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Microstructural evaluation of Hastelloy-X transient liquid phase bonded joints:Effects of filler metal thickness and holding time 被引量:1
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作者 A.MALEKAN S.E.MIRSALEHI +2 位作者 m.farvizi N.SAITO K.NAKASHIMA 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第5期1548-1558,共11页
Transient liquid phase(TLP)bonding was investigated in Hastelloy-X samples with different filler metal thicknesses(20,35,50,65,and 100μm)and holding time(5,20,80,320,and 640 min)to obtain optimum bonding parameters.M... Transient liquid phase(TLP)bonding was investigated in Hastelloy-X samples with different filler metal thicknesses(20,35,50,65,and 100μm)and holding time(5,20,80,320,and 640 min)to obtain optimum bonding parameters.Microstructural evaluations using electron probe microanalysis(EPMA)and electron backscattered diffraction(EBSD)show that the central eutectic phases present in the athermally solidified zone(ASZ)are Ni_(3)B,Ni_(2)Si,and CrB,and the precipitates formed in the diffusion-affected zone(DAZ)are MoB,CrB_(2),and Mo_(2)B_(5).According to the results,decreasing the filler thickness as well as increasing the holding time helps realize the completion of isothermal solidification and reduction in the density of precipitates in the DAZ,leading to a joint with more uniform properties.Diffusion of boron and silicon to longer distances with increasing holding time causes the removal of Cr-rich borides in the DAZ and the formation of Mo-rich silicide at the joint interface.Decrease in hardness of ASZ and DAZ due to the elimination of brittle phases in these zones during long holding time causes more uniform hardness distribution in the joint area.The best results are obtained for the sample joined with the 35μm-thick filler metal for 640 min holding time. 展开更多
关键词 Hastelloy-X transient liquid phase(TLP)bonding microstructure filler metal electron probe microanalysis(EPMA) electron backscattered diffraction(EBSD)
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