BACKGROUND The intestinal flora(IF)has been linked to risks of non-communicable diseases,especially various cancers,stroke,and Alzheimer’s disease.However,many uncertainties of these associations during different sta...BACKGROUND The intestinal flora(IF)has been linked to risks of non-communicable diseases,especially various cancers,stroke,and Alzheimer’s disease.However,many uncertainties of these associations during different stages of growth,deve-lopment,and aging still exist.Therefore,further in-depth explorations are warranted.AIM To explore the associations of the human IF with disease risks during different stages of growth,development,and aging to achieve more accurate and con-vincing conclusions.METHODS Cohort,cross-sectional,case-control,and Mendelian randomization studies published in the PubMed and Web of Science databases until December 31,2023 were systematically reviewed to clarify the associations of the IF at the genus level with the risks of various non-communicable diseases,which were grouped in accordance with the 10^(th) revision of the International Classification of Diseases.RESULTS In total,57 studies were included to quantitatively examine the influence of the IF on the risks of 30 non-communicable diseases during different stages of growth,development,and aging.Population studies and Mendelian randomization studies confirmed positive associations of the abundances of Bifidobacterium and Ruminococcus with multiple sclerosis.CONCLUSION These findings contribute to a deeper understanding of the roles of the IF and provide novel evidence for effective strategies for the prevention and treatment of non-communicable diseases.In the future,it will be necessary to explore a greater variety of research techniques to uncover the specific mechanisms by which gut microbiota trigger diseases and conduct in-depth studies on the temporal relationship between microbiota alterations and diseases,so as to clarify the causal relationship more accurately.展开更多
High-purity copper(Cu) with excellent thermal and electrical conductivity, is crucial in modern technological applications, including heat exchangers, integrated circuits, and superconducting magnets. The current puri...High-purity copper(Cu) with excellent thermal and electrical conductivity, is crucial in modern technological applications, including heat exchangers, integrated circuits, and superconducting magnets. The current purification process is mainly based on the zone/electrolytic refining or anion exchange, however, which excessively relies on specific integrated equipment with ultra-high vacuum or chemical solution environment, and is also bothered by external contaminants and energy consumption. Here we report a simple approach to purify the Cu foils from 99.9%(3N) to 99.99%(4N) by a temperature-gradient thermal annealing technique, accompanied by the kinetic evolution of single crystallization of Cu.The success of purification mainly relies on(i) the segregation of elements with low effective distribution coefficient driven by grain-boundary movements and(ii) the high-temperature evaporation of elements with high saturated vapor pressure.The purified Cu foils display higher flexibility(elongation of 70%) and electrical conductivity(104% IACS) than that of the original commercial rolled Cu foils(elongation of 10%, electrical conductivity of ~ 100% IACS). Our results provide an effective strategy to optimize the as-produced metal medium, and therefore will facilitate the potential applications of Cu foils in precision electronic products and high-frequency printed circuit boards.展开更多
基金Supported by National Natural Science Foundation of China,No.81903398the Research Start-Up Fund for the Introduction of Talents of Sichuan University,No.YJ2021112+4 种基金Medical Youth Innovation Research Project of Sichuan Province,No.Q21016Natural Science Foundation of Sichuan,No.2023NSFSC1927“From 0 to 1”Innovation Project,Sichuan University,No.2023SCUH0026Sichuan Provincial Science and Technology Department 2023 Central Guide Local Project,No.2023ZYD0097Cigar Fermentation Technology Key Laboratory of Tobacco Industry,No.20202309BC530.
文摘BACKGROUND The intestinal flora(IF)has been linked to risks of non-communicable diseases,especially various cancers,stroke,and Alzheimer’s disease.However,many uncertainties of these associations during different stages of growth,deve-lopment,and aging still exist.Therefore,further in-depth explorations are warranted.AIM To explore the associations of the human IF with disease risks during different stages of growth,development,and aging to achieve more accurate and con-vincing conclusions.METHODS Cohort,cross-sectional,case-control,and Mendelian randomization studies published in the PubMed and Web of Science databases until December 31,2023 were systematically reviewed to clarify the associations of the IF at the genus level with the risks of various non-communicable diseases,which were grouped in accordance with the 10^(th) revision of the International Classification of Diseases.RESULTS In total,57 studies were included to quantitatively examine the influence of the IF on the risks of 30 non-communicable diseases during different stages of growth,development,and aging.Population studies and Mendelian randomization studies confirmed positive associations of the abundances of Bifidobacterium and Ruminococcus with multiple sclerosis.CONCLUSION These findings contribute to a deeper understanding of the roles of the IF and provide novel evidence for effective strategies for the prevention and treatment of non-communicable diseases.In the future,it will be necessary to explore a greater variety of research techniques to uncover the specific mechanisms by which gut microbiota trigger diseases and conduct in-depth studies on the temporal relationship between microbiota alterations and diseases,so as to clarify the causal relationship more accurately.
基金Project supported by the Basic and Applied Basic Research Foundation of Guangdong Province,China(Grant Nos.2019A1515110302 and 2022A1515140003)the Key Research and Development Program of Guangdong Province,China(Grant Nos.2020B010189001,2021B0301030002,2019B010931001,and 2018B030327001)+5 种基金the National Natural Science Foundation of China(Grant Nos.52172035,52025023,52322205,51991342,52021006,51991344,52100115,11888101,92163206,12104018,and 12274456)the National Key Research and Development Program of China(Grant Nos.2021YFB3200303,2022YFA1405600,2018YFA0703700,2021YFA1400201,and 2021YFA1400502)the Strategic Priority Research Program of the Chinese Academy of Sciences(Grant No.XDB33000000)the Pearl River Talent Recruitment Program of Guangdong Province,China(Grant No.2019ZT08C321)China Postdoctoral Science Foundation(Grant Nos.2020T130022 and 2020M680178)the Science and Technology Plan Project of Liaoning Province,China(Grant No.2021JH2/10100012).
文摘High-purity copper(Cu) with excellent thermal and electrical conductivity, is crucial in modern technological applications, including heat exchangers, integrated circuits, and superconducting magnets. The current purification process is mainly based on the zone/electrolytic refining or anion exchange, however, which excessively relies on specific integrated equipment with ultra-high vacuum or chemical solution environment, and is also bothered by external contaminants and energy consumption. Here we report a simple approach to purify the Cu foils from 99.9%(3N) to 99.99%(4N) by a temperature-gradient thermal annealing technique, accompanied by the kinetic evolution of single crystallization of Cu.The success of purification mainly relies on(i) the segregation of elements with low effective distribution coefficient driven by grain-boundary movements and(ii) the high-temperature evaporation of elements with high saturated vapor pressure.The purified Cu foils display higher flexibility(elongation of 70%) and electrical conductivity(104% IACS) than that of the original commercial rolled Cu foils(elongation of 10%, electrical conductivity of ~ 100% IACS). Our results provide an effective strategy to optimize the as-produced metal medium, and therefore will facilitate the potential applications of Cu foils in precision electronic products and high-frequency printed circuit boards.
