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Influence of Undercooling on the Solidification Behaviour and Microstructure of Non-equilibrium Solidification of Cu-based Alloys
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作者 LI Hejun AN Hongen +6 位作者 Willey Liew Yun Hsien ismal saad Bih Lii Chuab Nancy Julius Siambun CAO Shichao WANG Hongfu YAO Wei 《Journal of Wuhan University of Technology(Materials Science)》 2025年第2期610-618,共9页
The evolution of the microstructure and morphology of Cu55Ni45 and Cu60Ni40 alloys under varying degrees of undercooling was investigated through molten glass purification and cyclic superheating technology.By increas... The evolution of the microstructure and morphology of Cu55Ni45 and Cu60Ni40 alloys under varying degrees of undercooling was investigated through molten glass purification and cyclic superheating technology.By increasing the Cu content,the effect of Cu on the evolution of the microstructure and morphology of the Cu-Ni alloy during undercooling was studied.The mechanism of grain refinement at different degrees of undercooling and the effect of Cu content on its solidification behaviour were investigated.The solidification behaviour of Cu55Ni45 and Cu60Ni40 alloys was investigated using infrared thermometry and high-speed photography.The results indicate that both Cu55Ni45 and Cu60Ni40 alloy melts undergo only one recalescence during rapid solidification.The degree of recalescence increases approximately linearly with increasing undercooling.The solidification front of the alloy melts undergoes a transition process from a small-angle plane to a sharp front and then to a smooth arc.However,the growth of the subcooled melt is constrained to a narrow range,facilitating the formation of a coarse dendritic crystal morphology in the Cu-Ni alloy.At large undercooling,the stress breakdown of the directionally growing dendrites is primarily caused by thermal diffusion.The strain remaining in the dendritic fragments provides the driving force for recrystallisation of the tissue to occur,which in turn refines the tissue. 展开更多
关键词 UNDERCOOLING MICROSTRUCTURE grain refinement solidification rate
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First-principle Investigations on Electronic and Optical Properties of LiZnAs under Pressure up to 20 GPa
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作者 LIANG Hailong AN Hongen +7 位作者 Willey Liew Yun Hsien ismal saad Bih Lii Chuab Nancy Julius Siambun LIU Lu QU Shuwei LI Ruiqin YAO Wei 《Journal of Wuhan University of Technology(Materials Science)》 2025年第4期1162-1168,共7页
Density functional theory(DFT)studies were performed on the lattice parameters,electronic band structure,and optical constants under pressure up to 20 GPa in order to obtain insight into the electronic and optical pro... Density functional theory(DFT)studies were performed on the lattice parameters,electronic band structure,and optical constants under pressure up to 20 GPa in order to obtain insight into the electronic and optical properties of LiZnAs.The calculated results show LiZnAs is a semiconductor with a direct gap of 0.86 eV,which is smaller than the experimental value 1.1 eV.It also indicates that the structural parameters such as lattice parameters and cell volume show inverse relation to the pressure and shows smooth decreasing behavior from 0 to 20 GPa.Meanwhile,the pressure dependence of the electronic band structure,density of states and partial density of states of LiZnAs up to 20 GPa were presented.And we found that the band gap increased with the pressure.Moreover,the evolution of the dielectric function,absorption coefficient a(w),reflectivity R(w),the refractive index n(w),and the extinction coefficient k(w)of LiZnAs under pressure were presented.According to our work,we found that the optical properties of LiZnAs undergo a blue shift with increasing pressure.These results suggest technological applications of such materials in extreme environments. 展开更多
关键词 high pressure optical properties density functional theory
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Refinement Mechanism of Microstructure of Undercooled Nickel Based Alloys
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作者 杜文华 HOU Kai +6 位作者 XU Xuguang ismal saad Willey Liew Yun Hsien AN Hongen Nancy Julius Siambun Bih-Lii Chuab 王洪福 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS CSCD 2024年第4期1041-1047,共7页
Through the use of purification and recirculation superheating techniques on molten glass,the Ni65Cu33Co2 alloy was successfully undercooled to a maximum temperature of 292 K.High-speed photography was employed to cap... Through the use of purification and recirculation superheating techniques on molten glass,the Ni65Cu33Co2 alloy was successfully undercooled to a maximum temperature of 292 K.High-speed photography was employed to capture the process of interface migration of the alloy liquid,allowing for an analysis of the relationship between the morphological characteristics of the alloy liquid solidification front and the degree of undercooling.Additionally,the microstructure of the alloy was examined using metallographic microscopy,leading to a systematic study of the microscopic morphological characteristics and evolution laws of the refined structure during rapid solidification.The research reveals that the grain refining mechanism of the Ni-Cu-Co ternary alloy is consistent with that of the binary alloy(Ni-Cu).Specifically,under low undercooling conditions,intense dendritic remelting was found to cause grain refinement,while under high undercooling conditions,recrystallization driven by accumulated stress and plastic strain resulting from the interaction between the liquid flow and the primary dendrites caused by rapid solidification was identified as the main factor contributing to grain refinement.Furthermore,the study highlights the significant role of the Co element in influencing the solidification rate and reheat effect of the alloy.The addition of Co was also found to facilitate the formation of non-segregated solidification structure,indicating its importance in the overall solidification process. 展开更多
关键词 grain refinement RECALESCENCE RECRYSTALLIZATION UNDERCOOLING
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