Tungsten(W)thin films were prepared by magnetron sputtering onto Si(100)substrates.Their microstructures were characterized by X-ray diffraction(XRD),field emission scanning electron microscopy(FE-SEM)and transmission...Tungsten(W)thin films were prepared by magnetron sputtering onto Si(100)substrates.Their microstructures were characterized by X-ray diffraction(XRD),field emission scanning electron microscopy(FE-SEM)and transmission electron microscopy(TEM).The hardness and modulus were evaluated by nanoindentation.It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film fromβ-W toα-W structure.In addition,remarkable hardness enhancement both for the deposited and annealed W films,were compared with that of bulk coarse-grained W,although their nanoindentation modulus is very close to that of corresponding bulk W.The intrinsic reasons that lead to structure changes and super hardness are discussed.展开更多
基金supported by the National Basic Re-search Program of China(No.2004CB619302)the National Natural Science Foundation of China(No.50871083,50771078 and 50771069)
文摘Tungsten(W)thin films were prepared by magnetron sputtering onto Si(100)substrates.Their microstructures were characterized by X-ray diffraction(XRD),field emission scanning electron microscopy(FE-SEM)and transmission electron microscopy(TEM).The hardness and modulus were evaluated by nanoindentation.It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film fromβ-W toα-W structure.In addition,remarkable hardness enhancement both for the deposited and annealed W films,were compared with that of bulk coarse-grained W,although their nanoindentation modulus is very close to that of corresponding bulk W.The intrinsic reasons that lead to structure changes and super hardness are discussed.
