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Molecular Engineering of Benzobisoxazole-Based Conjugated Polymers for High-Performance Organic Photodetectors and Fingerprint Image Sensors
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作者 Cheol Shin WonJo Jeong +7 位作者 Ezgi Darici Lee Jong Baek Park Hyungju Ahn Seyeon Baek myeong in kim Dae Sung Chung Kang-Il Seo in Hwan Jung 《Energy & Environmental Materials》 2025年第1期151-163,共13页
Various novel conjugated polymers(CPs)have been developed for organic photodetectors(OPDs),but their application to practical image sensors such as X-ray,R/G/B,and fingerprint sensors is rare.In this article,we report... Various novel conjugated polymers(CPs)have been developed for organic photodetectors(OPDs),but their application to practical image sensors such as X-ray,R/G/B,and fingerprint sensors is rare.In this article,we report the entire process from the synthesis and molecular engineering of novel CPs to the development of OPDs and fingerprint image sensors.We synthesized six benzo[1,2-d:4,5-d’]bis(oxazole)(BBO)-based CPs by modifying the alkyl side chains of the CPs.Several relationships between the molecular structure and the OPD performance were revealed,and increasing the number of linear octyl side chains on the conjugated backbone was the best way to improve Jph and reduce Jd in the OPDs.The optimized CP demonstrated promising OPD performance with a responsivity(R)of 0.22 A/W,specific detectivity(D^(*))of 1.05×10^(13)Jones at a bias of-1 V,rising/falling response time of 2.9/6.9μs,and cut-off frequency(f_(-3dB))of 134 kHz under collimated 530 nm LED irradiation.Finally,a fingerprint image sensor was fabricated by stacking the POTB1-based OPD layer on the organic thin-film transistors(318 ppi).The image contrast caused by the valleys and ridges in the fingerprints was obtained as a digital signal. 展开更多
关键词 alkyl side chain engineering fingerprint image sensor on/off ratio organic photodetector specific detectivity
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Rapid pressure-assisted sinter bonding in air using 200 nm Cu particles and enhancement of bonding strength by successive pressureless annealing
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作者 myeong in kim Jong-Hyun LEE 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第2期629-638,共10页
To design an effective and realistically applicable sinter bonding process for power devices,we proposed a two-step process using a 200 nm Cu-particle-based paste to form a bondline having high-temperature sustainabil... To design an effective and realistically applicable sinter bonding process for power devices,we proposed a two-step process using a 200 nm Cu-particle-based paste to form a bondline having high-temperature sustainability and superior thermal conductance.This process involved rapid pressure-assisted sinter bonding in air followed by pressureless annealing in a nitrogen atmosphere.In the case of a paste prepared with a mixture of 20 wt.%malic acid and 80 wt.%ethylene glycol,sinter bonding at 300℃and 5 MPa for only 30 s resulted in a sufficient shear strength of 23.1 MPa.The shear strength was significantly enhanced to 69.6 MPa by the additional pressureless aging for 30 min.Therefore,the two-step sinter bonding process is expected to provide an outstanding production rate as a next-generation sinter bonding process. 展开更多
关键词 submicron Cu particles Cu paste malic acid sinter bonding successive annealing shear strength
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