The architecture and component technology of a low power,high capacity,short reach optical interconnect are detailed.Measurements from high-performance 300 mm silicon photonics components that comprise the system are ...The architecture and component technology of a low power,high capacity,short reach optical interconnect are detailed.Measurements from high-performance 300 mm silicon photonics components that comprise the system are shown,along with a quantum-dot mode-locked laser 20-channel comb source with free space wall plug efficiencies up to 17%,advanced packaging techniques for 3D silicon photonic-electronic integration,and schematics for integrated electronics that control the photonic integrated circuits.Techniques for operating such a system in the presence of changing ambient temperature are addressed.Experiments on a 1 Tbps design are conducted with an optical link experiment indicating sub-picojoule/bit energy consumption at scale.展开更多
The architecture and component technology of a low power,high capacity,short reach optical interconnect are detailed.Measurements from high-performance 300 mm silicon photonics components that comprise the system are ...The architecture and component technology of a low power,high capacity,short reach optical interconnect are detailed.Measurements from high-performance 300 mm silicon photonics components that comprise the system are shown,along with a quantum-dot mode-locked laser 20-channel comb source with free space wall plug efficiencies up to 17%,advanced packaging techniques for 3D silicon photonic-electronic integration,and schematics for integrated electronics that control the photonic integrated circuits.Techniques for operating such a system in the presence of changing ambient temperature are addressed.Experiments on a 1 Tbps design are conducted with an optical link experiment indicating sub-picojoule/bit energy consumption at scale.展开更多
基金Defense Advanced Research Projects Agency(HR0011-19-C-0083)Semiconductor Research Corporation(2023-JU-3132)。
文摘The architecture and component technology of a low power,high capacity,short reach optical interconnect are detailed.Measurements from high-performance 300 mm silicon photonics components that comprise the system are shown,along with a quantum-dot mode-locked laser 20-channel comb source with free space wall plug efficiencies up to 17%,advanced packaging techniques for 3D silicon photonic-electronic integration,and schematics for integrated electronics that control the photonic integrated circuits.Techniques for operating such a system in the presence of changing ambient temperature are addressed.Experiments on a 1 Tbps design are conducted with an optical link experiment indicating sub-picojoule/bit energy consumption at scale.
基金Defense Advanced Research Projects Agency(HR0011-19-C-0083)Semiconductor Research Corporation(2023-JU-3132).
文摘The architecture and component technology of a low power,high capacity,short reach optical interconnect are detailed.Measurements from high-performance 300 mm silicon photonics components that comprise the system are shown,along with a quantum-dot mode-locked laser 20-channel comb source with free space wall plug efficiencies up to 17%,advanced packaging techniques for 3D silicon photonic-electronic integration,and schematics for integrated electronics that control the photonic integrated circuits.Techniques for operating such a system in the presence of changing ambient temperature are addressed.Experiments on a 1 Tbps design are conducted with an optical link experiment indicating sub-picojoule/bit energy consumption at scale.
