Current three-body abrasive wear theories are based on a macroscale abrasive indentation process,and these theories claim that material wear cannot be achieved without damaging the hard mating surface.In this study,th...Current three-body abrasive wear theories are based on a macroscale abrasive indentation process,and these theories claim that material wear cannot be achieved without damaging the hard mating surface.In this study,the process of three-body nano-abrasive wear of a system including a single crystalline silicon substrate,an amorphous silica cluster,and a polyurethane pad,based on a chemical mechanical polishing(CMP)process,is investigated via molecular dynamics simulations.The cluster slid in a suspended state in smooth regions and underwent rolling impact in the asperity regions of the silicon surface,realizing non-damaging monoatomic material removal.This proves that indentation-plowing is not necessary when performing CMP material removal.Therefore,a non-indentation rolling-sliding adhesion theory for three-body nano-abrasive wear between ultrasoft/hard mating surfaces is proposed.This wear theory not only unifies current mainstream CMP material removal theories,but also clarifies that monoatomic material wear without damage can be realized when the indentation depth is less than zero,thereby perfecting the relationship between material wear and surface damage.These results provide new understanding regarding the CMP microscopic material removal mechanism as well as new research avenues for three-body abrasive wear theory at the monoatomic scale.展开更多
The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradu...The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradually diverge. As a result, the solidified water film between the cluster and the substrate becomes "thicker" and "looser". The "thicker" and "looser" water film will then consume more input energy to achieve complete solidification, resulting in the stress region and the high-pressure region of the silicon substrate under small standoff distances to be significantly larger than those under large standoff distances. Therefore, the degree of damage sustained by the substrate will first experience a small change and then decrease quickly as the standoff distance increases. In summary, the occurrence and maintenance of complete solidification of the confined water film between the cluster and the substrate plays a decisive role in the level of damage formation on the silicon substrate. These findings are helpful for exploring the mechanism of an abrasive water jet.展开更多
基金This work was supported by the National Natural Science Foundation of China(Nos.51375291 and 91323302)the Natural Science Foundation of Shanghai(No.19ZR1401500).
文摘Current three-body abrasive wear theories are based on a macroscale abrasive indentation process,and these theories claim that material wear cannot be achieved without damaging the hard mating surface.In this study,the process of three-body nano-abrasive wear of a system including a single crystalline silicon substrate,an amorphous silica cluster,and a polyurethane pad,based on a chemical mechanical polishing(CMP)process,is investigated via molecular dynamics simulations.The cluster slid in a suspended state in smooth regions and underwent rolling impact in the asperity regions of the silicon surface,realizing non-damaging monoatomic material removal.This proves that indentation-plowing is not necessary when performing CMP material removal.Therefore,a non-indentation rolling-sliding adhesion theory for three-body nano-abrasive wear between ultrasoft/hard mating surfaces is proposed.This wear theory not only unifies current mainstream CMP material removal theories,but also clarifies that monoatomic material wear without damage can be realized when the indentation depth is less than zero,thereby perfecting the relationship between material wear and surface damage.These results provide new understanding regarding the CMP microscopic material removal mechanism as well as new research avenues for three-body abrasive wear theory at the monoatomic scale.
基金financially supported by the National Natural Science Foundation of China(Nos.51375291 and 91323302)Initial Research Funds for Young Teachers of Donghua University(No.103-07-0053016)Innovation Program of Shanghai Municipal Education Commission(No.13YZ004)
文摘The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradually diverge. As a result, the solidified water film between the cluster and the substrate becomes "thicker" and "looser". The "thicker" and "looser" water film will then consume more input energy to achieve complete solidification, resulting in the stress region and the high-pressure region of the silicon substrate under small standoff distances to be significantly larger than those under large standoff distances. Therefore, the degree of damage sustained by the substrate will first experience a small change and then decrease quickly as the standoff distance increases. In summary, the occurrence and maintenance of complete solidification of the confined water film between the cluster and the substrate plays a decisive role in the level of damage formation on the silicon substrate. These findings are helpful for exploring the mechanism of an abrasive water jet.
