Chip-scale multi-dimensional multiplexing technology that combines wavelengths and spatial modes on a silicon photonic integrated circuit(PIC)is highly promising for the link-capacity scaling of future optical interco...Chip-scale multi-dimensional multiplexing technology that combines wavelengths and spatial modes on a silicon photonic integrated circuit(PIC)is highly promising for the link-capacity scaling of future optical interconnects.However,current multi-dimensional multiplexed PICs face significant challenges in simultaneously achieving broad optical bandwidth,low mode crosstalk,and dual-polarization modes in an ultra-compact footprint as the number of spatial modes increases.To address the issue,a topology-optimization-based inverse design assisted by a novel manufacturing calibration method(MCM)is utilized.Based on a 220 nm silicon-on-insulator(SOI)platform,a 100 nm broadband and ultra-compact(6μm×6μm)multi-dimensional multiplexed PIC supporting TE_(0),TE_(1),TM_(0),and TM_(1)modes with modes crosstalk<−16 dB ranging from 1500 to 1600 nm is demonstrated for the first time,to the best of our knowledge.Furthermore,the PIC is implemented to experimentally enable a single-wavelength 4-modes×100 Gbit=s PAM-4 direct modulation data transmission over 51 wavelengths with 0.8 nm channel spacing.This work shows the potential of utilizing multi-dimensional multiplexed PICs as optical interconnects to effectively address the speed limits of data transfer for future high-performance chip-to-chip interconnection.展开更多
基金National Natural Science Foundation of China(61925104,62171137,62235005).
文摘Chip-scale multi-dimensional multiplexing technology that combines wavelengths and spatial modes on a silicon photonic integrated circuit(PIC)is highly promising for the link-capacity scaling of future optical interconnects.However,current multi-dimensional multiplexed PICs face significant challenges in simultaneously achieving broad optical bandwidth,low mode crosstalk,and dual-polarization modes in an ultra-compact footprint as the number of spatial modes increases.To address the issue,a topology-optimization-based inverse design assisted by a novel manufacturing calibration method(MCM)is utilized.Based on a 220 nm silicon-on-insulator(SOI)platform,a 100 nm broadband and ultra-compact(6μm×6μm)multi-dimensional multiplexed PIC supporting TE_(0),TE_(1),TM_(0),and TM_(1)modes with modes crosstalk<−16 dB ranging from 1500 to 1600 nm is demonstrated for the first time,to the best of our knowledge.Furthermore,the PIC is implemented to experimentally enable a single-wavelength 4-modes×100 Gbit=s PAM-4 direct modulation data transmission over 51 wavelengths with 0.8 nm channel spacing.This work shows the potential of utilizing multi-dimensional multiplexed PICs as optical interconnects to effectively address the speed limits of data transfer for future high-performance chip-to-chip interconnection.
