneficial to reduce the thermal impedance, the proper assembly pressure should be selected to prevent the warpage of the contact surfaces and the increase in contact resistance, according to the compression properties of the SR composites. This study provides valuable insights into fabrication of high-performance TIMs for modern electronic device applications.展开更多
基金financially supported by the National Natural Science Foundation of China(No.51871043)Fundamental Research Funds for the Central Universities of China(No.N180212010)Liaoning Natural Science Foundation of China(No.2019-MS-113)。
文摘The actual effective partition coefficients of Mg and Cr in a cross-section of a dendrite arm in a direct-chill(DC)-casting ingot of 7475 aluminum alloy are obtained.Meanwhile,by analyzing the microstructure,the mechanism of the heterogeneous distribution of E(Al_(18)Mg_(3)Cr_(2))dispersoids in this DC ingot is revealed.The results show that the actual effective partition coefficients of Mg and Cr are 0.650 and 1.392,respectively,and they describe the heterogeneous distributions of Mg and Cr along the direction of radius of the cross-section of the dendrite arm of the alloy.After homogenization treatment at 470℃ for 24 h,Mg diffuses uniformly,but Cr hardly diffuses.Both the concentrations of Mg and Cr and the sites of heterogeneous nucleation in the alloy are the determinants of the formation of E dispersoids simultaneously.The heat treatment at 250℃ for 72 h provides a large number of the sites of heterogeneous nucleation of the formation of fine E dispersoids that will be formed in the center of the cross-section during the subsequent heat treatment at higher temperature.
基金financially supported by Sichuan Science and Technology Program (No.2022YFH0090)the Fundamental Research Funds for the Central Universities。
文摘Silicone rubber(SR) composites are most widely used as thermal interface materials(TIMs) for electronics heat dissipation. Thermal impedance as the main bottleneck limiting the performance of TIMs is usually neglected. Herein, the thermal impedance of SR composites loaded with different levels of hexagonal boron nitride(h-BN) as TIMs was elaborated for the first time by the ASTM D 5470 standard test and finite element analysis. It was found that elastic modulus and surface roughness of SR composites increased with the increase of h-BN content, indicating that the conformity was reduced. When the assembly pressure was 0.69 MPa, there existed an optimal h-BN content at which the contact resistance was minimum(0.39 K·cm^(2)·W^(-1)). Although the decreased bond line thickness(BLT) by increasing the assembly pressure was beneficial to reduce the thermal impedance, the proper assembly pressure should be selected to prevent the warpage of the contact surfaces and the increase in contact resistance, according to the compression properties of the SR composites. This study provides valuable insights into fabrication of high-performance TIMs for modern electronic device applications.
