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一种新型数字式加速度传感器原理与设计 被引量:2
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作者 庞洁 Lukasz Pakula +2 位作者 paddy french 杨恒 王跃林 《传感技术学报》 CAS CSCD 北大核心 2007年第9期1996-2000,共5页
建立了一种新型纯数字式加速度传感器的理论模型,通过检测吸合时间差检测加速度.该传感器不存在吸合电压的限制,避免了寄生电容的影响,其芯片面积远小于传统电容式加速度传感器;由于输出时间信号,可采用简单的纯数字接口电路检测.理论... 建立了一种新型纯数字式加速度传感器的理论模型,通过检测吸合时间差检测加速度.该传感器不存在吸合电压的限制,避免了寄生电容的影响,其芯片面积远小于传统电容式加速度传感器;由于输出时间信号,可采用简单的纯数字接口电路检测.理论分析表明,质量块在两个检测电极之间的吸合时间差ΔT与加速度成正比关系,通过检测ΔT的变化即可检测加速度,其灵敏度、非线性与传统电容式加速度传感器相当.设计了一个悬臂梁-质量块结构的加速度传感器,芯片有效面积仅为0.03mm2,模拟结果显示,工作电压为8V,加速度为1gn时,吸合时间的变化ΔT为1.0554μs.采用TTL电路进行检测,其分辨率可以达到0.01gn,满量程±10gn工作时,非线性度为1.23%. 展开更多
关键词 加速度传感器 数字式 吸合时间 吸合电压
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Precision in harsh environments 被引量:5
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作者 paddy french Gijs Krijnen Fred Roozeboom 《Microsystems & Nanoengineering》 EI 2016年第1期61-72,共12页
Microsystems are increasingly being applied in harsh and/or inaccessible environments,but many markets expect the same level of functionality for long periods of time.Harsh environments cover areas that can be subject... Microsystems are increasingly being applied in harsh and/or inaccessible environments,but many markets expect the same level of functionality for long periods of time.Harsh environments cover areas that can be subjected to high temperature,(bio)-chemical and mechanical disturbances,electromagnetic noise,radiation,or high vacuum.In the field of actuators,the devices must maintain stringent accuracy specifications for displacement,force,and response times,among others.These new requirements present additional challenges in the compensation for or elimination of cross-sensitivities.Many state-of-the-art precision devices lose their precision and reliability when exposed to harsh environments.It is also important that advanced sensor and actuator systems maintain maximum autonomy such that the devices can operate independently with low maintenance.The next-generation microsystems will be deployed in remote and/or inaccessible and harsh environments that present many challenges to sensor design,materials,device functionality,and packaging.All of these aspects of integrated sensors and actuator microsystems require a multidisciplinary approach to overcome these challenges.The main areas of importance are in the fields of materials science,micro/nano-fabrication technology,device design,circuitry and systems,(first-level)packaging,and measurement strategy.This study examines the challenges presented by harsh environments and investigates the required approaches.Examples of successful devices are also given. 展开更多
关键词 atomic layer deposition harsh environments micro/nano-fabrication technology PACKAGING SENSORS
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