As an alternative to conventional encapsulation concepts for a double glass photovoltaic(PV)module,we introduce an innovative ionomer-based multi-layer encapsulant,by which the application of additional edge sealing t...As an alternative to conventional encapsulation concepts for a double glass photovoltaic(PV)module,we introduce an innovative ionomer-based multi-layer encapsulant,by which the application of additional edge sealing to prevent moisture penetration is not required.The spontaneous moisture absorption and desorption of this encapsulant and its raw materials,poly(ethylene-co-acrylic acid)and an ionomer,are analyzed under different climatic conditions in this work.The relative air humidity is thermodynamically the driving force for these inverse processes and determines the corresponding equilibrium moisture content(EMC).Higher air humidity results in a larger EMC.The homogenization of the absorbed water molecules is a diffusion-controlled process,in which temperature plays a dominant role.Nevertheless,the diffusion coefficient at a higher temperature is still relatively low.Hence,under normal climatic conditions for the application of PV modules,we believe that the investigated ionomer-based encapsulant can“breathe”the humidity:During the day,when there is higher relative humidity,it“inhales”(absorbs)moisture and restrains it within the outer edge of the module;then at night,when there is a lower relative humidity,it“exhales”(desorbs)the moisture.In this way,the encapsulant protects the cell from moisture ingress.展开更多
In this report,we show that hyperspectral high-resolution photoluminescence mapping is a powerful tool for the selection and optimiz1ation of the laser ablation processes used for the patterning interconnections of su...In this report,we show that hyperspectral high-resolution photoluminescence mapping is a powerful tool for the selection and optimiz1ation of the laser ablation processes used for the patterning interconnections of subcells on Cu(Inx,Ga1-x)Se2(CIGS)modules.In this way,we show that in-depth monitoring of material degradation in the vicinity of the ablation region and the identification of the underlying mechanisms can be accomplished.Specifically,by analyzing the standard P1 patterning line ablated before the CIGS deposition,we reveal an anomalous emission-quenching effect that follows the edge of the molybdenum groove underneath.We further rationalize the origins of this effect by comparing the topography of the P1 edge through a scanning electron microscope(SEM)cross-section,where a reduction of the photoemission cannot be explained by a thickness variation.We also investigate the laser-induced damage on P1 patterning lines performed after the deposition of CIGS.We then document,for the first time,the existence of a short-range damaged area,which is independent of the application of an optical aperture on the laser path.Our findings pave the way for a better understanding of P1-induced power losses and introduce new insights into the improvement of current strategies for industry-relevant module interconnection schemes.展开更多
文摘As an alternative to conventional encapsulation concepts for a double glass photovoltaic(PV)module,we introduce an innovative ionomer-based multi-layer encapsulant,by which the application of additional edge sealing to prevent moisture penetration is not required.The spontaneous moisture absorption and desorption of this encapsulant and its raw materials,poly(ethylene-co-acrylic acid)and an ionomer,are analyzed under different climatic conditions in this work.The relative air humidity is thermodynamically the driving force for these inverse processes and determines the corresponding equilibrium moisture content(EMC).Higher air humidity results in a larger EMC.The homogenization of the absorbed water molecules is a diffusion-controlled process,in which temperature plays a dominant role.Nevertheless,the diffusion coefficient at a higher temperature is still relatively low.Hence,under normal climatic conditions for the application of PV modules,we believe that the investigated ionomer-based encapsulant can“breathe”the humidity:During the day,when there is higher relative humidity,it“inhales”(absorbs)moisture and restrains it within the outer edge of the module;then at night,when there is a lower relative humidity,it“exhales”(desorbs)the moisture.In this way,the encapsulant protects the cell from moisture ingress.
基金the DFG research training group GRK 1896 at Erlangen University and from the Joint Project Helmholtz-Institute Erlangen-Nürnberg(HI-ERN)for Renewable Energy Production under Project DBF01253,respectivelyfinancial support through the“Aufbruch Bayern”initiative of the state of Bavaria(EnCN and Solar Factory of the Future)and the“Solar Factory of the Future”with the Energy Campus Nürnberg(EnCN).
文摘In this report,we show that hyperspectral high-resolution photoluminescence mapping is a powerful tool for the selection and optimiz1ation of the laser ablation processes used for the patterning interconnections of subcells on Cu(Inx,Ga1-x)Se2(CIGS)modules.In this way,we show that in-depth monitoring of material degradation in the vicinity of the ablation region and the identification of the underlying mechanisms can be accomplished.Specifically,by analyzing the standard P1 patterning line ablated before the CIGS deposition,we reveal an anomalous emission-quenching effect that follows the edge of the molybdenum groove underneath.We further rationalize the origins of this effect by comparing the topography of the P1 edge through a scanning electron microscope(SEM)cross-section,where a reduction of the photoemission cannot be explained by a thickness variation.We also investigate the laser-induced damage on P1 patterning lines performed after the deposition of CIGS.We then document,for the first time,the existence of a short-range damaged area,which is independent of the application of an optical aperture on the laser path.Our findings pave the way for a better understanding of P1-induced power losses and introduce new insights into the improvement of current strategies for industry-relevant module interconnection schemes.
