The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of el...The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of electronic component interconnect.However,the synergistic effect mechanism of multi-component alloy compositions on the growth behavior of IMCs is not clear.Herein,we successfully prepared a new quaternary alloy solder with a composition of Sn-0.7Cu-0.175Pt-0.025Al(wt%)using the high-throughput screening(HTS)method.The results showed that it possesses excellent welding performance with an inhibition rate over 40%on the growth of IMCs layers.For Cu_(6)Sn_(5),the co-doping of Al and Pt not only greatly improves its thermodynamic stability,but also effectively suppresses the phase transition.Meanwhile,the co-doping of Al and Pt also significantly delays the generation time of Kirkendall defects.The substitution sites of Al and Pt in Cu_(6)Sn_(5)have been explored using atomic resolution imaging and advanced data informatics,indicating that Al and Pt preferentially substitute Sn and Cu atoms,respectively,to generate(Cu,Pt)_(6)(Sn,Al)_(5).A one-dimensional(1D)kinetic model of the IMCs layer growth at the Sn solder/Cu substrate interface was derived and validated,and the results showed that the error of the derived mathematical model is less than 5%.Finally,the synergistic mechanism of Al and Pt co-doping on the growth rate of Cu_(6)Sn_(5)was further elucidated.This work provides a feasible route for the design and development of multi-component alloy solders.展开更多
To improve the surface performance of TB2 alloy,pack boriding was performed at 1100℃ for 20 h with 4 wt.%La_(2)O_(3).The composition and thickness of boride layer and corrosion and wear properties of borided TB2 allo...To improve the surface performance of TB2 alloy,pack boriding was performed at 1100℃ for 20 h with 4 wt.%La_(2)O_(3).The composition and thickness of boride layer and corrosion and wear properties of borided TB2 alloy were measured.The results show that La_(2)O_(3) can promote the growth,continuity,and compactness of boride layer,and the length of TiB whisker increases from 16.80 to 21.84μm.The reason is that La_(2)O_(3) can react with B to form La−B active groups and further to improve the growth of the boride layer.The wear and corrosion resistances of TB2 alloy are enhanced by boriding with La_(2)O_(3).The wear mechanisms are adhesive wear and abrasive wear for unborided and borided TB2 alloys,respectively,and the corrosion mechanism is changed from local corrosion(unborided TB2 alloy)to uniform corrosion(borided TB2 alloy).展开更多
基金financially supported by the Innovation Team Cultivation Project of Yunnan Province(No.202005AE160016)the Key Research&Development Program of Yunnan Province(No.202103AA080017)Yunnan Ten Thousand Talents Plan Young&Elite Talents Project(No.YNWR-QNBJ2018-044)。
文摘The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of electronic component interconnect.However,the synergistic effect mechanism of multi-component alloy compositions on the growth behavior of IMCs is not clear.Herein,we successfully prepared a new quaternary alloy solder with a composition of Sn-0.7Cu-0.175Pt-0.025Al(wt%)using the high-throughput screening(HTS)method.The results showed that it possesses excellent welding performance with an inhibition rate over 40%on the growth of IMCs layers.For Cu_(6)Sn_(5),the co-doping of Al and Pt not only greatly improves its thermodynamic stability,but also effectively suppresses the phase transition.Meanwhile,the co-doping of Al and Pt also significantly delays the generation time of Kirkendall defects.The substitution sites of Al and Pt in Cu_(6)Sn_(5)have been explored using atomic resolution imaging and advanced data informatics,indicating that Al and Pt preferentially substitute Sn and Cu atoms,respectively,to generate(Cu,Pt)_(6)(Sn,Al)_(5).A one-dimensional(1D)kinetic model of the IMCs layer growth at the Sn solder/Cu substrate interface was derived and validated,and the results showed that the error of the derived mathematical model is less than 5%.Finally,the synergistic mechanism of Al and Pt co-doping on the growth rate of Cu_(6)Sn_(5)was further elucidated.This work provides a feasible route for the design and development of multi-component alloy solders.
基金the financial support from the National Natural Science Foundation of China (No. 51761023)。
文摘To improve the surface performance of TB2 alloy,pack boriding was performed at 1100℃ for 20 h with 4 wt.%La_(2)O_(3).The composition and thickness of boride layer and corrosion and wear properties of borided TB2 alloy were measured.The results show that La_(2)O_(3) can promote the growth,continuity,and compactness of boride layer,and the length of TiB whisker increases from 16.80 to 21.84μm.The reason is that La_(2)O_(3) can react with B to form La−B active groups and further to improve the growth of the boride layer.The wear and corrosion resistances of TB2 alloy are enhanced by boriding with La_(2)O_(3).The wear mechanisms are adhesive wear and abrasive wear for unborided and borided TB2 alloys,respectively,and the corrosion mechanism is changed from local corrosion(unborided TB2 alloy)to uniform corrosion(borided TB2 alloy).
