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Electronic thermal conductivity of tungsten-based systems during collision cascade processes
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作者 jiong-rong wang Bi-Cai Pan 《Nuclear Science and Techniques》 2025年第5期167-176,共10页
The thermal conductivity of plasma-facing materials(PFM)exposed to intense radiation is a critical concern for the reliable usage of materials in fusion reactors.However,limited research has been performed regarding t... The thermal conductivity of plasma-facing materials(PFM)exposed to intense radiation is a critical concern for the reliable usage of materials in fusion reactors.However,limited research has been performed regarding the thermal conductivity of structures that rapidly change in a short time during collision cascade processes under irradiation.In this study,we employed the tight-binding(TB)method to investigate the electronic thermal conductivity(κ_(e))of tungsten-based systems during various cascading processes.We found thatκ_(e) values sharply decrease within the initial 0.3 picoseconds and then partially recover at a slow pace;this is closely linked to the evolution of defects and microstructural distortions.The increase in the initial kinetic energy of the primary knock-on atom and the presence of a high concentration of hydrogen atoms further decrease theκ_(e) values.Conversely,higher temperatures have a significant positive effect onκ_(e).Furthermore,the presence of a grain boundary∑5[001](130)substantially reducesκ_(e),whereas the absorption effect of point defects by the grain boundary has little influence onκ_(e) during cascades.Our findings provide a theoretical basis for evaluating changes in the thermal conductivity performance of PFMs during their usage in nuclear fusion reactors. 展开更多
关键词 Electronic thermal conductivity Collision cascade TUNGSTEN Plasma-facing materials Tight-binding calculations
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