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Some Tools to Model Ground or Supply Bounces Induced in and out of Heterogeneous Integrated Circuits
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作者 Christian Gontrand Olivier Valorge +4 位作者 Rabah Dahmanil Fengyuan Sun Francis Calmon jacques verdier Paul Dautriche 《Computer Technology and Application》 2011年第10期788-800,共13页
Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout (and by its printed-circuit-board). When the ground node moves, system performance suffers ... Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout (and by its printed-circuit-board). When the ground node moves, system performance suffers and the system radiates electromagnetic interferences. But the understanding of the physics of ground noise can provide an intuitive sense for reducing the problem. Ground bounce can produce transients with amplitudes of volts; most often changing magnetic flux is the cause; in this work, the authors use a Finite-Difference Time-Domain to begin to understand such phenomena. Additionally, predicting substrate cross-talks in mixed-signal circuits has become a critical issue to preserve signal integrity in future integrated systems. Phenomena that involve parasitic signal propagation into the substrate are discussed. A simple methodology to predict the substrate cross-talk and some associated tools are presented. Finally, the authors indicate a stochastic method which could grasp both outer or inner RF (Radio-Frequency) radiations and substrate parasites. 展开更多
关键词 Electromagnetism 3D (three-dimensional) integration noise TSV (through silicon vias) ground or supply bounce mixed analog-digital integrated circuits substrate noise stochastic methodology.
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