作为现代信息社会的物理基石,以硅基材料为核心的集成电路极大推动了人类现代文明的进程.但是,随着晶体管特征尺寸微缩逐渐接近物理极限,传统硅基材料出现了电学性能衰退、异质界面失稳等挑战,导致集成电路数据处理能力提升难、功耗急...作为现代信息社会的物理基石,以硅基材料为核心的集成电路极大推动了人类现代文明的进程.但是,随着晶体管特征尺寸微缩逐渐接近物理极限,传统硅基材料出现了电学性能衰退、异质界面失稳等挑战,导致集成电路数据处理能力提升难、功耗急剧增加等问题产生.超薄二维过渡金属硫族化合物(transition metal dichalcogenides,TMDCs)具有表面平整无悬挂键、电输运性能优异、静电控制力强、化学性质稳定等优势,可有效解决上述问题,被认为是后摩尔时代集成电路的最具潜力候选材料之一.目前,二维TMDCs集成电路研究在多个关键领域均取得了突破性成果,但距离产业化应用仍需要克服一些挑战.本文着重介绍了二维TMDCs材料与电子器件在集成电路应用的各方面优势,系统阐明了二维TMDCs集成电路在材料控制生长、范德华界面优化以及器件设计构筑等方面的关键科学问题,提出了相应解决办法和应对措施,分析了二维TMDCs集成电路产业化进程中的综合性挑战,明确了“与硅基技术兼容”二维TMDCs集成电路发展路线的优势、可行性与突破方向.展开更多
Monolayer two-dimensional(2D)semiconductors are emerging as top candidates for the channels of the future chip industry due to their atomically thin body and superior immunity to short channel effect.However,the low s...Monolayer two-dimensional(2D)semiconductors are emerging as top candidates for the channels of the future chip industry due to their atomically thin body and superior immunity to short channel effect.However,the low saturation current caused by the high contact resistance(R_(c))in monolayer MoS2 field-effect transistors(FETs)limits ultimate electrical performance at scaled contact lengths,which seriously hinders application of monolayer MoS_(2 )transistors.Here we present a scalable strategy with a clean end-bond contact scheme that leads to size-independent electrodes and ultralow contact resistance of 2.5 kΩ·μm to achieve record high performances of saturation current density of 730μA·μm^(-1)at 300 K and 960μA·μm^(-1)at 6 K.Our end-bond contact strategy in monolayer MoS2 FETs enables the great potential for atomically thin integrated circuitry.展开更多
文摘作为现代信息社会的物理基石,以硅基材料为核心的集成电路极大推动了人类现代文明的进程.但是,随着晶体管特征尺寸微缩逐渐接近物理极限,传统硅基材料出现了电学性能衰退、异质界面失稳等挑战,导致集成电路数据处理能力提升难、功耗急剧增加等问题产生.超薄二维过渡金属硫族化合物(transition metal dichalcogenides,TMDCs)具有表面平整无悬挂键、电输运性能优异、静电控制力强、化学性质稳定等优势,可有效解决上述问题,被认为是后摩尔时代集成电路的最具潜力候选材料之一.目前,二维TMDCs集成电路研究在多个关键领域均取得了突破性成果,但距离产业化应用仍需要克服一些挑战.本文着重介绍了二维TMDCs材料与电子器件在集成电路应用的各方面优势,系统阐明了二维TMDCs集成电路在材料控制生长、范德华界面优化以及器件设计构筑等方面的关键科学问题,提出了相应解决办法和应对措施,分析了二维TMDCs集成电路产业化进程中的综合性挑战,明确了“与硅基技术兼容”二维TMDCs集成电路发展路线的优势、可行性与突破方向.
基金supported by the Natural Science Foundation of Beijing Municipality(No.Z180011)the National Natural Science Foundation of China(Nos.51991340,51991342,51527802,51972022,51722203,and 51672026)+2 种基金the Overseas Expertise Introduction Projects for Discipline Innovation(No.B14003)the National Key Research and Development Program of China(Nos.2016YFA0202701,and 2018YFA0703503)the Fundamental Research Funds for the Central Universities(No.FRF-TP-19-025A3).
文摘Monolayer two-dimensional(2D)semiconductors are emerging as top candidates for the channels of the future chip industry due to their atomically thin body and superior immunity to short channel effect.However,the low saturation current caused by the high contact resistance(R_(c))in monolayer MoS2 field-effect transistors(FETs)limits ultimate electrical performance at scaled contact lengths,which seriously hinders application of monolayer MoS_(2 )transistors.Here we present a scalable strategy with a clean end-bond contact scheme that leads to size-independent electrodes and ultralow contact resistance of 2.5 kΩ·μm to achieve record high performances of saturation current density of 730μA·μm^(-1)at 300 K and 960μA·μm^(-1)at 6 K.Our end-bond contact strategy in monolayer MoS2 FETs enables the great potential for atomically thin integrated circuitry.
