Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, bu...Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.展开更多
The face-centered cubic structure(fcc)and its deformation behaviors,as well as the distinctive role of fcc-Ti in nanocrystallization in TC17 subjected to high energy shot peening(HESP),were investigated by using compr...The face-centered cubic structure(fcc)and its deformation behaviors,as well as the distinctive role of fcc-Ti in nanocrystallization in TC17 subjected to high energy shot peening(HESP),were investigated by using comprehensive high-resolution transmission electron microscopy(HRTEM).The results showed that there was a stress-induced fcc-Ti in TC17 with a lattice constant of 0.420–0.433 nm and the B-type orientation relationship between the hcp-Ti and the fcc-Ti as[2-1-10]_(hcp)//[-110]_(fcc)and(0001)_(hcp)//(111)_(fcc),which was accomplished by the gliding of Shockley partial dislocations with Burgers vector of 1/3[01-10]on the basal plane.The deformation twinning dominated the subsequent deformation of fcc-Ti,producing two types of{111}<11-2>twins with different characteristics.Among them,the I-type twin with complete structure was generated by successive gliding of Shockley partial dislocations with the same Burgers vector of 1/6[11-2].In contrast,the cooperative slip of three Shockley partials,whose sum of Burgers vectors was equal to zero,produced the II-type twin with zero net macroscopic strain.And then,the emission of Shockley partial with the Burgers vector of 1/6[11-2]on every three(111)fccplanes resulted in the formation of a 9R structure.Due to the dissociation effect of lamellar fcc-Ti and the superior deformation ability of fcc structure,the occurrence of fcc-Ti effectively promoted surface nanocrystallization of TC17.展开更多
基金financially supported by the National Natural Science Foundation of China (Nos.51505386 and 51275416)the Fundamental Research funds for the Central Universities (No.3102017GX06003)
文摘Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.
基金the financial support of the National Natural Science Foundation of China(Grants Nos.51475375 and 51705425)Shaanxi Province Postdoctoral Science Foundation(Grant No.2017BSHEDII06)。
文摘The face-centered cubic structure(fcc)and its deformation behaviors,as well as the distinctive role of fcc-Ti in nanocrystallization in TC17 subjected to high energy shot peening(HESP),were investigated by using comprehensive high-resolution transmission electron microscopy(HRTEM).The results showed that there was a stress-induced fcc-Ti in TC17 with a lattice constant of 0.420–0.433 nm and the B-type orientation relationship between the hcp-Ti and the fcc-Ti as[2-1-10]_(hcp)//[-110]_(fcc)and(0001)_(hcp)//(111)_(fcc),which was accomplished by the gliding of Shockley partial dislocations with Burgers vector of 1/3[01-10]on the basal plane.The deformation twinning dominated the subsequent deformation of fcc-Ti,producing two types of{111}<11-2>twins with different characteristics.Among them,the I-type twin with complete structure was generated by successive gliding of Shockley partial dislocations with the same Burgers vector of 1/6[11-2].In contrast,the cooperative slip of three Shockley partials,whose sum of Burgers vectors was equal to zero,produced the II-type twin with zero net macroscopic strain.And then,the emission of Shockley partial with the Burgers vector of 1/6[11-2]on every three(111)fccplanes resulted in the formation of a 9R structure.Due to the dissociation effect of lamellar fcc-Ti and the superior deformation ability of fcc structure,the occurrence of fcc-Ti effectively promoted surface nanocrystallization of TC17.
