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Simulating the stress–strain state of a thin plate after a thermal shock
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作者 A.V.Sedelnikov S.V.Glushkov +2 位作者 V.V.Serdakova m.a.evtushenko E.S.Khnyryova 《International Journal of Modeling, Simulation, and Scientific Computing》 EI 2022年第3期245-254,共10页
The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package.The assessment of the stress–strain state is carried out and the dynamics of changes in the temperatur... The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package.The assessment of the stress–strain state is carried out and the dynamics of changes in the temperature field of the plate is determined.The obtained results were compared with the data of other authors and can be used when taking into account the thermal shock of large elastic elements of spacecraft. 展开更多
关键词 Thermal shock thin plate stress-strain state temperature field
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